Tanaka Kikinzoku Kogyo K.k.

National Institute of Advanced Industrial Science and Technology

Tanaka Kikinzoku Kogoy K.k.

Japan Atomic Energy Agency

A School Corporation Kansai University

National Institutes for Quantum and Radiological Science and Technology

Hitoshi Kubo

Yuichi Makita

Yuusuke Ohshima

Junichi Taniuchi

Noriaki Nakamura

Hidekazu Matsuda

Hiroki Sato

Tomoko Ishikawa

Kenjiro Koshiji

Masato Kasuga

Teruhisa Iwai

Yusuke Ohshima

Shunji Kikuhara

Hiroaki Takahashi

Shingo Watanabe

Dai Shinozaki

Tatsuo Hasegawa

Shigeyuki Ootake

Masahiro Ito

Toshikazu Yamada

Satoshi Miyazaki

Kenichi Inoue

Kenji Matsuda

Kazuto Itaya

Hidenori Takanezawa

Ataru Daido

Syunsuke Kato

Hirokazu Shiraishi

Hiroshi Noguchi

Takeshi Yamashita

Yoshiteru Tsuchiya

Masahiro Sasaki

Shoso Shingubara

Fumihiro Inoue

Hirosi Noguchi

Yasunori Iwai

Shigeki Yamanaka

Katsumi Sato

A silver ink including silver particles and a protective agent containing at least one amine compound dispersed in a dispersion medium containing, as a main solvent, a solvent having a vapor pressure at 20° C. of 40 mmHg or less and a vapor pressure at 70° C. of 0.09 mmHg or more, in an amount of 80% or more on a mass basis relative to the total dispersion medium. The amine compound has a mass average molecular weight of 115 or less, and the total amount of the amine compound is 1 part by weight or more and 14 parts by weight or less per 100 parts by weight of the silver particles. The silver ink has a moisture content of 500 ppm or more and 50,000 ppm or less and enables a practical metal film to be formed even through calcination at a low temperature of 70° C. or less.

Silver ink for low-temperature calcination

An electroconductive substrate including a base material and a metal wiring made of at least either of silver and copper, and the electroconductive substrate has an antireflection region formed on part or all of the metal wiring surface. This antireflection region is composed of roughened particles made of at least either of silver and copper and blackened particles finer than the roughened particles and embedded between the roughened particles. The blackened particles are made of silver or a silver compound, copper or a copper compound, or carbon or an organic substance having a carbon content of 25 wt % or more. The antireflection region has a surface with a center line average roughness of 15 nm or more and 70 nm or less. The electroconductive substrate is formed from metal wiring from a metal ink that forms roughened particles, followed by application of a blackening ink containing blackened particles.

Electroconductive substrate having metal wiring, method for producing the electroconductive substrate, and metal ink for forming metal wiring

The present invention relates to a method for forming a metal pattern on a pattern formation section set on a base material. In the present invention, a substrate provided with a fluorine-containing resin layer on a surface of the base material including the pattern formation section is used. The present inventive method for forming a metal pattern includes steps of: forming a functional group on the pattern formation section; and applying a metal ink including an amine compound and a fatty acid as protective agents to the base material surface to fix the metal particles on the pattern formation section. In the present invention, a fluorine-containing resin having a surface free energy measured by the Owens-Wendt method of 13 mN/m or more and 20 mN/m or less is applied as the fluorine-containing resin layer. Further, a metal ink including ethyl cellulose as an additive is applied as the metal ink.

Method for forming metal pattern

A metal ink containing metal particles including silver, a protective agent A including an amine compound, and a protective agent B including a fatty acid. The metal ink is configured such that the protective agent A includes at least one Camine compound, and the protective agent B includes at least one Cfatty acid. It is preferable that the amine compound content is 0.2 mmol/g or more and 1.5 mmol/g or less on a silver particle mass basis. In addition, it is preferable that the fatty acid content is 0.01 mmol/g or more and 0.06 mmol/g or less on a silver particle mass basis.

Metal ink

A metal paste formed by kneading a solid content including silver particles and a solvent, in which the solid content includes silver particles containing silver particles having a particle size of 100 to 200 nm by 30% or more based on the number of particles, the silver particles have an average particle size of 60 to 800 nm as a whole, the silver particles constituting the solid content are bound with an amine compound having 4 to 8 carbon atoms in total as a protective agent, and the metal paste contains as an additive a high-molecular-weight ethyl cellulose having a number average molecular weight of 40000 to 90000. Since the metal paste contains a high-molecular-weight ethyl cellulose, a sintered body having a low resistance can be maintained while printability is improved. The metal paste has favorable printability, and can form a sintered body having a low resistance even in a low temperature region of 150&#xb0; C. or lower.

Metal paste having excellent low-temperature sinterability and method for producing the metal paste

The present invention provides a method for forming a metal pattern on a pattern formation section set in a part or the whole of a region on a base material, the base material including a fluorine-containing resin layer on a surface including at least the pattern formation section, the method including the step of: forming a functional group on a pattern formation section of the fluorine-containing resin layer by a treatment such as ultraviolet-ray irradiation, then applying to the surface of the base material a metal fine particle dispersion liquid in which metal fine particles protected by an amine compound as a first protective agent and a fatty acid as a second protective agent are dispersed in a solvent, and fixing the metal fine particles on the pattern formation section.

Method for forming metal pattern, and electric conductor

The present invention provides a method for producing silver particles, including the steps of: mixing a thermally decomposable silver compound and an amine compound to prepare a silver-amine complex as a precursor; and heating the silver-amine complex at a heating temperature equal to or higher than the decomposition temperature of the silver-amine complex to precipitate silver particles, the silver compound being silver carbonate, the amine compound being terminated with a primary amino group on at least one end and containing a predetermined hydrocarbon group R with a carbon number of 4 to 10. In the method of the present invention, silver particles with the particle size controlled to fall within the range of 20 nm to 200 nm in terms of an average particle size can be produced.HN&#x2014;R&#x2003;&#x2003;[Chemical Formula 1]

Method for producing silver particles, and silver particles produced by the method

The present invention is a metal colloid solution comprising: colloidal particles consisting of metal particles consisting of one or two or more metal(s) and a protective agent bonding to the metal particles; and a solvent as a dispersion medium of the colloidal particles, wherein: a chloride ion concentration per a metal concentration of 1 mass % is 25 ppm or less; and a nitrate ion concentration per a metal concentration of 1 mass % is 7500 ppm or less. In the present invention, adsorption performance can be improved with adjustment of the amount of the protective agent of the colloidal particles. It is preferable to bind the protective agent of 0.2 to 2.5 times the mass of the metal particles.

Metal colloidal solution and method for producing the same

The present invention provides a method for producing silver particles, the method capable of adjusting the particle diameter to be within the range of several tens of nanometers to several hundreds of nanometers and also producing silver particles with a uniform particle diameter. The present invention relates to a method for producing silver particles by heating of a reaction system containing a thermally-decomposable silver-amine complex precursor, including a process of producing a silver-amine complex, a process of adding an organic compound having an amide (carboxylic amide) as a skeleton to a reaction system, and a process of heating the reaction system, in which a water content in the reaction system before the heating is 20 to 100 parts by weight relative to 100 parts by weight of the silver compound. The present invention can produce uniform silver particles while the particle diameter is controlled.

Method for manufacturing silver particles

Provided are a fine silver particle ink composed of hexylamine, dodecylamine, oleic acid, fine silver particles and a solvent, in which the volume resistivity of a sintered body at 100&#xb0; C. obtained after the ink is applied on a substrate by spin coating is 8 to 25 &#x3bc;&#x3a9;cm, a sintered body thereof, and a method for producing a fine silver particle ink. When a fine silver particle ink containing coated fine silver particles is produced by a silver-amine complex decomposition method, production can be carried out smoothly. The fine silver particle ink can be sintered even at a low temperature, and a sintered body thereof has a mirror surface and low volume resistance.

Fine silver particle ink, fine silver particle sintered body, and method for producing fine silver particle ink

A semiconductor device includes a semiconductor chip which can be a heat-generating semiconductor chip or a semiconductor relay substrate in which an integrated circuit or wiring is built in. A sintered-silver-coated film is adhered on a surface layer part of the semiconductor substrate, interposed by a silicon oxide film. A heat-dissipating fin (heat sink), which may be copper or aluminum, is bonded on the sintered-silver-coated film, interposed by an adhesive layer.

Semiconductor device and heat-dissipating mechanism

The present invention provides a method for treating a substrate that supports metal fine particles for forming a plating layer on a circuit pattern or TSVs in various substrates, in which further micronization treatment is enabled compared with the conventional methods, and the formation of a stable plating layer is enabled. The present invention is a method for treating a substrate, the method including bringing a substrate into contact with a colloidal solution containing metal particles in order to support the metal particles that serve as a catalyst for forming a plating layer on the substrate, in which the colloidal solution contains metal particles formed of Pd and having a particle size of 0.6 nm to 4.0 nm and a face-to-face dimension of the (111) plane of 2.254 &#x212b; or more. When an organic layer such as SAM is formed on a surface of the substrate before this treatment, the binding force of the Pd particles can be increased.

Method for treating substrate that support catalyst particles for plating processing

The present invention is a hydrogen combustion catalyst including a catalyst metal supported on a carrier composed of an inorganic oxide, wherein a functional group having at the end thereof at least an alkyl group having three or less carbon atoms is bonded by substitution to each of a certain fraction or the whole of the hydroxyl groups on the surface of the carrier. The functional group bonded to each of a certain fraction or the whole of the hydroxyl groups on the surface of the carrier is preferably an organic silane. The hydrogen combustion catalyst according to the present invention is capable of maintaining the activity thereof even when a hydrogen-containing gas, a treatment object, contains a water content equal to or less than the saturated water vapor content and the reaction temperature is set at or around room temperature, namely, at 0 to 40&#xb0; C.

Hydrogen combustion catalyst and method for producing thereof, and method for combusting hydrogen

A method for supporting a catalytic metal on the surface of a carrier by bringing an aqueous catalytic metal salt solution into contact a porous carrier. The method includes the steps of: impregnating the carrier with a liquid hydrophobic organic compound before bringing the aqueous catalytic metal salt solution into contact with the carrier, and drying the impregnated carrier to volatilize the hydrophobic organic compound on the surface of the carrier, followed by bringing the carrier into contact with the aqueous catalytic metal salt solution; and then bringing a reducing agent into contact with the catalytic metal salt on the surface of the carrier to reduce the catalytic metal salt to undergo insolubilization treatment. The catalytic component is supported in a region from the surface of the carrier to a depth of 50 &#x3bc;m or more and 500 &#x3bc;m or less. The supported state of the catalytic component is made controllable, and the catalytic component can be supported in the inner part of the carrier with a suitable depth.

Method for producing surface-supported catalyst

The present invention provides a catalyst for combustion treatment of suspended particulate matter in diesel exhaust gases, and a combustion catalyst for treating diesel exhaust gases in which a precious metal or an oxide thereof as the catalytic component is loaded on a carrier composed of oxide ceramic particles comprising ceria-zirconia or ceria-praseodymium oxide. In the present invention, depending on the carried precious metal, the carrier is preferably composed of oxide ceramic particles further comprising yttria or lanthanum oxide. The present invention provides a sufficient activity to combust suspended particulate matter in exhaust gases, and can cause combustion at a low temperature of about 300&#xb0; C. It operates stably for a long period, and can burn suspended particulate matter, especially carbon microparticles.

Growing community of inventors

Tsukuba, Japan

Hitoshi Kubo