Sumitomo Osaka Cement Co., Ltd.

Tokyo Electron Limited

Hitoshi Kouno

Mamoru Kosakai

Kazunori Ishimura

Ryuuji Hayahara

Yuuki Kinpara

Yasuharu Sasaki

Yukio Miura

Takashi Satou

Shinichi Maeta

Toshiyuki Makabe

Kenji Masuzawa

Fumihiro Gobou

Takeshi Watanabe

Yoshiaki Moriya

Keisuke Maeda

Kentaro Takahashi

Kazuto Ando

Tomomi Ito

Keigo Maki

An electrostatic chuck device includes: an electrostatic chuck part having, as a main surface, a mounting surface on which a plate-shaped sample is mounted, an electrostatic attraction electrode; a base part configured to cool the electrostatic chuck part; a heater disposed in a layered manner between the electrostatic chuck part and the base part; and an adhesion layer which bonds and integrates the electrostatic chuck part and the base part together, in which the electrostatic chuck part is provided with a first through-hole, the base part is provided with a second through-hole communicating with the first through-hole, the adhesion layer is provided with a third through-hole communicating with the first through-hole and the second through-hole, a tubular insulator is fixed in the second through-hole, and an end of the insulator located on the electrostatic chuck part side is separated from the electrostatic chuck part with a space interposed therebetween.

Electrostatic chuck device

An electrostatic chuck device comprising: a placing table having a placing surface on which a plate-shaped sample is placed, an electrostatic attraction electrode, which is located on a lower side of the placing table in such a manner that the electrode is located on a surface side opposite to the placing surface of the placing table, a base part on which at least the placing table and the electrostatic attraction electrode are mounted, a focus ring which surrounds the placing table wherein the focus ring is a continuous ring or is divided into two or more portions, and a lift pin which is movable in an up-down direction and raises the entirety of or at least a part of the focus ring from the base part.

Electrostatic chuck device having focus ring

An electrostatic chuck device includes: an electrostatic chuck part which incorporates an internal electrode for electrostatic attraction and has a placing surface on which a plate-like sample is placed; a base part which cools the electrostatic chuck part; and an adhesion layer which bonds the electrostatic chuck part and the base part to integrate the parts together, in which a first through-hole is provided in the electrostatic chuck part, a second through-hole that communicates with the first through-hole is provided in the base part, a tubular insulator is fixed in the second through-hole, an annular sealing member is sandwiched between the electrostatic chuck part and a distal end surface of the insulator, wherein the distal end surface is located on the electrostatic chuck part side of the insulator, and a tubular insulating wall member is located at the inner side of the sealing member in the radial direction.

A plate-shaped body for temperature measurement which, simply by being mounted on a mounting surface of an electrostatic chuck apparatus and without using a semiconductor wafer itself, is able to easily optimize the in-plane temperature distribution of the mounting surface of the electrostatic chuck apparatus, the temperature rising characteristics, and the cooling characteristics during decreases in temperature. In such plate-shaped body for temperature measurement (), an insulating adhesive () is bonded to the entirety of a surface () of a wafer (), a heater element () is provided on the insulating adhesive (), a temperature measurement region () is provided used to measure the temperature of the surface () of the wafer () in a region excluding the heater element () on the surface () of the insulating adhesive (), and the heater element () and the temperature measurement region () are coated with an insulating film ().

Plate-shaped body for temperature measurement and temperature measuring apparatus provided with the same

Disclosed is an electrostatic chuck device for increasing electrostatic adsorptive force for a focus ring and uniformly cooling the focus ring. In such a device, a mounting table has a holder in the periphery of a placing surface along the circumferential direction of a focus ring, the holder has a pair of banks in the circumferential direction, and an annular groove formed between these banks, and in at least a bank on an outer circumferential position of the focus ring among the pair of the banks, a micro-protruding part including a plurality of micro-protrusions is on a surface facing the focus ring, or convex parts are on a bottom of the groove. The convex parts do not contact the focus ring, and the pair of banks or plurality of micro-protrusions contacts the focus ring and electrostatically adsorbs the focus ring in coordination with the convex parts.

An electrostatic chuck device according to the present invention includes: an electrostatic chuck portion having a placement surface on which a plate-like sample is placed; a base portion for temperature adjustment disposed in opposition to the side of the electrostatic chuck portion on the opposite side from the placement surface; a bonding portion for bonding the electrostatic chuck portion and the base portion for temperature adjustment together; and an annular focus ring surrounding the periphery of the placement surface, in which the volume of a space surrounded by the electrostatic chuck portion, the focus ring, the bonding portion, and a dam portion of the base portion for temperature adjustment is greater than the amount of volume expansion of the bonding portion at the working temperature.

An electrostatic chuck device that adsorbs a plate-like specimen with an electrostatic adsorption electrode and cools the plate-like specimen, including an electrostatic chuck portion, a forming material of which is a ceramic sintered body, and that has one main surface that is a placement surface on which the plate-like specimen is placed, in which a plurality of protrusions supporting the plate-like specimen are provided on the placement surface, the protrusion has a top surface that is in contact with the plate-like specimen and supports the plate-like specimen, and has a cross-sectional area that gradually increases vertically downward from a height position of the top surface, and a cross-sectional area at a distance 0.6 &#x3bc;m vertically downward from a lower end of the top surface of the protrusion is 110% or less of a cross-sectional area of a lower end of the top surface.

Disclosed is an electrostatic chuck apparatus which is configured of: an electrostatic chuck section; an annular focus ring section provided to surround the electrostatic chuck section; and a cooling base section which cools the electrostatic chuck section and the focus ring section. The focus ring section is provided with an annular focus ring, an annular heat conducting sheet, an annular ceramic ring, a nonmagnetic heater, and an electrode section that supplies power to the heater.

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Tokyo, Japan

Hitoshi Kouno