Japan Display Inc.

Mitsubishi Denki Kabushiki Kaisha

Sumitomo Bakelite Company Limited

Mitsubishi Electric Corporation

Toyota Jidosha Kabushiki Kaisha

Toyota Tsusho Corporation

Hitoshi Kawaguchi

Yasushi Nakano

Hideaki Abe

Hayato Yoshino

Yoshio Takita

Keisuke Asada

Ryouhei Suzuki

Hiroyuki Onodera

Yasuhito Aruga

Hiroki Kato

Kazuhiko Baba

Masaya Inoue

Hiroyuki Tanaka

Masahiro Wada

Kensuke Nakamura

Hideaki Arita

Masahiro Iezawa

Toshihiko Miyake

Kikuo Izumi

Michio Yamada

Tomohito Fukuda

Mitsuo Sugino

Shinichiro Ito

Hiroshi Hirose

Kazuhiro Nakane

Toshio Komiyatani

Masanori Kageyama

Hironori Maruyama

Kenya Tachibana

Masao Uesaka

Masataka Arai

Yoshitaka Okugawa

Yoshihide Nii

Hideaki Sasajima

Keiichi Tsukurimichi

Kazuhikio Baba

Toyoshi Nomura

Nobuo Kojima

Hatsuhiro Soh

Kazumoto Shimizu

Takashi Murata

Yoshiyuki Nakamura

Izumi Takahashi

A display device includes: a display panel including panel terminals; and a wiring substrate including first substrate terminals coupled to the panel terminals. The panel terminals include panel terminals arranged in a first region and panel terminals arranged in second regions sandwiching the first region. The first substrate terminals include first substrate terminals arranged in a third region and first substrate terminals arranged in fourth regions sandwiching the third region. A gap between panel terminals is substantially constant in the first and second regions. A first width of the panel terminals in the first region is different from a second width of the panel terminals in the second regions. A width of the first substrate terminals is substantially constant in the third and fourth regions. A first gap between first substrate terminals in the third region is different from a second gap between first substrate terminals in the fourth regions.

Display device and wiring substrate

A display device includes: a display panel including panel terminals; and a wiring substrate including first substrate terminals coupled to the panel terminals. The panel terminals include panel terminals arranged in a first region and panel terminals arranged in second regions sandwiching the first region. The first substrate terminals include first substrate terminals arranged in a third region and first substrate terminals arranged in fourth regions sandwiching the third region. A gap between panel terminals is substantially constant in the first and second regions. A first width of the panel terminals in the first region is different from a second width of the panel terminals is the second regions. A width of the first substrate terminals is substantially constant in the third and fourth regions. A first gap between first substrate terminals in the third region is different from a second gap between first substrate terminals in the fourth regions.

A power conversion device which converts power between a power grid and a DC power supply, includes: AC/DC converters for performing conversion from AC power to DC power or from DC power to AC power between the power grid and the DC power supply; a capacitor provided on the DC power supply side of the AC/DC converters and storing DC power; and a step-up unit for charging the capacitor.

Power conversion device and method for controlling power conversion device

Terminal portions are arrayed at regular widths and regular intervals, and each face any enable terminal, and are electrically connected to the enable terminals by conductive particles. A lead portion is connected to the other terminal portion except for a pair of terminal portions which is a pair of terminal portions adjacent to each other, and extends from an overlap region to a lead region. A connection portion connects the respective terminal portions that are not connected with the lead portion to the adjacent terminal portions that are connected to the lead portion within an area of the overlap region. An interval between a pair of lead portions extending from a pair of connection portions located to sandwich a pair of terminal portions that are not connected with the lead portion therebetween is larger than an interval between the other adjacent lead portions.

Display device

Terminal portions are arrayed at regular widths and regular intervals, and each face any enable terminal, and are electrically connected to the enable terminals by conductive particles. A lead portion is connected to the other terminal portion except for pair of terminal portions which is a pair of terminal portions adjacent to each other, and extends from an overlap region to a lead region. A connection portion connects the respective terminal portions that are not connected with the lead portion to the adjacent terminal portions that are connected to the lead portion within an area of the overlap region. An interval between a pair of lead portions extending from a pair of connection portions located to sandwich a pair of terminal portions that are not connected with the lead portion therebetween is larger than an interval between the other adjacent lead portions.

Electronic device

A terminal connection structure includes plural first connection terminals which are arranged side by side in one direction on a first circuit substrate, and plural second connection terminals which are arranged side by side in the one direction on a second resin circuit substrate overlappingly connected to the first circuit substrate and are respectively connected to the plural first connection terminals. Each of the plural second connection terminals includes plural first wirings extending in a direction crossing the one direction, and a second wiring connected to the plural first wirings and extending in the one direction. The second wiring is provided in a region where the second circuit substrate is overlapped and connected to the first circuit substrate.

Touch sensor built-in display device structure

Touch sensor includes plural first connection terminals which are arranged side by side in one direction on a first circuit substrate, and plural second connection terminals which are arranged side by side in the one direction on a second substrate connected to the plural first connection terminals. Each of the plural second connection terminals includes plural first wirings extending in a direction crossing the one direction, and a second wiring connected to the plural first wirings and extending in the one direction. The second wiring is provided in a region where the second circuit substrate is overlapped with the first circuit substrate.

Touch sensor built-in display device and terminal connection structure

In a rotary electric motor a first stator core and a second stator core are disposed coaxially so as to be separated by a predetermined distance axially and such that circumferential positions of teeth are aligned, and a first rotor core and a second rotor core on which salient poles are disposed at a uniform angular pitch circumferentially are fixed coaxially to a rotating shaft so as to be positioned on inner peripheral sides of the first stator core and the second stator core, respectively, and so as to be offset circumferentially by a pitch of half a salient pole from each other. A first permanent magnet that is magnetically oriented such that a direction of magnetization is radially inward is disposed on an outer peripheral surface of a core back of the first stator core, and an outer peripheral surface of the first permanent magnet and the outer peripheral surface of the core back of the second stator core are linked by a frame that is made of a magnetic material.

Rotary electric motor and blower that uses the same

Semiconductor chip mounting yield and semiconductor package reliability deteriorate due to warpage of a multilayer circuit board. A multilayer circuit board () using an interlayer insulating layer () can suppress warpage of the entire multilayer circuit board () by making the interlayer insulating layer () serve as a buffer material. In the multilayer circuit board () using the interlayer insulating layer (), conductor circuit layers () and interlayer insulating layers () are alternately arranged. The interlayer insulating layer () to be used in the multilayer circuit board () includes a first insulating layer and a second insulating layer having an elastic modulus higher than that of the first insulating layer.

Multilayer circuit board, insulating sheet, and semiconductor package using multilayer circuit board

There is provided a circuit board manufacturing method that makes it possible to manufacture a next-generation semiconductor device in a stable manner and improve the yield during secondary mounting processing. A circuit boardwith a thickness of 230 &#x3bc;m manufactured using a cyanate-based prepregcontaining a resin composition with which a glass cloth is impregnated is heated at a higher temperature than a glass transition temperature of the resin composition after it is cured before reflow processing.

Circuit board manufacturing method, semiconductor manufacturing apparatus, circuit board and semiconductor device

A flip-chip semiconductor package includes a circuit board having a core layer and at least one buildup layer, a semiconductor device connected to the circuit board through a metal bump, and a cured member that is made of a sealing resin composition and enclosed between the semiconductor device and the circuit board. The coefficient of linear expansion at 25 to 75&#xb0; C. of the cured member is 15 to 35 ppm/&#xb0; C., the glass transition temperature of at least one buildup layer is 170&#xb0; C. or more, and the coefficient of linear expansion of at 25 to 75&#xb0; C. of the at least one buildup layer in the planar direction is 25 ppm or less. A highly reliable flip-chip semiconductor package, buildup layer material, core layer material, and sealing resin composition can be provided by preventing cracks and inhibiting delamination.

Semiconductor package, core layer material, buildup layer material, and sealing resin composition

There are provided an epoxy resin composition exhibiting less warpage after molding and during a solder treatment process as well as during a low temperature process of, for example, a temperature cycle test, and excellent in flame retardancy, solder crack resistance, and flowability; and a semiconductor device using the same. The epoxy resin composition used in the semiconductor device contains at least one type of epoxy resin (A) selected from a trifunctional epoxy resin and a tetrafunctional epoxy resin, a curing agent (B) having at least two hydroxyl groups per molecule, a compound (C) having at least two cyanate groups per molecule, and an inorganic filler (D), as essential components.

Epoxy resin composition and semiconductor device

Growing community of inventors

Tokyo, Japan

Hitoshi Kawaguchi