Kabushiki Kaisha Toshiba

Toshiba Electronic Devices & Storage Corporation

Hitoshi Imi

Motochika Okano

Toshihiro Tsujimura

Yoshinori Fukuba

Takahiro Aoki

Daisuke Ando

According to one embodiment, a simulation apparatus is disclosed. The simulation apparatus includes a storage device storing data relating to a thermal equivalent circuit of a semiconductor device. The simulation apparatus further includes an estimation device estimating a time-dependent change in thermal characteristics of the semiconductor device by using the data. The thermal equivalent circuit includes a first thermal equivalent circuit corresponding to a lower-surface-side part of the semiconductor device. The thermal equivalent circuit further includes a second thermal equivalent circuit connected to the first thermal equivalent circuit and corresponding to an upper-surface-side part of the semiconductor device.

Simulation apparatus and creation method of thermal equivalent circuit

A non-transitory computer readable recording medium includes simulation data input into a computing device executing a simulation of a semiconductor device, wherein the simulation data includes part shape information describing shape and terminal information of the semiconductor device, logical model information describing operation and connection information of an element in the semiconductor device, and functional block information describing positional information of a functional block in the semiconductor device, and the computing device causes the part shape information, the logical model information, and the functional block information to correspond to each other to execute the simulation of the semiconductor device.

Recording medium, computing method, and computing device

A recording medium includes simulation data input into a computing device executing a simulation of a semiconductor device, wherein the simulation data includes part shape information describing a shape of a part included in a simulation target circuit, model information describing operation and connection information of the simulation target circuit, and symbol information of the part included in the simulation target circuit, and the computing device causes the part shape information, the model information, and the symbol information to correspond to each other to execute the simulation of the semiconductor device.

A printed circuit board of an embodiment includes a board, a first ground plane provided on a first face of the board and having a first opening, a first wiring provided above the first ground plane, a second ground plane provided on a second face facing the first face of the board and having a second opening, a second wiring provided above the second ground plane, and a third wiring penetrating the board between the first opening and the second opening and connecting the first wiring and the second wiring. The third wiring is provided in the first opening and in the second opening when viewed from a direction perpendicular to the first face of the board.

Growing community of inventors

Yokohama Kanagawa, Japan

Hitoshi Imi