Kabushiki Kaisha Toshiba

Toshiba Electron Tubes & Devices Co., Ltd.

Toshiba Electronic Tubes & Devices Co., Ltd.

Hitoshi Chiyoma

Osamu Furukawa

Hiroshi Aida

Atsuya Yoshida

Kenichi Donuma

Kazuhisa Yabukawa

Yuichi Shimba

Wataru Matsuyama

Toyoo Yamamoto

Akiko Suzuki

Shinetsu Fujieda

Katsuhisa Homma

Toshiyuki Takagi

Yasuo Ebata

Masayoshi Koshino

Shirofumi Yamagishi

Minoru Kawase

Hiroshi Iwata

Kaoru Sakinada

Zensaku Watanabe

Masahiro Nakagawa

Keiko Sakai

Naoki Akahori

Masakuni Ikagawa

According to one embodiment, an apparatus of manufacturing a radiation detection panel, includes an evaporation source configured to evaporate a scintillator material and emit the scintillator material vertically upward, a holding mechanism located vertically above the evaporation source, and holding a photoelectric conversion substrate, and a heat conductor arranged opposite to the holding mechanism with a gap.

Apparatus and method of manufacturing radiation detection panel

According to one embodiment, a radiation detector includes a photodetector including a fluorescent film configured to convert radiation into light, and a photoelectric conversion element configured to convert light into an electrical signal, a circuit board configured to electrically drives the photodetector, and electronically processes an output signal from the photodetector, and a connection board configured to electrically connect the photodetector and circuit board, and including a flexible circuit board, and an IC mounting board connected to the flexible circuit board, less flexible than the flexible circuit board, and including an IC semiconductor element.

Radiation detector

According to one embodiment, a radiation detector includes, a substrate, a scintillator layer, a moistureproof body, and an adhesion layer. The substrate comprises a photoelectric conversion element. The scintillator layer is formed on the substrate and converts radiation into fluorescence. The moistureproof body comprises a flange portion in a periphery thereof, the moistureproof body being deep enough to contain at least the scintillator layer. The adhesion layer causes the substrate and the flange portion of the moistureproof body to adhere to each other in a sealed manner.

Radiation detector and method for producing the same

In a radiation detector in which scintillator layers are directly formed on all the light receiving parts of a plurality of photoelectric conversion substrates, space and level difference between the adjacent photoelectric conversion substrates are determined so that the effects of these space and level difference fall within a range corresponding to the effect of one photoelectric conversion element. Specifically, the space between the adjacent photoelectric conversion substrates is equal to or less than 133 &#x3bc;m and the level difference between the adjacent photoelectric conversion substrates is equal to or less than 100 &#x3bc;m. Accordingly, the scintillator layers can be directly formed on all the light receiving parts of the plurality of photoelectric conversion substrates. This prevents degradation in MTF and sensitivity and reduces manufacturing costs.

A radiation detection apparatus includes a radiation detection panel having a fluorescent film and photoelectric conversion elements, a support board for supporting the radiation detection panel, and a gel member displaced between the radiation detection panel and support board.

Radiation detection apparatus

An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device having a main surface thereon having a transducer portion and wiring patterns connected electrically to the transducer portion; a printed circuit board having wiring patterns formed at least on one main surface thereof; a plurality of conductive bumps which connect electrically both of the mutually opposed wiring patterns and form a space portion between the surface acoustic wave device and a printed circuit board ; and resin portion which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device and seals the device together with the printed circuit board , wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the electronic device can be simplified.

Electronic component and method of production thereof

An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device having a main surface thereon having a transducer portion and wiring patterns connected electrically to the transducer portion; a printed circuit board having wiring patterns formed at least on one main surface thereof; a plurality of conductive bumps which connect electrically both of the mutually opposed wiring patterns and form a space portion between the surface acoustic wave device and a printed circuit board and resin portion which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device and seals the device together with the printed circuit board wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the electronic device can be simplified.

A surface acoustic wave filter element and a method of producing the same. The element is constructed in a manner such that a conductive film, which constitutes a plurality of electrode fingers, a bus bar connecting the electrode fingers in common, an electrode pad connected to the bus bar, etc., is formed on a piezoelectric substrate. When using the surface acoustic wave filter element with this arrangement in a high-frequency band, the thickness of the conductive film and the line width of electrodes are reduced, so that the mechanical strength is a critical problem. According to the present invention, therefore, the conductive film has a two-layer structure, including a layer containing tantalum and aluminum and a metallic layer of aluminum or an alloy consisting mainly of aluminum formed thereon, for example. The composition ratio between tantalum and aluminum is set so that the tantalum content ranges from 39% to 75% (atomic percentage). Thus, the orientation the layer of aluminum or the alloy consisting mainly of aluminum, formed on the layer containing tantalum and aluminum, is improved to increase the strength of the conductive film.

Surface acoustic wave device with a layered conductive film and method of producing the same

An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device,having a main surface thereon having a transducer portion,and wiring patterns,connected electrically to the transducer portion; a printed circuit board,having wiring patterns,formed at least on one main surface thereof; a plurality of conductive bumps,which connect electrically both of the mutually opposed wiring patterns and form a space portion,between the surface acoustic wave device,and a printed circuit board,; and resin portion,which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device,and seals the device,together with the printed circuit board,, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the electronic device can be simplified.

Image sensor wherein there are provided a charge storage type photoelectric conversion section and a drive circuit including an integrated circuit on a substrate, and with these being connected by conductive strips, characterized in that capacitance adjustment conductive strips extend from the drive circuit section, and are arranged so as to pass underneath or close to the photoelectric conversion section and reduce variations in stray capacitances in the conductive strips.

Growing community of inventors

Otawara, Japan

Hitoshi Chiyoma