Daicel Corporation

Hitomi Tamaoki

Daisuke Ito

Tsukasa Yoshida

Satoru Sumimoto

Toshihiro Tai

Provided is a curable compound having a low melting temperature, having excellent workability as a result of having good solvent solubility, and being capable of forming a cured product having excellent heat resistance. The curable compound according to an embodiment of the present invention includes the following characteristics (a) to (e). (a) Number average molecular weight (calibrated with polystyrene standard): 1000 to 15000. (b) Proportion of a structure derived from an aromatic ring in the total amount of the curable compound: 50 wt. % or greater. (c) Solvent solubility at 25° C.: 1 g/100 g or greater. (d) Glass transition temperature: 280° C. or lower. (e) 5% Weight loss temperature (T) measured at a rate of temperature increase of 10° C./min (in nitrogen), for a cured product of the curable compound: 300° C. or higher.

Curable compound

Provided is a curable composition having excellent workability and being capable of forming a cured product having excellent heat resistance. The curable composition of the present invention includes a compound represented by Formula (1) below and a solvent: In Formula (1) below, Rand Reach represent a curable functional group, and Dand Deach represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. In Formula (I) and Formula (II) below, Arto Areach represent a group in which two hydrogen atoms are removed from an aromatic ring structure or a group in which two hydrogen atoms are removed from a structure in which two or more aromatic rings are bonded through a single bond or a linking group. X represents —CO—, —S—, or —SO—, and Y represents —S—, —SO—, —O—, —CO—, —COO—, or —CONH—. n represents an integer of 0 or greater.

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Tokyo, Japan

Hitomi Tamaoki