Intel Corporation

Hitesh Arora

James Chris Matayabas, Jr

Nisha Ananthakrishnan

Suriyakala Ramalingam

Arjun Krishnan

Randall D Lowe, Jr

Chandra Mohan Jha

Rajendra C Dias

Manish Dubey

Yiqun Bai

Mihir A Oka

Yonghao Xiu

Hsin-Yu Li

Michelle S Phen

Methods for covalently and indelibly anchoring a polyacrylate polymer using a UV-induced polymerization process in the presence of a photoinitiator to an oxide surface are disclosed herein. The methods and compositions prepared by the methods can be used as indelible marking materials for use on microelectronic packages and as solder and sealant barriers to prevent overspreading of liquids on the oxide surfaces of microelectronic packages. The polyacrylate polymers are covalently linked to the oxide surface by use during the printing and UV-curing process of an adhesion promoter having as a first domain an oxide-reactive silyl group, bonded via a linker to an acrylate-reactive group.

Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials

A die backside film including a matrix material; and an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles. A method including introducing a die backside film on a backside surface of a die, the die backside film including a matrix material including an elastomer an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles; and disposing the die in a package.

DBF film as a thermal interface material

Embodiments of the present disclosure are directed to techniques and configurations for an integrated circuit (IC) package having an underfill layer with filler particles arranged in a generally random distribution pattern. In some embodiments, a generally random distribution pattern of filler particles may be obtained by reducing an electrostatic charge on one or more components of the IC package assembly, by applying a surface treatment to filler to reduce filler electrical charge, by applying an electric force against the filler particles of the underfill material in a direction opposite to a direction of gravitational force, by using an underfill material with a relatively low maximum filler particle size, and/or by snap curing the underfill layer at a relatively low temperature. Other embodiments may be described and/or claimed.

Method for reducing underfill filler settling in integrated circuit packages

Certain embodiments relate to compositions that may be used as thermal interface materials in electronic assemblies. One such composition includes a block copolymer matrix comprising polystyrene and polybutene. The composition also includes a filler positioned in the copolymer matrix, the filler comprising carbon. The filler may in certain embodiments be a material selected from the group consisting of graphite, graphene, and carbon nanotubes. composition may include routing structures and their formation. Assemblies may include the composition positioned between a die and a heat spreader. Other embodiments are described and claimed.

Thermal interface material composition including polymeric matrix and carbon filler

Growing community of inventors

Chandler, AZ, United States of America

Hitesh Arora