Tdk Corporation

Tkd Corporation

Hisayuki Abe

Makoto Orikasa

Yuhei Horikawa

Susumu Taniguchi

Atsushi Sato

Kenichi Yoshida

Hideyuki Seike

Miyuki Yanagida

Yoshihiro Kanbayashi

Akiko Seki

Takashi Daitoku

Kenichi Kawabata

Hirohumi Asou

Makoto Kobayashi

Toru Takahashi

Tsutomu Yasui

Takashi Ota

Minoru Takaya

Tomoko Kitamura

Kosuke Kunitsuka

Satoshi Kurimoto

Ko Onodera

Kouzou Sasaki

Noriyuki Saito

Shuumi Kumagai

Masumi Kameda

Kenji Shibata

Hiroshi Yamamoto

Toshio Tomonari

Kei Suzuki

Yoshikazu Ito

Yoji Tozawa

Takashi Kawashima

Takashi Sakurai

Masashi Katsumata

Kazuhiko Itoh

Hiroshi Shindo

Toshikazu Endo

Katsuhiko Igarashi

Masami Sasaki

Kosuke Takano

Osamu Hirose

Genichi Watanabe

Akira Kakinuma

Shinya Yoshihara

Takashi Kajino

Yukari Inoue

Masahiko Konno

Akihiro Horita

Shin Fujita

Masataka Kitagami

Akira Suda

Yasuyoshi Suzuki

Tomohisa Mitose

Taketo Sasaki

Hiroki Ashizawa

Miho Mori

Misaki Tamura

Hideki Masuda

Hiroshige Okawa

Kiryu Ikebe

A mounting board includes: an electronic component including at least a pair of first terminals; and a circuit board including at least a pair of second terminals. The first terminals and the second terminals are electrically joined by a joining material containing a metal element, the electronic component and the joining material are disposed within a wall made of an insulator, a lower surface of the electronic component is lower than an upper surface of the wall, and when long sides of a region surrounded by the wall have a dimension dand long sides of the electronic component have a dimension d, a value of (dimension d−dimension d) is 10 μm or less.

Mounting board and circuit board

An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

Electroconductive substrate, electronic device and display device

A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.

Sheet material, metal mesh, wiring substrate, display device and manufacturing methods therefor

A sheet material includes a resin layer containing a binder and polypyrrole particles, an electroless plating film provided on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a transparent base material provided on the side of the other main surface of the resin layer.

Sheet material, metal mesh and manufacturing methods thereof

A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

Method of producing electroconductive substrate, electronic device and display device

A method of providing a coating on a conductor. The coating has a first layer containing palladium and a second layer containing gold from the conductor side. The first layer has an inner layer on the conductor side and an outer layer arranged nearer to the second layer than the inner layer, and the outer layer has a higher phosphorus concentration than the inner layer.

Coating electronic component

Disclosed herein is a wiring component that includes a base material and a planar coil pattern formed on the base material. The planar coil pattern includes a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion connected to the first connecting position; and a connection wiring portion that short-circuits the second connecting position and the third connecting position. A cross-section structure of the planar coil pattern has a base resin layer formed on the base material, and a conductive layer formed on the base resin layer.

Wiring component

First solder is lead-free solder that contains no lead (Pb). The first solder includes a first metal that contains at least Sn; and a second metal that contains at least a Ni&#x2014;Fe alloy.

Lead-free solder and electronic component built-in module

Disclosed herein is a method for manufacturing a planar coil, the method including forming a base conductive layer on a base material, the base conductive layer including: a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion that connects the first connecting position with an external power source; and a connection wiring portion that short-circuits the second connecting position and the third connecting position; forming a wiring conductive layer on the base conductive layer by electrolytic plating by feeding power from the external power source; and removing the power-feed wiring portion and the connection wiring portion.

Method for manufacturing planar coil

A method for producing a semiconductor chip is a method for producing a semiconductor chip that includes a substrate, a conductive portion formed on the substrate, and a microbump formed on the conductive portion, which includes a smooth surface formation process of forming a smooth surface on the microbump, and the smooth surface formation process includes a heating process of causing a reducing gas to flow in an inert atmosphere into a space where the semiconductor chips are arranged and heated at or higher than a temperature of a melting point of the microbump, and in the heating process, a pressure application member is mounted on the microbump and among principal surfaces of the pressure application member, a principal surface that contacts the microbump is a flat surface.

Method for producing semiconductor chip

Disclosed herein is an electronic component module that includes, an electronic component, a mold resin that seals the electronic component, a conductive film that covers the mold resin, and a protective film that covers the conductive film. The protective film includes a protective layer and a low reflective layer, and the low reflective layer is free from contacting the conductive film.

Electronic component module having a protective film comprising a protective layer and a low reflectivity layer having a rough outer surface and manufacturing method thereof

Growing community of inventors

Tokyo, Japan

Hisayuki Abe