Sony Corporation

Sony Group Corporation

Hisayoshi Motobayashi

Hidekazu Kawanishi

Hiroyuki Miyahara

Masahiro Murayama

Masayuki Tanaka

Tomoki Ono

Shiro Uchida

Takahiro Koyama

Yoshiro Takiguchi

Tomomasa Watanabe

Hitoshi Domon

A first semiconductor device according to an embodiment of the present disclosure includes: a semiconductor element; a first housing member and a second housing member that house the semiconductor element; a first base layer formed on a bonded surface of the first housing member to the second housing member; a second base layer formed on a bonded surface of the second housing member to the first housing member; a solder bonding section that bonds the first housing member and the second housing member with the first base layer and the second base layer interposed in between; and a solder adsorption layer provided on at least one of the bonded surface of the first housing member or the bonded surface of the second housing member to be apart from the first base layer and the second base layer.

Semiconductor device

There is provided a semiconductor light emitting device that allows the internal resistance to be improved. A semiconductor light emitting device according to an embodiment of the present disclosure includes: a light emitting element; a first housing member and a second housing member at least one of which has a wiring structure; and an electrically conductive bonding section. The first housing member and the second housing member house the light emitting element. The wiring structure electrically couples the light emitting element and an outside. The electrically conductive bonding section bonds the first housing member and the second housing member. The electrically conductive bonding section is electrically coupled to the wiring structure.

Semiconductor light emitting device

A light-emitting device including: a package including a light-emitting element, a reflection member that reflects light outputted from the light-emitting element, and a sealed space that accommodates the light-emitting element and the reflection member; a base plate on which a plurality of the packages is mounted; and lenses opposed to the base plate with the plurality of packages interposed therebetween, the lenses being opposed to the respective packages.

Light-emitting device and projection display apparatus

An optical shaping apparatus includes: a light source unit that outputs collimated light; an optical function unit that is disposed on an optical path of the collimated light and modulates the optical path or a phase of the collimated light; and a control unit that controls operation of the optical function unit, to irradiate a target surface with modulated light produced in the optical function unit.

Optical shaping apparatus and method of manufacturing shaped object

A light source module according to an embodiment of the present disclosure includes: a radiator; a plurality of light-emitting elements disposed on the radiator; a plurality of lenses that each convert a light beam outputted from corresponding one of the plurality of light-emitting elements into a collimated light beam and output the collimated light beam; a plurality of first optical elements that each reflect the collimated light beam outputted from corresponding one of the plurality of lenses while adjusting an optical axis direction of the collimated light beam; and a second optical element that multiplexes respective light beams reflected from the plurality of first optical elements.

Growing community of inventors

TOKYO, Japan

Hisayoshi Motobayashi