Hitachi High-tech Instruments Company, Ltd.

Other

Hisayoshi Kashitani

Kazuyoshi Oyama

Akira Aoki

Masami Iizuka

Kazuyoshi Ieizumi

Makio Kameda

Koichi Izuhara

Katsuyuki Seto

Yoshiharu Fukushima

Isao Takahira

Yoshihiro Onoguchi

Hiroomi Kobayashi

Yutaka Mitsumochi

Seiji Oonishi

Koiti Izuhara

Naoki Urata

The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources. The component feeding device is provided on only one side of the carrying device, and the suction nozzles provided on each of the mounting heads pick up electronic components from the component feeding device and mount the electronic components on a printed board by moving the mounting heads provided on both the beams between the printed board on the carrying device and the component feeding device by driving the drive sources respectively.

Electronic component mounting apparatus

An electronic component is mounted on a printed board by a first head and a second head collaboratively. The first head is prioritized to the second head for moving operations. The range which allows the second head to move is defined in consideration with all the positions where the electronic components held by the first head are to be mounted on the printed board such that no collision occurs between the first head in operation and the second head.

Mounting apparatus for electronic components

In a mounting apparatus for electronic components, a command from a host computer is transmitted to a linear motor M via a motion controller and a servo amplifier to thereby drive a mounting head Hor a mounting head H. To prevent collision between the two mounting heads H, H, position information from a linear encoder E is fed back to not only the servo amplifier, but also the motion controller. Once determining that the two mounting heads H, Hcollide, the motion controller applies brake to the mounting heads H, Hto avoid collision therebetween, regardless of the command from the host computer.

An electronic component mounting apparatus has a pair of guides, a beam traveling along the guides and a mounting head placed on the beam. A first linear motor moves the beam along the guides, and a second linear motor moves the mounting head along the beam. A thermal insulating portion placed between the beam and the guides thermally insulates the two components from each other. Thermal conduction portions are placed on the fixed elements of the first and second linear motors. This configuration assures an accurate operation of the mounting apparatus by eliminating thermal deformations of their components.

Growing community of inventors

Ota, Japan

Hisayoshi Kashitani