Kaneka Corporation

The United States of America As Represented by the Administrator of the

United States of America As Represented by the Administrator of Nasa

Other

Unitika Ltd.

Unitka Ltd.

Hisayasu Kaneshiro

Takashi Kikuchi

Yoshiaki Echigo

Terry L St Clair

Erik S Weiser

Kiyokazu Akahori

Hiroyuki Tsuji

Shogo Fujimoto

Masami Yanagida

Toshihisa Itoh

Yasushi Nishikawa

Roberto J Cano

Yasutaka Kondo

Katsunori Yabuta

Koji Hanada

Jushiro Eguchi

Teruo Matsutani

Takahiro Ono

Masayoshi Shimizu

Takashi Urabe

A film is formed by extruding a resin from a lip opening () of a multilayer extrusion die () in a state in which a rectifying jig () does not cover the lip opening () but covers a seal part () while being located adjacent to each end in a longer side direction of the lip opening ().

Film manufacturing method, film manufacturing device, and jig

A process includes the steps of: casting or coating a polyamic acid organic solvent solution on a support and drying the polyamic acid organic solvent solution thereon, so as to form a partially cured and/or partially dried polyamic acid film; dipping the polyamic acid film in tertiary amine or a solution of tertiary amine, or coating tertiary amine or a solution of tertiary amine on the polyamic acid film; and drying the film while imidizing the polyamic acid. In another process, a chemical converting agent and a catalyst are mixed in an organic solvent solution of polyamic acid. After casting and heating the mixture on a support, a partially cured and/or partially dried polyamic acid film is detached from the support. The film contains, with respect to the remaining volatile component, not less than 50 parts of catalyst, not more than 30 parts of solvent, and not more than 20 parts of chemical converting agent and/or a chemical converting agent derived component. The remaining amic acid is imidized and the film is dried.

Polyimide film and process for producing the same

In the present invention, (i) a polyamic acid solution for forming a thermoplastic polyimide layer to be in no contact with a support contains no chemical dehydrating agent or imidization catalyst, (ii) a polyamic acid solution for forming a thermoplastic polyimide layer to be in contact with the support contains an imidization catalyst, and (iii) a polyamic acid solution for forming a non-thermoplastic polyimide layer contains a chemical dehydrating agent and an imidization catalyst. This arrangement eliminates a property difference between the thermoplastic polyimide layers.

Method for producing three-layer co-extruded polyimide film

An object of this invention is to provide a polyimide film suitable for use in flexible printed circuit boards and the like which have high flexibility and dimensional stability, and to provide a laminate and metal-clad laminate which uses such a polyimide film. This invention relates to a multilayer polyimide film being a polyimide film having a multilayer structure, including: a core layer; and clad layers provided on each side of the film, which clad layers are exposed, the core layer being a non-thermoplastic polyimide having an average coefficient of linear expansion at a temperature from 100&#xb0; C. to 200&#xb0; C. in a range of 5 ppm/&#xb0; C. to 20 ppm/&#xb0; C., each of the clad layers being a polyimide having a peeling strength of 3 N/cm or less, the film as a whole having an average coefficient of linear expansion at a temperature range of 100&#xb0; C. to 200&#xb0; C. in a range of 9 ppm/&#xb0; C. to 30 ppm/&#xb0; C., and (a)&#x3e;(b), where (a) is an average modulus of elasticity of the core layer and (b) is an average modulus of elasticity of the clad layers.

Multilayer polyimide film, laminate, and metal-clad laminate

A process for the production of non-thermoplastic polyimide film whose precursor solution has high storage stability and which exhibits high adhesiveness even without expensive surface treatment, more specifically, a process for the production of non-thermoplastic polyimide film made of a non-thermoplastic polyimide containing a block resulting from a thermoplastic polyimide which comprises (A) the step of forming a prepolymer having amino or an acid anhydride group at the end in an organic polar solvent (B) the step of synthesizing a polyimide precursor solution by using the obtained prepolymer, an acid anhydride, and a diamine in such a way as to become substantially equimolar over the whole step, and (C) the step of casting a film-forming dope containing the polyimide precursor solution and subjecting the resultant dope to chemical and/or thermal imidization, wherein the diamine and acid dianhydride used in the step (A) are selected so that the reaction of both with each other in equimolar amounts can give a thermoplastic polyimide, and the polyimide precursor obtained in the step (B) is a precursor of a non-thermoplastic polyimide.

Process for production of polyimide film having high adhesiveness

A polyimide film which, especially when superposed on a metal layer by the laminating method, has the function of diminishing the thermal distortion to be imposed on the material; an adhesive film and a flexible metal-clad laminate each comprising or obtained with the polyimide film. the polyimide film is obtained by reacting an aromatic diamine with an aromatic acid dianhydride and imidiating the polyamic acid obtained, and has a storage elastic modulus in a specific range.

Polyimide film and adhesive film and flexible metal-clad laminate both obtained with the same

The present invention provides a polyimide film and its usage. The polyimide film according to the present invention does not cause dimensional change due to thermal stress. The present invention particularly relates to a polyimide film and its usage, which polyimide film has a characteristic of suppressing thermal deformation of the material in lamination of a polyimide film and a metal layer by a laminate method. The polyimide film according to the present invention has the following characteristics:

Polyimide film and use thereof

Disclosed is an adhesive film having high dimensional stability which can be suitably used for two layer FPCs. Specifically, disclosed is an adhesive sheet composed of an insulating layer and an adhesive layer arranged on one side or both sides of the insulating layer. This adhesive sheet is characterized in that the insulating layer has a ratio E'2/E&#x2032;1 between the storage elasticity modulus E&#x2032;1 at 25&#xb0; C. and the storage elasticity modulus E&#x2032;2 at 380&#xb0; C. of not more than 0.2 and a coefficient of thermal expansion in the MD direction of 5-15 ppm at 100-200&#xb0; C. It is further characterized in that the change in the coefficient of thermal expansion of the adhesive sheet at 100-250&#xb0; C. after heat treatment at 380&#xb0; C. for 30 seconds under tension of 20 kg/m is not more than 2.5 ppm in the tension direction and not more than 10 ppm in the direction perpendicular to the tension direction.

Adhesive sheet and copper-clad laminate

A metal-coated polyimide film is excellent in long-term adhesion reliability, exhibits various dimensional stabilities, and is particularly suitable for FPC, COF and TAB applications. The metal-coated polyimide film comprises a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.

Metal-coated polyimide film

It is an object of the present invention to provide an adhesive film which is used for producing, by a laminating method, a flexible metal-clad laminate in which the change in dimensions is suppressed, a flexible metal-clad laminate including the adhesive film, and a production method therefor. The present invention relates to an adhesive film including a polyimide film and an adhesive layer containing a thermoplastic polyimide, the adhesive layer being disposed on at least one surface of the polyimide film, a flexible metal-clad laminate produced by laminating a metal foil to the adhesive film with a thermal roll laminator, and a production method therefor, wherein the polyimide film is formed by a process including step (A) of mixing a polyamic acid solution, a dehydrating agent, and an imidization catalyst, and casting and applying the mixture onto a support to form a gel film; step (B) of stripping off the gel film and fixing both ends of the gel film; and step (C) of heating and transporting the film with both ends being fixed in a state loosened in the TD direction.

Adhesive film, flexible metal-clad laminate including the same with improved dimensional stability, and production method therefor

Disclosed in an adhesive film which enables to obtain a flexible metal clad laminate which is suppressed in dimensional change when produced by heat roll lamination. Such an adhesive film comprises a heat-resistant layer containing a highly heat resistant polyimide and an adhesive layer which is formed on at least one surface of the heat-resistant layer and contains a thermoplastic polyimide. In this adhesive film, the thermal shrinkage ratio in the TD direction is not less than +0.01%, and the thermal shrinkage ratio in the MD direction is not more than &#x2212;0.02%. Consequently, when a metal layer and the adhesive film are bonded together by heat roll lamination and the resulting laminate is subjected to a treatment with heating, occurrence of dimensional changes can be sufficiently suppressed.

Adhesive film and use thereof

A non-thermoplastic polyimide film exhibits high adherability without expensive surface treatment and is made from a precursor solution having high storage stability. The non-thermoplastic polyimide film comprises a non-thermoplastic polyimide resin having a block component derived from a thermoplastic polyimide. Preferably, the block component of the thermoplastic polyimide is present in an amount of 20 to 60 mol % of the entire polyimide so that the precursor solution thereof exhibits high storage stability and that the film can exhibit high adherability, in particular, high adherability to polyimide adhesives.

Polyimide film having high adhesiveness and method for producing same

A process for producing an adhesive film includes laminating an adhesive layer containing thermoplastic polyimide onto at least one surface of a highly heat-resistant polyimide layer by coextrusion casting method, wherein a chemical dehydrator and a catalyst are contained in a precursor solution of the highly heat-resistant polyimide and/or a solution containing either the thermoplastic polyimide or a precursor of the thermoplastic polyimide.

Growing community of inventors

Uji, Japan

Hisayasu Kaneshiro