Kyocera Corporation

Hisatoshi Takada

Youichi Moto

Yui Tanaka

Yuuna Ookubo

Yasumitsu Yamamoto

Masafumi Hirayama

Yousuke Iwamoto

Arata Okayama

Shouji Hirose

Tatsuru Seto

Takumi Hatanaka

Makoto Watanabe

A thermal head includes: a substrate; a heat generating section which is disposed on the substrate; a plurality of driving ICs including first and second driving ICs which are disposed on the substrate and electrically coupled to the heat generating section; and a cover member covering the first and second driving ICs. The cover member is disposed in an inter-driving IC region between the first driving IC and the second driving IC and above and below the inter-driving IC region, and includes a first void.

Thermal head and thermal printer

A thermal head includes a substrate; a heat generating section disposed on the substrate; an electrode which is disposed on the substrate and is electrically connected to the heat generating section; and a connector including a fixing ping electrically connected to the electrode, a movable pin which holds the substrate between the movable pin and the fixing pin, and a connection pin which connects the fixing pin and the movable pin. The movable pin includes a movable section which is bent or curved and a contact section making contact with the substrate. The movable pin is disposed so as to protrude from the connection pin beyond the fixing pin. The contact section is located closer to a connection pin side than a tip end of the fixing pin.

A thermal head capable of reducing a possibility of separation of a connector is provided. A thermal head includes a substrate; a plurality of heat generating portions disposed on the substrate; a plurality of electrodes which are disposed on the substrate and are electrically connected to the plurality of heat generating portions, respectively; and a connector including a plurality of connector pins which pinch the substrate and are electrically connected to the plurality of electrodes, respectively, and a housing for containing the plurality of connector pins. The housing is disposed adjacent to the substrate in a sub-scanning direction, and the housing includes a support portion disposed under the substrate. This can reduce a possibility of separation of the connector.

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Kyoto, Japan

Hisatoshi Takada