Resonac Corporation

Showa Denko Materials Co., Ltd.

Namics Corporation

Hisato Takahashi

Yuma Takeuchi

Toshio Takizawa

Masayuki Hanano

Hidetoshi Inoue

Haruyuki Yoshii

Yoshihito Inaba

Tsuyoshi Kamimura

Takayuki Matsuzaki

Yuya Otsuka

Mayumi Komine

Naoyuki Nojiri

Makoto Kunimi

Kohji Hori

Hisataka Minami

Shingo Kobayashi

Hiroyoshi Deguchi

A liquid resin composition for compression molding contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D).

Liquid resin composition for compression molding and electronic component apparatus

A polishing liquid includes abrasive grains containing at least one selected from the group consisting of cerium oxide and silicon oxide; a nitrogen-containing compound; and water. The nitrogen-containing compound contains nicotinamide. A polishing liquid set includes constituent components of a polishing liquid stored while being divided into a first liquid and a second liquid. A polishing method includes a step of polishing a surface to be polished by using a polishing liquid.

Polishing liquid, polishing liquid set, polishing method, and defect suppression method

A liquid resin composition for sealing contains an epoxy resin (A); a curing agent (B) containing at least one amino group in a molecule; a polymer resin (C); and an inorganic filler (D), wherein the polymer resin (C) has a weight average molecular weight of 10,000 or more.

Liquid resin composition for sealing and electronic component device

A liquid resin composition for sealing contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D), wherein a percentage content of the inorganic filler (D) is 77% by mass or more with respect to a total mass of the composition.

Liquid resin composition for sealing and electronic component apparatus

A polishing liquid containing: abrasive grains containing a metal oxide; at least one hydroxy acid compound selected from the group consisting of a hydroxy acid having a structure represented by General Formula (A1) below and a salt thereof; and water: [In the formula, Rrepresents a hydrogen atom or a hydroxy group, Rrepresents a hydrogen atom, an alkyl group, or an aryl group, n11 represents an integer of 0 or more, and n12 represents an integer of 0 or more; however, a case where both of Rand Rare a hydrogen atom is excluded.]

Polishing solution and polishing method

A polishing liquid containing: abrasive grains; a first nitrogen-containing compound; a second nitrogen-containing compound; and water, in which the first nitrogen-containing compound contains at least one selected from the group consisting of (I) a compound having an aromatic ring containing one nitrogen atom in the ring and a hydroxyl group, (II) a compound having an aromatic ring containing one nitrogen atom in the ring and a functional group containing a nitrogen atom, (III) a compound having a 6-membered ring containing two nitrogen atoms in the ring, (IV) a compound having a benzene ring and a ring containing a nitrogen atom in the ring, and (V) a compound having a benzene ring to which two or more functional groups containing a nitrogen atom are bonded, and an HLB value of the second nitrogen-containing compound is 7 or more.

Polishing solution, polishing solution set, polishing method, and defect suppressing method

A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 m/g or more.

Sealing resin composition, electronic component device, and method of manufacturing electronic component device

A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 &#x3bc;m to 20 &#x3bc;m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm/g or more.

A liquid epoxy resin composition for sealing includes an epoxy resin, a curing agent, and a particle having a core-shell structure. In the composition, the particle having a core-shell structure includes a core including a cross-linked polysiloxane and a shell including a polymer in which the content of a structural unit having an epoxy group is 10% by mass or more.

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Hisato Takahashi