Citizen Watch Company, Ltd.

Nagase Co., Ltd.

Watada Printing Co., Ltd.

Hisataro Watada

Hiroyuki Kaneko

Shingo Ichikawa

Toshibumi Wakayama

Toyoji Kanazawa

A process of producing an IC card, the IC card having a card substrate and an IC module embedded therein, the card substrate having a single core sheet and first and second cover films laminated over the core sheet on the opposite sides, the process including the steps of forming an adhesive layer on the inside of each of the first and second cover films except a non-adhesive area in which the IC module is to be fitted; bonding the cover films to the opposite sides of the core sheet through the adhesive layers to form the card substrate having the non-adhesive area; cutting the non-adhesive areas of the card substrate along their outer peripheries to form a cavity for receiving the IC module; fitting the IC module into the cavity; and fixedly securing the IC module to the card substrate.

Process of producing IC cards

A plastic card prepared by laminating unstretched polyester sheets to both sides of a single sheet or a laminate of a plurality of sheets of a stretched polyester film, cutting the obtained laminate to a shape of a card, and forming a cavity for embedding a chip module by milling in the laminate cut to the shape of a card. The plastic card is excellent in mechanical strength, dimensional stability, heat resistance, and property for printing, contains no hazardous halogen elements, and has a cavity for embedding a chip module which is formed without formation of burr by milling.

Laminated stretched and unstretched polyester card for IC card

Growing community of inventors

Kyoto, Japan

Hisataro Watada