Canon Kabushiki Kaisha

Hisatane Komori

Koji Tsuduki

Tadashi Kosaka

Takanori Suzuki

Satoru Hamasaki

Yasuhiro Matsuki

Shin Hasegawa

Yasushi Kurihara

Kazuya Notsu

Fujio Ito

Koichi Shimizu

Shuichi Chiba

Yu Katase

Hiroshi Kondo

Ichiro Kataoka

Fumio Hata

Ikuto Kimura

Provided is an electronic device that suppresses an increase in internal pressure while suppressing entry of a foreign material. An electronic module according to the present embodiment has an electronic device, a substrate, a frame, and a cover, a hole portion having a first opening in a first main surface and a second opening in a second main surface and communicating the internal space and the external space, and a component is disposed to face the second opening.

Electronic module and imaging system

According to the disclosure, a relationship of Tgp&#x3e;Tgf, &#x3b1;f1&#x3c;&#x3b1;PCB1, and (Tgp&#x2212;To)&#xd7;&#x3b1;PCB1&#x3c;(Tgf&#x2212;To)&#xd7;&#x3b1;f1+(Tgp&#x2212;Tgf)&#xd7;&#x3b1;f2 or a relationship of Tgp&#x3c;Tgf, &#x3b1;PCB1&#x3c;&#x3b1;f1, and (Tgf&#x2212;To)&#xd7;&#x3b1;f1&#x3c;(Tgp&#x2212;To)&#xd7;&#x3b1;PCB1+(Tgf&#x2212;Tgp)&#xd7;&#x3b1;PCB2 is satisfied, where linear expansion coefficients in an in-plane direction of the substrate at a temperature below a glass transition temperature Tgp of the substrate and at a temperature above the glass transition temperature Tgp of the substrate are denoted as &#x3b1;PCB1 and &#x3b1;PCB2, respectively, linear expansion coefficient of the frame at a temperature below a glass transition temperature Tgf of the frame and at a temperature above the glass transition temperature Tgf of the frame are denoted as &#x3b1;f1 and &#x3b1;f2, respectively, and a room temperature is denoted as To.

Imaging device module, imaging system, imaging device package, and manufacturing method

A method includes applying solder pastes separately to first and second portions of the first member; bringing the solder paste applied to the first portion of the first member and a first portion of the second member into contact with each other, and bringing the solder paste applied to the second portion of the first member and a second portion of the second member into contact with other; and causing the solder paste brought into contact with the first portion of the second member and the solder paste brought into contact with the second portion of the second member to melt. In the melting, molten solder formed by melting the solder paste brought into contact with the first portion of the second member and molten solder formed by melting the solder paste brought into contact with the second portion of the second member are joined to each other.

Method for producing a module

A surface mounted electronic component is provided. The component includes a first and a second connection portion for performing connection to a mounting board. The first connection portion includes a joint region arranged on a lower surface. The second connection portion includes a lower surface region arranged on the lower surface, and a side surface region connected to the lower surface region and arranged on a side surface. In a direction along the side, the lower surface region is arranged apart from the joint region, a length of the lower surface region in the direction is longer than a length of the joint region, a length of the side surface region in the direction is shorter than the length of the lower surface region, and the side surface region is spaced apart from an end of the side surface.

Mounted electronic component including connection portions

A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body.

Electronic component and electronic apparatus

A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition &#x3b1;, &#x3b1;, &#x3b1;&#x3c;&#x3b1;is satisfied, where &#x3b1;is a thermal expansion coefficient of the lid body, &#x3b1;is a thermal expansion coefficient of the frame body, &#x3b1;is a thermal expansion coefficient of the base body, and &#x3b1;is a thermal expansion coefficient of the wiring member.

Electronic component, electronic module, their manufacturing methods, mounting member, and electronic apparatus

A base body includes a fiducial stage part provided with an inner terminal group, and an upper stage part located at a side of an outer edge of a package with respect to the fiducial stage part and protruding with respect to the fiducial stage part through a step part. A frame body is bonded to the upper stage part, and an inner edge of the frame body is located at the side of the outer edge of the package with respect to the step part.

Electronic component, mounting member, electronic apparatus, and their manufacturing methods

A solid-state imaging apparatus, comprising: a semiconductor chip having a principal face including a pixel region; a protruding portion disposed on the principal face to surround the pixel region; a cover member disposed over the pixel region; and an adhesive material surrounding the pixel region and bonding the cover member and the protruding portion, is provided. The protruding portion has top and first side faces facing the space, a first edge line being formed by this two faces. The adhesive material bonds the top face of the protruding portion and the cover member. The adhesive material has a first face facing the interior space, and the first face extends from the first edge line toward the cover member. Perimeters of the interior space, in planes parallel to the principal face become shorter in a direction from the top face of the protruding portion toward the cover member.

Solid-state imaging apparatus, method of manufacturing same, and camera

A cover member fixed to a pickup element has a non-vertical surface and an upright surface and satisfies Htan(&#x3b8;A&#x2212;2&#x3b8;C)&#x2266;LLat any point on the upright surface, and H tan(&#x3b8;A&#x2212;2&#x3b8;B)+(H)tan &#x3b8;B&#x2266;Land &#x3b8;B&#x3e;&#x3b8;C at any point on the non-vertical surface, where &#x3b8;A is the inclination of incident light, &#x3b8;B is the inclination at a point on the non-vertical surface, &#x3b8;C is the inclination at a point on the upright surface, His the height of the non-vertical surface, His the height of the upright surface, H is the height of the frame portion, Lis the distance from the edge of a pixel region to the upper edge of the upright surface, and Lis the distance from the upper edge to the lower edge of the upright surface in the planar direction.

Solid-state image pickup device

A method includes preparing a cover member; preparing an image pickup element including a substrate including a pixel region including a plurality of photo detectors on a principal surface, a first concavo-convex portion including a plurality of first convex portions configured to concentrate light on the plurality of photo detectors, the first convex portions each having a lens shape, and a second concavo-convex portion surrounding the first concavo-convex portion, the second concavo-convex portion including a plurality of second convex portions; and fixing the cover member to a region of the image pickup element using a fixing member, the region being between the first concavo-convex portion and the second concavo-convex portion.

Method of manufacturing solid-state image pickup device and solid-state image pickup device

An IC package has a substrate having recesses formed on the side wall thereof, an insulating film for covering an opening of each recess on the side of a principal surface of the substrate, and an IC chip mounted on a mount surface side of the film on the substrate, wherein a conductive portion formed on each recess is used as an external connection terminal for the IC chip. A method of assembling an IC package has the steps of forming a substrate having a plurality of through holes each having an insulating film covering one of the openings of each through hole, mounting one or more IC chips on a principal surface of the substrate on the insulating film side, and electrically connecting the IC chip and the through holes, sealing the substrate with the IC chip mounted thereon with insulating resin, and cut the substrate with the IC chip mounted thereon to expose the side wall of each through hole.

Growing community of inventors

Ayase, Japan

Hisatane Komori