Nitto-Denko Corporation

Hisataka Ito

Yasunari Ooyabu

Satoshi Sato

Shinya Ota

Hironaka Fujii

Tsutomu Nishioka

Yuki Shinbori

Toshiki Naito

Toshitaka Nakamura

Takashi Taniguchi

Kazuhiro Fuke

Hiroshi Noro

Hirofumi Oono

Akihisa Kuroyanagi

Shinichirou Sudo

Satoshi Tanigawa

Sadahito Misumi

Yasushi Inoue

Hideyuki Usui

Kazumasa Igarashi

Megumu Nagasawa

Nobuhiko Yoshio

Hiroyuki Katayama

Yuji Tada

Kazuhiro Ikemura

Shinya Akizuki

Katsumi Shimada

Takahiro Uchida

Masao Gunji

Tadao Okawa

Shinjiro Uenishi

Takuya Eto

Masahiro Shirakawa

Chisato Goto

Takamitsu Ota

Akiko Nakahashi

Kazuhiko Yoshida

Seigou Takuwa

The present invention relates to a semiconductor light emitting device including: a substrate for element mounting; a wiring provided on the substrate; an LED element provided on the substrate and electrically connected to the wiring; an encapsulating resin layer for encapsulating the LED element; and a wavelength conversion layer which contains a phosphor material and converts a wavelength of light emitted by the LED element, in which the wavelength conversion layer is provided on an upper side of the LED element, and a diffusive reflection resin layer is provided in a state that side faces of the LED element are surrounded therewith, and an area at the LED element face side of the wavelength conversion layer is at least twice larger by area ratio than an area of light emitting area on an upper surface of the LED element.

Semiconductor light emitting device

A reflecting resin sheet provides a reflecting resin layer at the side of a light emitting diode element. The reflecting resin sheet includes a release substrate and the reflecting resin layer provided on one surface in a thickness direction of the release substrate. The reflecting resin layer is formed corresponding to the light emitting diode element so as to be capable of being in close contact with the light emitting diode element.

Reflecting resin sheet, light emitting diode device and producing method thereof

A phosphor reflecting sheet provides a phosphor layer on one side in a thickness direction of a light emitting diode element and provides a reflecting resin layer at the side of the light emitting diode element. The phosphor reflecting sheet includes the phosphor layer and the reflecting resin layer provided on one surface in the thickness direction of the phosphor layer. The reflecting resin layer is formed corresponding to the light emitting diode element so as to be disposed in opposed relation to the side surface of the light emitting diode element.

Phosphor reflecting sheet, light emitting diode device, and producing method thereof

A method for producing an encapsulating layer-covered optical semiconductor element includes a disposing step of disposing an encapsulating layer at one side in a thickness direction of a support and a covering step of, after the disposing step, covering an optical semiconductor element with the encapsulating layer so as to expose one surface thereof to obtain an encapsulating layer-covered optical semiconductor element.

Encapsulating layer-covered optical semiconductor element, producing method thereof, and optical semiconductor device

A phosphor layer attaching kit includes a phosphor layer and a silicone pressure-sensitive adhesion composition for attaching the phosphor layer to an optical semiconductor element or an optical semiconductor element package. A percentage of the peel strength of the silicone pressure-sensitive adhesion composition is 30% or more.

Phosphor layer attaching kit, optical semiconductor element-phosphor layer attaching body, and optical semiconductor device

A light-emitting device includes a circuit board to which external electric power is supplied, a light emitting diode that is electrically connected onto the circuit board and emits light based on electric power from the circuit board, a housing provided on the circuit board so as to surround the light emitting diode and so that the upper end portion of the housing is positioned above the upper end portion of the light emitting diode, and a fluorescent laminate provided on the housing. The fluorescent laminate includes a first fluorescent layer that emits fluorescent light and a second fluorescent layer that emits fluorescent light having a wavelength that is longer than that of the first fluorescent layer. The second fluorescent layer is disposed on the housing and the first fluorescent layer is laminated on the second fluorescent layer.

Light-emitting device

A light-emitting diode element includes an optical semiconductor layer, an electrode unit to be connected to the optical semiconductor layer, and an encapsulating resin layer that encapsulates the optical semiconductor layer and the electrode unit, the encapsulating resin layer containing a light reflection component.

Light-emitting diode element in which an optical semiconductor element is encapsulated by an encapsulating resin layer containing a light reflection component

A method for producing a light emitting diode device includes the steps of preparing a base board; allowing a light semiconductor layer where an electrode portion is provided at one side in a thickness direction to be disposed in opposed relation to the base board, and the electrode portion to be electrically connected to a terminal, so that the light semiconductor layer is flip-chip mounted on the base board; forming an encapsulating resin layer containing a light reflecting component at the other side of the base board so as to cover the light semiconductor layer and the electrode portion; removing the other side portion of the encapsulating resin layer so as to expose the light semiconductor layer; and forming a phosphor layer formed in a sheet state so as to be in contact with the other surface of the light semiconductor layer.

Light emitting diode device and producing method thereof

A phosphor layer is composed of a resin in which phosphor particles and light scattering particles are dispersed.

Phosphor layer and light-emitting device

A reflecting material contains a silicone resin composition prepared from a polysiloxane containing silanol groups at both ends, an ethylenic silicon compound, a silicon compound containing an epoxy group, an organohydrogenpolysiloxane, a condensation catalyst, and an addition catalyst; and a light reflecting component.

Reflecting material and light emitting diode device

A transfer sheet for a phosphor layer includes a release substrate, a phosphor layer formed on the release substrate, and an adhesive layer formed on the phosphor layer.

Transfer sheet for phosphor layer and light-emitting device

A method for producing a light emitting diode device includes the steps of preparing a phosphor layer formed in a sheet state; forming a light semiconductor layer on one surface in a thickness direction of the phosphor layer; forming an electrode portion on one surface of the light semiconductor layer; forming an encapsulating resin layer containing a light reflecting component so as to cover the light semiconductor layer and the electrode portion; producing the light emitting diode element by partially removing the encapsulating resin layer so as to expose one surface of the electrode portion; and allowing the electrode portion to be electrically connected to the terminal, so that the light emitting diode element is flip-chip mounted on the base board.

Producing method of light emitting diode device and light emitting diode element

A phosphor ceramic includes at least one fluorescent layer that is capable of emitting fluorescent light; and at least one non-fluorescent layer that does not emit fluorescent light and is laminated onto the fluorescent layer.

Phosphor ceramic and light-emitting device

The present invention relates to a resin composition for forming an insulating resin layer for optical semiconductor element housing package having a concave portion in which a metal lead frame and an optical semiconductor element mounted thereon are housed, in which the resin composition includes the following ingredients (A) to (D), and the ingredients (C) and (D) are contained in a blend ratio (C)/(D) of 0.3 to 3.0 as a weight ratio thereof: (A) an epoxy resin; (B) an acid anhydride curing agent; (C) a white pigment; and (D) an inorganic filler.

Growing community of inventors

Osaka, Japan

Hisataka Ito