Toray Industries, Inc.

Hisashi Yamanoue

Kei Saito

Gen Noguchi

Akira Saito

Masashi Matsuda

A polyphenylene sulfide resin composition includes a polyphenylene sulfide resin (A); an aromatic vinyl compound block copolymer (B) containing at least one functional group selected from the group consisting of a carboxyl group, an acid anhydride group, a hydroxyl group, an amino group, an epoxy group and an isocyanate group; and an alkoxysilane compound (C) containing at least one functional group selected from the group consisting of an epoxy group, an amino group and an isocyanate group; wherein a phase structure of the polyphenylene sulfide resin composition is a sea-island structure in which the polyphenylene sulfide resin (A) forms a sea phase, and the aromatic vinyl compound block copolymer (B) forms an island phase dispersed in a number average dispersed particle size of 1,000 nm or less.

Polyphenylene sulfide resin composition, method of producing same, and molded article

A polyphenylene sulfide resin composition includes (A) 100 parts by weight of an acid-treated polyphenylene sulfide resin, (B) 10 to 100 parts by weight of a glass fiber, and (C) 0.1 to 10 parts by weight of an amino group-containing alkoxysilane compound, wherein the polyphenylene sulfide resin composition has an exothermic peak temperature (Tmc) of 195&#xb0; C. to 225&#xb0; C., the exothermic peak temperature being observed during a crystallization caused when the polyphenylene sulfide resin composition is melted by heating to 340&#xb0; C. and then cooled at a rate of 20&#xb0; C./minute, using a differential scanning calorimeter.

Poly(phenylene sulfide) resin composition, production method therefor, and molded article

An antistatic thermoplastic resin composition includes 0.01 to 20 parts by weight of an organic ion conductive agent mixed with 100 parts by weight of a thermoplastic resin composition consisting of 97 to 55 parts by weight of a styrene-based resin and 3 to 45 parts by weight of a copolymer containing alkylene oxide units as a component, and a molded article composed thereof. The antistatic thermoplastic resin composition is low in surface resistivity value, stable in sustained antistatic properly and excellent in moldability, surface appearance and mechanical properties, and can be suitably used as molded articles such as electric and electronic parts, carrier parts for electric and electronic parts, carrier parts for display related parts, etc.

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Nagoya, Japan

Hisashi Yamanoue