Mitsubishi Electric Corporation

Mitsubishi Denki Kabushiki Kaisha

Hisashi Tominaga

Hiroaki Morikawa

Mitsunori Nakatani

Daisuke Echizenya

Seiichi Mimura

Hirokazu Nishida

Takafumi Kawasaki

Hiroo Sakamoto

Shiro Takada

Keizo Makino

Hirozoh Tsuruta

Masayuki Hamayasu

A solar cell includes a silicon substrate, an aluminum electrode that collects electricity from the rear surface of the silicon substrate, and a silver electrode that extracts output from the aluminum electrode. The aluminum electrode includes an opening formed on the rear surface of the silicon substrate. On a side of the opening is formed a notch that recesses parallel to the direction in which principal stress acts in a plane of the silicon substrate. The silver electrode covers at least the opening and the notch of the aluminum electrode.

Solar cell

A printing mask includes a mask frame and a mesh extended on the mask frame, in which a mask portion is formed by filling the mesh with resin to leave a pattern forming portion in a region corresponding to an electrode pattern to be formed on a printing object. The mask portion has a raised part on a surface of the mesh to be opposed to the printing object. The thickness of the raised part is such that a difference in average film thickness between the end and other parts of the electrode pattern formed with the printing mask is equal to or less thanmicrometers.

Printing mask and solar cell

A multi-wire saw according to the present invention cuts a workpiece while supplying a slurry containing an alkali or mixed acid to a cutting interface between the workpiece and a wire, and includes: a storage tank with a heating mechanism for storing and heating the slurry; a thermal insulating pipe for transporting the slurry sent with a pump from the storage tank with a heating mechanism to a position before a position where the wire is incorporated into the workpiece, while keeping the slurry at a predetermined temperature; a thermostat for keeping a temperature in a vicinity of the workpiece fixed to a stage at the predetermined temperature; and a wire heating mechanism for heating the wire to the predetermined temperature. Consequently, the cutting resistance decreases during cutting machining of a silicon ingot, and the variation in the cutting resistance also decreases, whereby a high-quality wafer can be obtained at a high efficiency and a low cost.

Multi-wire saw

Growing community of inventors

Tokyo, Japan

Hisashi Tominaga