Sony Corporation

Hisashi Ohba

Toshiaki Iwafuchi

Kunihiko Hayashi

Yoshiyuki Yanagisawa

Toyoharu Oohata

Yoshinari Sasaki

Koichi Muto

A method of repairing a defective one of devices mounted on substrate is provided. Devices are arrayed on a substrate and electrically connected to wiring lines connected to a drive circuit, to be thus mounted on the substrate. The devices mounted on the substrate are then subjected to an emission test. If a defective device is detected in this test, a repair device is mounted at a position corresponding to a position of the defective device. At this time, after wiring lines connected to the defective device are cut off, the repair device is electrically connected to portions of the wiring lines, the portions of the wiring lines being located at positions nearer to the drive circuit side than the cut-off positions of the wiring lines. Since a defective device is repaired by a simple step that is carried out by simply mounting and fixing a repair device without removal of the defective device, it is possible to eliminate the need of any complicated, microscopic work, for example, removal of the mounted devices, and/or selective removal or repair of an insulating layer.

Method of repairing an image display unit

A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate. As a result, only the devices to be transferred can be done so with certainty, efficiency, and accuracy without exerting adverse effect on other parts.

Device transferring method, and device arraying method

Device mounting substrate and image display device

Light emitting devices formed in an array on a first substrate are transferred to an insulating material, to form a sheet-shaped device substrate. The sheet-shaped device substrate is cut along an array direction of the light emitting devices into long-sized line-shaped device substrates. The line-shaped device substrates are arrayed on a second substrate such that the line-shaped device substrates are enlargedly spaced from each other. The line-shaped device substrates divided from the second substrate are arrayed on a third substrate such as to be enlargedly spaced from each other.

Color image display unit

Device transferring method

Device transferring method, and device arraying method and image display unit fabricating method using the same

A method of repairing a defective one of devices mounted on substrate is provided. Devices are arrayed on a substrate and electrically connected to wiring lines connected to a drive circuit, to be thus mounted on the substrate. The devices mounted on the substrate are then subjected to an emission test. If a defective device is detected in this test, a repair device is mounted at a position corresponding to a position of the defective device. At this time, after wiring lines connected to the defective device are cut off, the repair device is electrically connected to portions of the wiring lines, the portions of the wiring lines being located at positions nearer to the drive circuit side than the cut-off positions of the wiring lines. Since a defective device is repaired by a simple step that is carried out by simply mounting and fixing a repair device without removal of the defective device, it is possible to eliminate the need for any complicated, microscopic work; for example, removal of the mounted devices, and/or selective removal or repair of an insulating layer.

Device mounting substrate and method of repairing defective device

Method of fabricating image display unit

A first adhesive layer is provided on a base substrate, and multiple devices are arranged on the first adhesive layer. The first adhesive layer is irradiated with laser light from the back side of the base substrate, only at positions corresponding to the devices to be transferred, by use of a mask, whereby the adhesive force of the first adhesive layer is lowered only at these positions, and only these devices are made releasable from the base substrate. A transfer substrate provided with a second adhesive layer and the base substrate are so disposed that the devices and the second adhesive layer are opposite to each other and pressed against each other. When the transfer substrate is stripped from the base substrate, only the devices to be transferred are selectively transferred onto the transfer substrate.

Method of transferring devices, method of arranging devices using the same, and method of manufacturing an image display system

Method of mounting light emitting device and method of fabricating image display unit

A lithium-ion secondary cell is provided to remarkably improve a mechanical peel strength of heat fusion-bonding portions of a container as well as to improve a moisture permeability resistance, a sealing performance, a barrier property, a safety or the like of the container. A lead (,) for use with a lithium-ion secondary cell according to the present invention is sandwiched by heat fusion-bonding portions (,) of a container (,) so as to be exposed in the outside of the container (,) when the container (,) is sealed by heat fusion-bonding. The lead (,) is coated with a heat fusion-bonding seal material (,). This heat fusion-bonding seal material (,) has an excellent adhesion to the lead (,) rather than a material of a sealant layer (,). Also, in the lithium-ion secondary cell, an end portion (,) on the outside portion in the longitudinal direction of the lead (,) in the layer made of the heat fusion-bonding seal material (,) is exposed from the end face of the container (,). Moreover, the lithium-ion secondary cell may have the lead (,) having a mesh structure.

Growing community of inventors

Kanagawa, Japan

Hisashi Ohba