Shibaura Mechatronics Corporation

Kabushiki Kaisha Toshiba

Hisashi Nishigaki

Yoji Takizawa

Munenori Iwami

Shohei Tanabe

Tsukasa Kawakami

Haruka Narita

Takumi Hanada

Tomokazu Ito

Atsushi Fujita

Shigeki Matsunaka

Yoshinao Kamo

Naoaki Sakurai

Naoya Hayamizu

Hiroshi Fujita

Koji Yoshimura

Hachiya Takeuchi

According to one embodiment, a film formation apparatus that suppresses effects of pre-processing and enables stable film formation is provided. A film formation apparatus of the present disclosure includes a chamber that can be made vacuum, a transporter that is provided inside the chamber and that circulates and transports a workpiece in a trajectory of a circle, a film formation unit that forms film by sputtering on the workpiece circulated and transported by the transporter, a load-lock room that loads the workpiece into and out of the chamber relative to air space while keeping an interior of the chamber vacuum, and a pre-processing unit that is provided in the chamber at a position adjacent to the load-lock room and that performs pre-processing to the workpiece loaded in from the load-lock room in a state distant from the transporter.

Film formation apparatus

According to one embodiment, an electromagnetic wave attenuator includes a first structure body. The first structure body includes a first member, a second member, and a third member. The first member includes a first magnetic layer and a first nonmagnetic layer alternately provided in a first direction. The first nonmagnetic layer is conductive. The first direction is a stacking direction. The second member includes a second magnetic layer and a second nonmagnetic layer alternately provided in the first direction. The second nonmagnetic layer is conductive. The third member includes a third nonmagnetic layer. The third nonmagnetic layer is conductive. A direction from the third member toward the first member is along the first direction. A direction from the third member toward the second member is along the first direction. A first magnetic layer thickness is greater than a second magnetic layer thickness.

Electromagnetic wave attenuator, electronic device, film formation apparatus, and film formation method

A resin layer formation method and device for making a resin layer uniform on a substrate before lamination or on a substrate is provided. Adhesive is coated at an inner circumference side while rotating a substrate at low speed. A first adhesive layer is formed on the surface of the substrate by rotating at high speed. A step difference section is formed around a rotation center of the substrate by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer to hardening the area. Adhesive is coated at the rotation center side from the step difference section on the substrate, and a second adhesive layer is formed on the first adhesive layer by rotating the substrate at high speed. The first adhesive layer and the second adhesive layer are integrated to form a uniform adhesive layer.

Resin layer formation method, resin layer formation device, disk and disk manufacturing method

A resin layer formation method, resin layer formation device, disk and disk manufacturing method for making a resin layer uniform on a substrate before lamination or on a substrate to be coated by a simple procedure are provided. Adhesive A is coated at the inner circumference side while rotating a substrate P at low speed, a first adhesive layer ALis formed on the surface of the substrate P by rotating the substrate P at high speed, a step difference section H is formed around a rotation center of the substrate P by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer ALand hardening the area, the adhesive A is coated at the rotation center side from the step difference section H on the substrate P, and a second adhesive layer ALis formed on the first adhesive layer ALby rotating the substrate P at high speed. The first adhesive layer ALand the second adhesive layer ALare integrated to form a uniform adhesive layer B as a whole.

Resin layer formation method, resin layer formation device, disk, and disk manufacturing method

Resin layer formation method, resin layer formation device, and disk manufacturing method

The present invention provides a bonding apparatus and bonding method which can prevent warping of substrates by ensuring a sufficient standing time following bonding of the substrates, using a simple and compact apparatus. Substrate carrying partsare formed along the circumference of a rotating turntable. The respective substrate carrying partsare formed so that these parts pass through substrate placement positionsand, a bonding position, pre-curing standing positionsthrough, a curing position, a post-curing standing positionand a conveying positionas the turntablerotates. After being bonded in the bonding position, the substrates move through the pre-curing standing positionsthroughas a result of the rotation of the turntable, and are allowed to stand for a fixed period of time, so that warping is corrected.

Bonding apparatus and bonding method

Provided is a cleaning method for effectively removing particles on the surface of an object to be cleaned. This cleaning method includes dissolving oxygen into deaerated pure water to prepare a cleaning fluid, and cleaning an object to be cleaned by bringing the object into contact with the cleaning fluid to which ultrasonic vibration is being applied.

Cleaning method

Growing community of inventors

Yokohama, Japan

Hisashi Nishigaki