Ibiden Company Limited

Other

Hisashi Minoura

Kiyotaka Tsukada

Mitsuhiro Kondo

Masaru Takada

Hiroyuki Kobayashi

Kenji Chihara

Naoto Ishida

Yoshikazu Ukai

Kouji Asano

Morio Nakao

Koji Asano

A solder resist comprising a thermosetting resin is printed on a surface of an insulating board () having a conductor circuit (). The solder resist is then heat-cured to form an insulating film () having a low thermal expansion coefficient. A laser beam () is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (), whereby the conductor circuit () is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

Method of manufacturing printed wiring board

In a printed wiring board, an odd number (n) of conductive layers (-) and insulating layers (-) are alternately laminated upon another. The first conductive layer () is constituted as a parts connecting layer and the n-th conductive layer () is constituted as an external connecting layer which is connected to external connecting terminals (). The second to (n&#x2212;1)-th conductive layers () are constituted as current transmitting layers for transmitting internal currents. The surface of the n-th conductive layer () is coated with the outermost n-th insulating layer () in a state where the external connecting terminals () are exposed on the surface. It is preferable to constitute the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.

Printed wiring board and method for manufacturing the same

A method of producing a printed wiring board comprising innerlayer conductor circuits among insulating layers and blind via-holes formed by irradiating laser beams from the outermost surface of the insulating layer toward the innerlayer conductor circuit. A central portion of the innerlayer conductor circuit contains a previously formed opening hole located at the bottom of the blind via-hole. Thereafter, a metal plated film is formed on surfaces of the innerlayer conductor circuits and the blind via-holes.

Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuit

In a printed wiring board, an odd number (n) of conductive layers (-) and insulating layers (-) are alternately laminated upon each other. The first conductive layer () is a parts connecting layer and the n-th conductive layer () is an external connecting layer which is connected to external connecting terminals (). The second to (n&#x2212;1)-th conductive layers () are current transmitting layers for transmitting internal currents. The surface of the n-th insulating layer () in a state where the external connecting terminals () are exposed on the surface. It is preferable to make the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.

Printed wiring board and method of manufacturing the same

In the production of a printed wiring board comprising innerlayer conductor circuits arranged among insulating layers and blind via-holes formed from an outermost surface of the insulating layer toward the innerlayer conductor circuit, an opening hole is previously formed in a central portion of the innerlayer conductor circuit located at the bottom of the blind via-hole , and laser beams are irradiated from the outermost surface of the insulating layer to form the blind via-holes . Thereafter, a metal plated film is formed on surfaces of the innerlayer conductor circuits and the blind via-holes

Printed wiring board having throughole and annular lands

A solder resist comprising a thermosetting resin is printed on a surface of an insulating board ( ) having a conductor circuit ( ). The solder resist is then heat-cured to form an insulating film ( ) having a low thermal expansion coefficient. A laser beam ( ) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening ( ), whereby the conductor circuit ( ) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

A method for manufacturing a multilayer printed circuit board that shortens the distance between pattern layers and facilitates formation of a minute conductive hole having superior conductive reliability. A core substrate ( ) including ad core pattern ( ), which has a pad ( ), is first prepared. Then, a laminated plate is formed by laminating an insulating layer ( ) on the surface of the core substrate. Afterward, a surface pattern ( ) is formed on the surface of the laminated plate. Further, the conductive hole ( ) is formed by irradiating a laser beam at the laminated plate. The bottom opening of the conductive hole ( ) is covered by the pad ( ).

Multilayer printed wiring board and method for manufacturing the same

A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (,) having a conductor circuit (,). The solder resist is then heat-cured to form an insulating film (,) having a low thermal expansion coefficient. A laser beam (,) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (,), whereby the conductor circuit (,) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

An electronic component mounting base board has an insulating substrate provided with a conductor circuit and a mount portion for an electronic component, and a heat slug adhered to the insulating substrate, wherein the heat slug is comprised of a flat main body and a projection portion extending vertically from a side face of the main body, and provided with a slit deforming portion absorbing deformation of the insulating substrate.

Growing community of inventors

Ogaki, Japan

Hisashi Minoura