Asahi Kasei Construction Materials Corporation

Hidefumi Hirai

Asahi Kasei Contruction Materials Corporation

Hisashi Mihori

Yoshihito Fukasawa

Takayuki Kuroda

Nobuki Hiramatsu

Takatoshi Kitagawa

Kazuhiro Saito

Tsutomu Nakamura

Shigemi Mukaiyama

Masato Hamajima

Yoshimitsu Inoue

Noriaki Kikuchi

Narumi Miyata

Rikinori Terakado

Ken Ihara

Yuuki Saito

Yukihiro Shimizu

Masami Komiyama

Hideaki Ohkubo

In the phenolic resin foam laminate board (), a surface material () is arranged on at least one of one side of a phenolic resin foam () and the back side of the one side. The phenolic resin foam () has a density of not less than 22 kg/mand not more than 50 kg/m, a cell diameter of not less than 50 μm and not more than 170 μm, and a closed cell ratio of not less than 80%. When HCFO-1224yd(Z), aliphatic hydrocarbons having a carbon number of 6 or less, chlorinated saturated hydrocarbons having a carbon number of 5 or less, and hydrofluoroolefin are gas components, the phenolic resin foam contains only HCFO-1224yd (Z) as a gas component. A cell internal pressure of air bubble is 0.20 atm or more.

Phenolic resin foam laminate board and composite board

Provided is a phenolic resin foam laminate board in which a flexible surface material is arranged on at least upper and lower surfaces of a phenolic resin foam. The phenolic resin foam contains HCFO-1224yd(Z), has a density of not less than 20 kg/mand not more than 55 kg/m, a closed cell ratio of 80% or more, an average cell diameter of not less than 60 μm and not more than 200 μm, a percentage of an area seeping out from the surface material is 30% or less, and content of HCFO-1224yd(Z) per space volume of 22.4×10min the phenolic resin foam is not less than 0.06 mol and not more than 0.35 mol.

Phenolic resin foam laminate board

A phenolic resin foam has a density of 30 kg/mto 80 kg/m, a closed cell ratio of 85% or more, and reaches a total amount of heat release of 8 MJ/min a time of 20 minutes or more in a heat release test performed using a cone calorimeter.

Flame-retardant phenolic resin foam

A phenol resin foamed plate contains hydrocarbon and/or chlorinated aliphatic hydrocarbon, in which an average cell diameter is in a range of 5 &#x3bc;m or more and 200 &#x3bc;m or less, a void area ratio is 5% or less in its cross section, a density is 15 kg/mor more and 26 kg/mor less, and when compression is made by a 10% displacement in a direction perpendicular to the thickness direction, a recovery rate 1 minute after release of this compression is 96.0% or more and 98.5% or less and a degree of change in recovery rates C is 0.030%/hr or more and 0.060%/hr or less.

Phenol resin foamed plate

A phenolic resin foam laminated sheet comprising a phenolic resin foam; and a face material for covering a surface of the phenolic resin foam, wherein the phenolic resin foam contains a hydrocarbon, a chlorinated aliphatic hydrocarbon or a combination thereof, a density of the phenolic resin foam is 10 kg/mor higher and 100 kg/mor lower, an average cell diameter of the phenolic resin foam is 5 &#x3bc;m or larger and 200 &#x3bc;m or smaller, a closed cell content of the phenolic resin foam is 85% or higher and 99% or lower, and an absolute value of a dimensional charge rate of the phenolic resin foam after 70&#xb0; C. for 48 hours is 0.49% or lower.

Phenolic resin foam laminated sheet and method for manufacturing the same

The present invention is a phenolic resin foam board having a thickness of 40 mm or more to 300 mm or less, when the phenolic resin foam board is sliced into n pieces (n&#x2265;5) at approximately equal intervals of 8 mm or more to 10 mm or less, a density of an n-th specimen is d, an average density of n pieces of specimens is d, a lowest density among the densities of n pieces of specimens is d, 0&#x2264;(d&#x2212;d)/d&#x2264;0.12 is established, and when values for D=(d+d)/2 are calculated, Dvalues are plotted and points corresponding to the Dvalues are connected, resulting in a density distribution curve, no straight line parallel to the horizontal axis intersects the density distribution curve at four points.

Phenolic resin foam board, and method for manufacturing same

There is provided an expandable phenolic resin composition comprising: a phenolic resin; an acid curing catalyst for the resin; a foaming agent; and a surfactant, wherein the foaming agent comprises a hydrocarbon-based foaming agent; and the surfactant is a polyoxyethylene alkyl ether having an alkyl ether moiety having 14 to 22 carbon atoms, and the content of the surfactant is 0.01 to 10 parts by weight relative to 100 parts by weight of the phenolic resin.

Expandable phenolic resin composition, phenolic resin foam, and method for producing the phenolic resin foam

Disclosed is a process for introducing a carboxyl group to an aromatic carboxylic acid or a derivative thereof, which comprises reacting a starting aromatic carboxylic acid, such as a benzoic acid, a biphenylcarboxylic acid, a naphthalenecarboxylic acid, a diphenylcarboxylic acid, or a derivative thereof, with a carbon tetrahalide in the presence of a cyclodextrin and an alkali metal hydroxide, thereby introducing a carboxyl group to the aromatic ring of the starting aromatic carboxylic acid or the derivative thereof in substitution for a hydrogen atom bonded thereto. By the process of the present invention, a desired aromatic polycarboxylic acid or a derivative thereof can be easily obtained with high selectivity.

Growing community of inventors

Tokyo, Japan

Hisashi Mihori