E.i. Dupont De Nemours and Company

Yamatake Corporation

Nihon Yamamura Glass Co., Ltd.

Hisashi Matsuno

Keiichiro Hayakawa

Michael F Barker

Brian J Laughlin

Takuya Konno

Hiroaki Noda

Hiroki Kojo

Kenneth Warren Hang

Alan Frederick Carroll

Yueli Wang

Tetsuo Koike

Jerome David Smith

Masakatsu Kuroki

Zhigang Rick Li

Tomoyuki Taguchi

Ji-Yeon Lee

Ikuo Kuriyama

Hiroyuki Soshi

Tetsu Sugihara

Yousuke Kusano

Keiichiro Hayakwa

Mamoru Murakami

Ichiro Uchiyama

A method for manufacturing a solar cell electrode, comprising the steps of: (a) applying a conductive paste for bus electrode to a wafer in order to form a bus electrode pattern; (b) depositing onto the wafer a photocurable conductive paste for finger electrode from a discharge slot of a dispenser nozzle to thereby form an uncured finger electrode pattern on the wafer, wherein the nozzle moves parallel to the wafer; and (c) curing the uncured finger electrode pattern by exposing the uncured finger electrode pattern to UV light either after forming the uncured finger electrode pattern on the wafer in the step (b), or concurrent with the step (b).

Method for manufacturing solar cell electrode

An objective of this present invention is to provide a conductive paste that could obtain good electrical property, for example series resistance in an electrode. An aspect of the present invention relates to a conductive paste which comprises electrically conductive powder; glass frit which comprises, based on weight percent (wt %) of the glass frit, 8-26 wt % of SiO, 0.1-5 wt % of AlO, and 73-90 wt % of lead compound, wherein lead fluoride is contained in the range of 5-28 wt % based on the total weight of the lead compound; and organic medium.

Glass compositions used in conductors for photovoltaic cells

The invention relates to zinc-containing glass compositions useful in conductive pastes for silicon semiconductor devices and photovoltaic cells.

The invention relates to glass compositions useful in conductive pastes for silicon semiconductor devices and photovoltaic cells. The thick film conductor compositions include one or more electrically functional powders and one or more glass frits dispersed in an organic medium. The thick film compositions may also include one or more additive(s). Exemplary additives may include metals, metal oxides or any compounds that can generate these metal oxides during firing.

An object of the present invention is to provide a lead-free bismuth glass wherein decrease of the degree of accuracy of the patterning is prevented. Specifically, the present invention provides a lead-free bismuth glass characterized in that said lead-free bismuth glass is used for an optical patterning glass material which is patterned by light irradiation and the optical-absorption coefficient to light with a wavelength of 365 nm is 300 to 3000 cm.

Lead-free bismuth glass

The black bus electrode of plasma display panel is formed from a conductive composition comprising a conductive powder, glass powder, organic binder, organic solvent, and black pigment, wherein the conductive powder comprises an alloy of at least two metals selected from the group of Ru, Rh, Pd, Ag, Os, Ir, Pt and Au.

Conductive composition for black bus electrode, and front panel of plasma display panel

The black bus electrode of plasma display panel is formed from a conductive composition comprising a conductive powder, glass powder, organic binder, organic solvent, and black pigment, wherein the conductive powder is coated with metal selected from the group of Ru, Rh, Pd, Os, Ir, Pt and Au.

The present invention provides a method for forming a black electrode by performing sintering at a temperature in the range of 500-600&#xb0; C. after applying a lead-free black conductive composition to a substrate. The aforementioned black electrode comprises a binder comprising a crystallized glass component. The aforementioned black conductive composition comprises conductive particles of black RuO, lead-free black ruthenium-based polyoxide, and mixtures thereof in an amount of 4-30 wt %, based on the total weight of the composition, a lead-free non-conductive black oxide in an amount of 0-30 wt %, based on the total weight of the composition, and a lead-free bismuth-based glass binder in an amount of 10-50 wt %, based on the total weight of the composition.

Black conductive thick film compositions, black electrodes, and methods of forming thereof

This invention is directed to black conductive compositions, black electrodes made from such compositions and methods of forming such electrodes. In particular, the invention is directed to a single layer bus electrode.

This invention is directed to black conductive compositions, black electrodes made from such compositions and methods of forming such electrodes.

The present invention relates to terminal electrode compositions for multilayer ceramic capacitors. More specifically, it relates to terminal electrode compositions for multilayer ceramic capacitors, which compositions are made of a conductive-based powder and a glass frit and can be fired at a low temperature in a nitrogen atmosphere.

Terminal electrode compositions for multilayer ceramic capacitors

The present invention relates to terminal electrode compositions for multilayer ceramic capacitors. More specifically, it relates to terminal electrode compositions for multilayer ceramic capacitors which have a metal oxide component selected from SnO, VOand MoO. The compositions can be fired at a low temperature in a nitrogen atmosphere.

The invention is directed to a thermosetting electroconductive paste for forming electroconductive bumps at predetermined locations on at least one circuit layer that is laminated to an insulating layer. Upon lamination the electroconductive bumps penetrate the insulating layer forming an electrical connection to a second circuit layer. The paste comprises, based on total composition, 80 to 90 wt % electroconductive powders comprising at least a first and second electroconductive metal powder of which packing densities are in the range of 20% or less of the average density (sp. gr.) of metal for the first powder and 20 to 40% of the average density (sp. gr.) of metal for the second powder; and 10 to 20 wt % epoxy resin, curing agent, and solvent.

Thermosetting electroconductive paste for electroconductive bump use

A relay device for a concatenated sensor system includes first and second relay units ( ) and a relay cable ( ) connecting the two relay units. When the first relay unit is located in intimate contact with one side of a sensor unit ( ) that is situated at one end of a sensor unit group ( ) or with one side of a master unit ( ), a linking connector of the relay unit is connected to an input-output connector provided on one side of the master unit or on one side of the sensor unit. When the second relay unit is located in intimate contact with the other side of a sensor unit that is situated at the other end of a sensor unit group ( or ), a linking connector of the relay unit is connected to an input-output connector provided on the other side of the sensor unit. Thus, electrical connection between the master unit and the sensor unit group and between the sensor unit groups of the concatenated sensor system can be established with reliability.

Repeater of tandem sensor system

A thick film resistor assembly comprising: (a) an insulation substrate, (b) a resistor layer being formed on surface of the insulation substrate, (c) a pair of conductor pads comprising a first Ag conductor layer comprising Ag powder and palladium or platinum or mixtures thereof, disposed on the insulation substrate with predetermined spaces from the resistor layer to sandwich the resistor layer in a direction of its conductive resistance path; and (d) a second Ag conductor layer comprising a Ag conductor composition devoid palladium or platinum or mixtures thereof, disposed over the resistor layer and conductor pads at their respective edges to connect electrically the resistor layer to the conductor pads forming a conductive resistance path.

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Tokyo, Japan

Hisashi Matsuno