Tdk Corporation

Snaptrack Incorporated

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Epcos Ag

Hisashi Kobuke

Yusuke Takahashi

Minoru Takaya

Yoshiaki Akachi

Toshio Sakurai

Tomohiro Arashi

Hiroyuki Uematsu

Yasuharu Miyauchi

Toshikazu Endo

Yousuke Futamata

Takahiro Nakano

Takashi Fukui

Masanori Abe

Yasumasa Harihara

Masami Sasaki

Emi Ninomiya

Kenichi Kawabata

Yuji Akimoto

Kazuro Nagashima

Kiyoshi Hatanaka

Toshiyuki Abe

Isao Kanada

Kazuhiko Itoh

Kouji Tashiro

Kenichi Tezuka

Munemitsu Hamada

Tomoko Nakamura

Osamu Hirose

Ryohei Nakano

Kazunari Kimura

Tomoyuki Goi

Tomohiro Sogabe

Hisanao Tosaka

Masaru Abe

Matsumi Watanabe

Yutaka Ui

Hiroshige Ohkawa

Takashi Kajino

Tatsuya Kikuchi

Shigeru Moriya

Toshiki Tate

Atsushi Ishimoto

Seiji Takahara

Masahiro Ikemoto

An antenna device according to the present disclosure includes two wiring layers and an antenna layer. One of the two wiring layers is divided in the x-direction by a first slit extending in the y-direction, and the antenna layer is divided in the x-direction into first and second antenna areas by a second slit extending in the y-direction. The first and second slits overlap each other in the z-direction. One of the first and second slits is larger in width than the other one thereof. The antenna layer includes an antenna conductor formed in the first antenna area and another antenna conductor formed in the second antenna area.

Antenna device, communication apparatus having the same, and manufacturing method of antenna device

Disclosed herein is an antenna device that includes: a substrate having a plurality of insulating layers laminated in a z-direction; a first ground pattern formed on a first insulating layer; a first radiating conductor pattern formed on a second insulating layer; a second ground pattern constituted by a first via conductor provided so as to penetrate at least two insulating layers; and a second radiating conductor pattern constituted by a second via conductor provided so as to penetrate at least one insulating layer. The first radiating conductor pattern overlaps the first ground pattern in the z-direction. The second radiating conductor pattern overlaps the second ground pattern in a y-direction.

Antenna device and circuit board having the same

Provided is a more versatile black marker composition which achieves excellent adhesion between a mark and an electronic component element body and excellent contrast of a mark regardless of the composition of the electronic component element body, the black marker composition containing borosilicate glass and a black oxide, in which a crystallization temperature of the borosilicate glass is less than 910&#xb0; C., and an amount of Zn in terms of ZnO is 0.05% by mass or less based on 100% by mass of an inorganic solid content in terms of an oxide contained in the black marker composition.

Black marker composition and electronic component using the same

A dielectric ceramic composition includes: MgSiOas main component; R-containing, Cu-containing, and B-containing compounds, and Li-containing glass, as sub-component. R is an alkaline earth metal. R-containing compound greater than or equal to 0.2 part by mass and less than or equal to 4.0 parts by mass, contained in terms of oxide, Cu-containing compound of greater than or equal to 0.5 part by mass and less than or equal to 3.0 parts by mass, contained in terms of oxide, and B-containing compound greater than or equal to 0.2 part by mass and less than or equal to 3.0 parts by mass, contained in terms of oxide, to 100 parts by mass of main component. Li-containing glass of greater than or equal to 2 parts by mass and less than or equal to 10 parts by mass contained to total a 100 parts by mass of main component, and sub-component excluding Li-containing glass.

Dielectric ceramic composition and electronic component

[Problem] The aim of the present invention lies in providing a glass ceramic sintered compact in which dielectric loss in a high-frequency region is reduced, without any reduction in sintering density, and also in providing a wiring board employing same. [Solution] A glass ceramic sintered compact containing a glass component, a ceramic filler and a composite oxide, characterized in that the glass component is crystallized glass on which is deposited a diopside oxide crystal phase including at least Mg, Ca and Si, and the composite oxide includes at least Al and Co.

Glass ceramic sintered compact and wiring board

A multilayer glass ceramic substrate includes a number of insulating layers composed of glass ceramics. An embedded resistor is formed between the insulating layers. The resistor includes scattered microvoids and includes materials containing conductive powders and glass powders. First and second internal conductors are provided where a first end of the embedded resistor is connected to the first internal conductor and a second end of the embedded resistor is connected to the second internal conductor.

Multilayer glass ceramic substrate with embedded resistor

A multilayer wiring substrate includes a number of insulating layers, each insulating layer including a glass ceramic. A number of internal conductor layers are formed between the insulating layers. Via conductors penetrate through the insulating layers and mutually connect the internal conductor layers in different layer locations. Surface conductor layers are formed on an outer surfaces in a lamination direction of the insulating layers. The insulating layers include outside insulating layers and inside insulating layers. A first aspect ratio representing an oblateness and sphericity of an external filler contained in the outside insulating layers is larger than a second aspect ratio representing an oblateness and sphericity of an internal filler contained in the inside insulating layers. A thermal expansion coefficient of the outside insulating layers is smaller than a thermal expansion coefficient of the inside insulating layers.

Multilayer wiring substrate

A ceramic electronic component includes a first dielectric layer, a second dielectric layer, and a boundary reaction layer. The first dielectric layer is a layer containing BaO, NdO, and TiO, the second dielectric layer is a layer containing a material different from the material of the first dielectric layer, and the boundary reaction layer is a layer formed between the first dielectric layer and the second dielectric layer and containing at least one of Zn, Ti, Cu, and Mg.

Ceramic electronic component and method of manufacturing ceramic electronic component

Provided is a dielectric ceramic that includes a main component which contains MgSiOand additives which contain a zinc oxide and a glass component, in which, in X-ray diffraction. The peak intensity ratio, I/I, of the X-ray diffraction peak intensity Iof zinc oxide remaining unreacted, for which 2&#x3b8; is between 31.0&#xb0; and 32.0&#xb0; and between 33.0&#xb0; and 34.0&#xb0;, with respect to the peak intensity Iof MgSiOas the main phase, for which 2&#x3b8; is between 36.0&#xb0; and 37.0&#xb0;, is 10% or less. The dielectric ceramic has a relative density of 96% or greater.

Dielectric ceramic, method for producing dielectric ceramic, and electronic component

A ceramic electronic component includes a first dielectric layer, a second dielectric layer, and an intermediate layer. The first dielectric layer is a layer containing BaO, NdO, and TiO, the second dielectric layer is a layer containing a different material from the material of the first dielectric layer, and the intermediate layer is a layer formed between the first dielectric layer and the second dielectric layer and containing main components that are not contained in the first dielectric layer and the second dielectric layer in common as the main components.

To provide a dielectric ceramic composition which is free from variation in breakdown voltage, and has excellent electric properties. The dielectric ceramic composition according the present invention includes: as a main component, a component represented by a composition formula {&#x3b1;(xBaO-yNdO-zTiO)+&#x3b2;(2MgO&#x2014;SiO)}, wherein x, y, and z representing a molar ratio of the BaO NdO, and TiOare each in a specific molar ratio range, and &#x3b1; and &#x3b2; representing a volume ratio of each component, zinc oxide, boron oxide, a glass having a softening point at a specific temperature or less, and silver, wherein a, b, c, and d representing a mass ratio of each of the minor components based on the main component are each in a specific mass ration range.

Dielectric ceramic composition

A method for manufacturing magnetic metal powder is provided. In the method, a powdered magnetic metal oxide is supplied to a heat treatment furnace with a carrier gas composed of a reducing gas. The heat treatment furnace is maintained at temperatures above a reducing action starting temperature for the powdered magnetic metal oxide and above a melting point of the magnetic metal in the powder. The powdered magnetic metal oxide is subject to a reducing process, and then magnetic metal particles, the resultant reduced product, is melted to form a melt. The melt is re-crystallized in a succeeding cooling step, to obtain single crystal magnetic metal power in substantially spherical form.

Method for manufacturing magnetic metal powder, and magnetic metal powder

A method for manufacturing spherical ceramic powder is provided. The method includes essentially a spray drying step and a sintering step. In the spray drying step, a spray nozzle is used to spray slurry containing powdered raw material consisting essentially of ceramic ingredients to form liquid droplets, and liquid contents in the liquid droplets are heated and removed to obtain ceramic granular powder. In the sintering step, the ceramic granular powder is sintered to form spherical ceramic powder. The method provides ceramic powder having a mean particle size of about 1-50 &#x3bc;m and a sphericity of about 0.8 or higher, which is suited for mixing with resin material to form a compound. The ceramic powder has high dispersant and filling properties against the resin material.

Method for manufacturing spherical ceramic powder

There is provided a dielectric ceramic material in which the firing temperature dependency of the relative dielectric constant can be suppressed and the mechanical strength can be improved. Specifically, there is provided a dielectric ceramic material including: main constituents given by a composition located in the region, in a ternary diagram of ZrO, SnOand TiOshown in FIG., bounded by point A, point B, point C, point D, point E and point F; and ZnO: 0.5 to 5 wt %, NiO: 0.1 to 3 wt %, and SiO: 0.008 to 1.5 wt % in relation to the total weight of the main constituents. The dielectric ceramic material can include NbO: 0.2 wt % or less and KO: 0.035 wt % or less in relation to the total weight of the main constituents.

Dielectric ceramic material

A core material-including organic core board or inorganic sintered boardhaving a plurality of band-shaped conductor patternsformed on its front and rear surfaces is sliced in a direction crossing the band-shaped conductor patterns. End portions of the band-shaped conductor patternsexposed on each of cut surfaces of the core boardare connected to one another by bridging conductor patterns formed on the cut surfaces. In this manner, at least one helical coil is provided. The inner diameter of the helical coil can be kept constant while coil pitch accuracy can be kept good.

Inductive device and method for producing the same

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Tokyo, Japan

Hisashi Kobuke