Fujitsu Corporation

Hisashi Kawashima

Masahiro Suzuki

Junichi Ishimine

Yoshiaki Udagawa

Masahiro Mochizuki

Jie Wei

Haruhiko Yamamoto

Keizo Takemura

Hideo Kubo

Akihiko Fujisaki

Masahiro Miyo

Kiyotaka Seyama

Motohiro Takemae

Tsuguo Okada

Hideo Katsumi

Hirofumi Takao

Jie Wie

Takaaki Kanki

A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigetant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level. Accordingly, the conventional dry evaporator is forced to absorb heat at a lower heat transfer coefficient, as compared with the present dry evaporator.

Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator

A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigerant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level. Accordingly, the conventional dry evaporator is forced to absorb heat at a lower heat transfer coefficient, as compared with the present dry evaporator.

An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

Liquid-cooled electronic apparatus

A cooling device for a mounting module in which heat generated from a predetermined number of circuit elements mounted on the mounting module is dissipated by a cooling arrangement. The cooling device is comprised of at least one conduction element which thermally connects the circuit element with the cooling arrangement, the conduction element includes a predetermined number of first conductive members which is placed in a respective hole formed in the conduction arrangement and is movably supported by a first conductive material filled between the side surface of the first conductive member and the surface of the conduction element so as to complete a thermal flow from the circuit element to the cooling arrangement.

Cooling device for mounting module

A reservoir tank of the present invention employed in a liquid cooling system is provided with a plurality of outlets for feeding out the coolant and a plurality of inlets to which the coolant returns after cooling electronics devices. These outlets are provided at the center of bottom of the tank and these inlets are provided at the external circumference of the outlets. Incident angle of the inlets to the tank is inclined from the vertical line of tank so that the coolant generates a whirlpool around the vertical axis of tank. A cylindrical partition may be provided between the center of the bottom having the inlets and the circumferential part having the outlets, so as to prevent a short path of the coolant flowing from inlets to the outlets. In this case, holes may be provided at the partition so that the coolant stirred at the outside of partition flows to the outlets therethrough. In such a structure, the coolant is sufficiently stirred in the tank even if temperature of coolant returning to the tank is different on each inlet. Thereby, temperature of coolant fed out from the outlets is kept at a uniform temperature; therefore, uniform cooling of the electronic devices can be realized.

Reservior tank for a liquid cooling system

An apparatus for circulating cooling fluid through a plurality of cooling modules for cooling electronic components, such as IC'S or LSI'S. A plurality of cooling fluid supply systems are independently connected to the respective cooling modules. Each of the supply systems includes a fluid line connected to a single tank containing cooling fluid and is provided with a pump and a heat exchanger, so that the cooling fluid in the tank is circulated through the respective cooling modules and returned to the tank, in which the cooling fluid is then mixed.

Apparatus for supplying cooling fluid

Growing community of inventors

Kawasaki, Japan

Hisashi Kawashima