Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Electric Corporation

Hisashi Kawafuji

Mitsutaka Iwasaki

Toru Iwagami

Tooru Iwagami

Sukehisa Noda

Kenichi Hayashi

Gourab Majumdar

Shinya Nakagawa

Maki Hasegawa

Satoshi Mori

Yoshio Takagi

Masahiro Kato

Toshiaki Shinohara

Hiroyuki Ozaki

Tatsuyuki Takeshita

Nobuhito Funakoshi

Shinji Yamada

Hitoshi Toda

Hiroshi Yoshida

Naoki Ikeda

Hisashi Oda

Ming Shang

Gorab Majumdar

Hongbo Zhang

Seiki Iwagaki

Mitsugu Tajiri

Shuhei Yokoyama

Shigeru Mori

Taketoshi Shikano

Kazuhiro Tada

Takanobu Yoshida

Hiroyuki Yoshihara

Goro Izuta

Junichi Murai

A power module includes: a power chip; a control chip controlling the power chip; a power terminal connected to the power chip; a control terminal connected to the control chip; and a package covering the power chip, the control chip, the power terminal, and the control terminal with mold resin, wherein first and second recesses for attaching a fin are respectively provided on side faces facing each other of the package from which neither the power terminal nor the control terminal protrudes, and the first and second recesses are arranged not at positions opposite to each other but alternately.

Power module

A power module includes one control IC and a plurality of reverse conducting insulated gate bipolar transistors (RC-IGBTs). The control IC has the functions of a high-voltage IC and a low-voltage IC. The plurality of RC-IGBTs are disposed on three of four sides of the control IC and connected to the control IC through only wires.

Method for manufacturing power module

Power module and control integrated circuit

Power semiconductor device

There is provided a semiconductor device having a converter circuit, a brake circuit and an inverter circuit and manufacturable by a simplified manufacturing process. The semiconductor device has a plurality of die pads, IGBTs, diodes, freewheel diodes, an HVIC and LVICs mounted on the plurality of die pads, a plurality of leads, and an encapsulation resin body that covers these component parts. In a manufacturing process, a single-plate lead frame having the above-described plurality of die pads and leads connected together can be prepared. The semiconductor device may be manufactured by using this single-plate lead frame.

Semiconductor device and method of manufacturing the same

There is provided a semiconductor device having a converter circuit, a brake circuit and an inverter circuit and manufacturable by a simplified manufacturing process. the semiconductor device has a plurality of die pads, IGBTs, diodes, freewheel diodes, an HVIC and LVICs mounted on the plurality of die pads, a plurality of leads, and an encapsulation resin body that covers these component parts. In a manufacturing process, a single-plate lead frame having the above-described plurality of die pads and leads connected together can be prepared. The semiconductor device may be manufactured by using this single-plate lead frame.

Semiconductor device

A semiconductor device includes a pair of power chips, an IC chip, a plurality of leads one of which having a die pad on which the power chips are mounted and another one having a die attach portion on which the IC chip is mounted, a resin sheet firmly adhered to one side of the die pad, and a resin casing made by molding operation to encapsulate the power chips, the IC chip and the resin sheet by a resin in such a manner that one surface of the resin sheet opposite the die pad is exposed to the exterior of the resin casing. The resin casing has a groove formed in one surface opposite the exposed surface of the resin sheet, the groove extending parallel to the resin sheet and perpendicular to a runner through which the resin was supplied in the molding operation.

Semiconductor device and mold for resin-molding semiconductor device

The method of producing a semiconductor device in which chips are resin-molded, including steps of: preparing frames having front and back surfaces and die pads; preparing an insulation resin sheet having a first and a second surfaces; preparing a resin-sealing metal mold having cap pins; mounting the resin sheet inside the resin-sealing metal mold in such a manner that the second surface of the resin sheet contacts an inner bottom surface of the resin-sealing metal mold; mounting power chips on the surfaces of the die pads; positioning the frames on the first surface of the resin sheet in such a manner that the back surfaces of the die pads contact the first surface of the resin sheet; pressing the die pads toward the resin sheet using the cap pins and fixing the die pads; injecting a sealing resin in the resin-sealing metal mold and hardening the sealing resin; and removing the semiconductor device in which the power chips are molded with the sealing resin out from the resin-sealing metal mold. The resin sheet may include a metal foil which is disposed to the second surface.

Method for producing semiconductor device and semiconductor device

A semiconductor device in which chips are resin-molded, including: frames having front and back surfaces and die pads; power chips mounted on the surfaces of the die pads; an insulation resin sheet having a first and a second surfaces which are opposed against each other, the resin sheet being disposed such that the back surfaces of the die pads contact the first surface of the resin sheet; and a mold resin applied on the first surface of the resin sheet so as to seal up the power chips. The thermal conductivity of the resin sheet is larger than that of the mold resin.

Semiconductor device and method for producing the same

In a semiconductor device (), semiconductor elements () and () are mounted on a lead frame () having leads (). The semiconductor elements () and () are connected with the leads () by metallic wires () and (). The semiconductor device () also has a heat sink (). The members () to () are sealed with a plastic package (). The leads () are exposed outward. Each of the end leads () to () has a wide first lead portion, a narrow second lead portion, a third lead portion to be inserted into an external substrate, and a protruding gap-controlling portion () for keeping the gap between the semiconductor device () and the external substrate constant. Because the heat resistance from the leads () to the plastic package () increases, the temperature-rise property of the lead is improved so that the solderability is improved.

Semiconductor device and semiconductor assembly module with a gap-controlling lead structure

Growing community of inventors

Tokyo, Japan

Hisashi Kawafuji