Nec Corporation

Japan Aviation Electronics Industry, Limited

Other

Toybox Corporation

Olympus Corporation

Hisashi Ishida

Osamu Hashiguchi

Kazuomi Sato

Masahiro Yamauchi

Yoshinori Mizusawa

Masahiro Yamada

Hiroyuki Tsuzuki

Toshihiko Maeda

Masashi Ogawa

Kazuki Saito

Manabu Kusumoto

Shinichi Hasegawa

Kenichiro Fukushi

Takeo Nozaki

Shin Kamiyamane

Kohji Kimbara

Ken Morishita

Tatsuya Matsuzaki

Koji Higuchi

Yoshio Kameda

Yoshiaki Takemoto

Sunao Sekiguchi

Masashi Kawakami

Chihiro Migita

Tadashi Ookoba

Chenpin Hsu

A ground reaction force load difference calculation unit configured to calculate a ground reaction force load difference that is an amount of a load relief for a user, on the basis of a first measured value that a weight, based on a weight of the user and a weight of the load reduction device that reduces a load on the user and has a mechanism that holds luggage and is at least worn by the user, is transmitted to a ground contact surface and of a second measured value that a weight based on the weight of the user is transmitted to the ground contact surface; and a torque control unit configured to control, on the basis of the ground reaction force load difference, torque that is output by the load reduction device to reduce the load on the user at an joint of each leg of the user.

Load reduction device, load reduction method, and storage medium storing program

Provided is to determine a walking state when a target person uses a stick. A walking state determination device according to an embodiment of the present invention includes: an acquisition unit that acquires feature information indicating a feature of a motion of a target person when using a stick, based on first measurement data acquired from a first sensor installed at the stick and second measurement data acquired from a second sensor installed at the target person; and a determination unit that determines a walking state of the target person, based on the acquired feature information.

Walking state determination device, walking state determination system, walking state determination method, and storage medium

Provided are a reference scale and dimension measurement system that make it possible to maintain accurate measurement even if the reference scale is not disposed or projected on a measurement surface. A dimension measurement device according to the present invention is provided with: a reference scale extraction means for extracting, from photographed image data including a reference scale that includes a film that has a pattern for displaying a length reference formed on the surface thereof and a lens that is in contact with the film, an image in which an image of the length reference is formed on the basis of the relationship between a pattern function expressing the length reference projected onto the lens according to variation in a prescribed angle between the reference scale and the optical axis of a photography device and an image formation color function indicating the image of the length reference formed on the imaging device; an object of measurement extraction means for extracting an object of measurement image from photographed image data including the reference scale; and a dimension calculation means for calculating a dimension of the object of measurement on the basis of a dimension of the image in which the image of the length reference is formed and the image of the object of measurement.

Dimension measurement device, dimension measurement system, and dimension measurement method

A design support device having a permissible power supply fluctuation deriving unit and a target impedance deriving unit. The permissible power supply fluctuation deriving unit derives the fluctuation in the power supply voltage that is permissible on the basis of jitter-voltage correlation information, which indicates the correlation between the power supply voltage fluctuation generated in an I/O buffer and the jitter generated by the power supply voltage fluctuations, and jitter constraint information, which is for stably transmitting a signal, for the generated jitter. The target impedance deriving unit derives a target impedance in the permissible range of impedance for a power supply circuit, on the basis of information on the signal operating current flowing through the power supply circuit of the I/O buffer, and the power supply voltage fluctuation.

Support device, design support method, and program

A method of manufacturing a semiconductor substrate includes a device-forming process of forming a plurality of device areas in a substrate section, a first wiring process of forming circuit wirings connected to the plurality of device areas, an electrode pad-forming process of forming a plurality of electrode pads, a second wiring process of forming a potential adjustment wiring electrically connecting at least a part of the electrode pads, an electrode-forming process of forming electrode bodies on the electrode pads by electroless plating after the second wiring process, and a potential adjustment-releasing process of releasing a connection by the potential adjustment wiring after the electrode-forming process.

Semiconductor substrate and manufacturing method thereof

Provided are an EMI characteristic derivation unit which derives an EMI characteristic radiated from a cable based on design information of a circuit board connected with the cable; a determination standard database which stores an EMI tolerance condition which is a tolerance condition for the EMI characteristic; an EMI condition determination unit which determines whether the EMI characteristic satisfies the EMI tolerance condition; an improvement effect database which stores a modification guideline to modify a configuration of the circuit board necessary to satisfy the EMI tolerance condition when the EMI characteristic does not satisfy the EMI tolerance condition and an improvement effect corresponding to the modification guideline; a restriction item database which stores a restriction item applied when the configuration of the board is modified; and a configuration modification unit which performs the configuration modification of the board in accordance with the modification guideline and the restriction item.

Board design method and board design device

To specify high-risk error positions in consideration of effects of electromagnetic noise flowing through a printed wiring board. A design rule check system () includes a pattern information acquisition unit () for acquiring a layout pattern of a board to be checked, a design rule check unit () for carrying out a design rule check on the layout pattern, a current calculation unit () for calculating distribution of noise current values on the board based on the layout pattern, a weighting unit () for adding a weight to a result of the design rule check according to the magnitude of the noise current values calculated by the current calculation unit () and corresponding to each error position detected through the design rule check, and an error information generation unit () which generates information indicating a risk level of each error position based on the weight.

Rule check system, method, and non-transitory computer readable medium storing presentation program

The present invention provides a wiring structure that easily achieves a wiring part having a three-dimensional shape with high connection reliability and high signal quality. A wiring structure () according to the present invention includes one or a plurality of cables (), a fiber () forming a mesh-like braiding fabric together with the cable (), cable connectors () formed at ends of the cable (), and modules () connected to the cable connectors (), the modules receiving or outputting signals through the cable.

Wiring structure, cable, and method of manufacturing wiring structure

A first interconnect substrate includes a first conductor pattern. A second interconnect substrate includes a second conductor pattern. At least a portion of the second conductor pattern is formed in a region opposite the first conductor pattern. At least either the first conductor pattern or the second conductor pattern has a repeated structure. The first conductor pattern and the second conductor pattern constitute at least a portion of an electromagnetic band gap (EBG) structure.

Electronic device and noise suppression method

Leakage of electromagnetic noise from a wiring substrate is suppressed. A wiring substrate () includes a multilayered wiring layer, a structure () of a conductor, and an electromagnetic wave absorber (). An electronic component () which is an example of an electromagnetic noise generation source is mounted on the wiring substrate (). The electronic component () has a high-frequency circuit. The structure () is formed using the multilayered wiring layer, and is arranged so as to enclose the electronic component () in plan view with an opening () in the enclosure. The electromagnetic wave absorber () is arranged so as to cover the opening ().

Wiring substrate and electronic device

A power supply circuit design system according to an exemplary aspect of the invention includes: a power supply voltage fluctuation deriving means for deriving a power supply voltage fluctuation characteristic as a voltage fluctuation characteristic in a semiconductor integrated circuit on the basis of design information about a power supply circuit for connecting the semiconductor integrated circuit and other components mounted on a substrate; a determination reference database including a power supply voltage fluctuation condition as a condition for which the power supply voltage fluctuation characteristic is allowed in the power supply circuit, and a change indicator for at least one of a circuit structure and operation of the semiconductor integrated circuit; a power supply voltage fluctuation determination means for comparing the power supply voltage fluctuation characteristic and the power supply voltage fluctuation condition, and determining whether the power supply voltage fluctuation characteristic satisfies the power supply voltage fluctuation condition; and a circuit structure changing means for changing at least one of the structure and the operation of the semiconductor integrated circuit in accordance with the change indicator if the power supply voltage fluctuation characteristic does not satisfy the power supply voltage fluctuation condition, and outputting design information about the changed semiconductor integrated circuit to the power supply voltage fluctuation deriving means; wherein the change indicator does not entail a change in size of the semiconductor integrated circuit.

Power supply circuit design system and power supply circuit design method

When soldering is performed, heat transferred from through holeis caused to bypass a mesh-like copper foil region between non-copper-foil regions and thus the transfer of heat to a solid pattern region around thermal landis delayed. Signal wiringsand signal wiringsare formed along the arrangement directions of non-copper-foil regionsrespectively keeping a predetermined spacing between them and disposed to overlap copper foil regions, thus ensuring a current return path by means of opposing ground layer

Printed wiring board including a thermal land for supressing heat dissipation

A computer system includes a rack, a computer module and an interface-dedicated module to be mounted therein, and an intra-rack management module. The rack has a rear panel for power supply to and signal connection among modules, and the modules permit plug-in mounting onto the rear panel of the rack. The computer module has behind the computer a dedicated adapter which makes possible plug-in mounting of the computer onto the rack and coordinates signals between the computer and the rear panel.

Computer system

In a cable connector used for connecting cables () having a plurality of wires, cable-side insulators () each arraying and retaining the wires in one plane are made attachable/detachable relative to a base insulator () retaining contacts. The cable-side insulators connect the wires to the contacts when attached to the base insulator. The base insulator has a pair of base guide portions () extending while confronting each other. The cable-side insulators each have a pair of cover guide portions () of which movement is guided by the base guide portions. At least either of the base guide portions and the cover guide portions have projection portions that bring both of them mutually into a press-fitted relation in a cable connected state.

Cable connector

A card-mounting rack for electronic part-mounting cards is disclosed by which a housing of a rack or the like produced in accordance with standard specifications can be used to mount a plurality of large cards in high density therein to achieve overall densification and miniaturization of a system such as a computer system. Cooling fans are provided on a front and rear faces of a housing of a rack. A mother board is horizontally placed at the center of the inside of the housing. A plurality of cards are mounted perpendicularly on top and bottom faces of the mother board using gondolas and driving mechanisms having a function for moving the cards upwardly or downwardly through a plurality of connector provided on the top and bottom faces of the motherboard. Further, spacers for stabilizing the cards are inserted on rear faces of the cards.

Growing community of inventors

Tokyo, Japan

Hisashi Ishida