Tdk Corporation

Tokyo Denki Kagaku Kogyo Kabushiki Kaisha

Hisashi Fujita

Hiroshi Yagi

Yoshio Harada

Sho Masuzima

Tetsuo Takahashi

Kenichi Takahashi

Kotaro Harigane

Yoshinobu Taguchi

Keiichi Ihara

Morikazu Kamoshida

A process for mounting chip type circuit elements on printed circuit boards and apparatus therefor are capable of eliminating the necessity for arranging an X-Y table, thereby to simplify the structure of the apparatus, and decreasing the time required to mount one circuit element on a printed circuit board. Chip type circuit elements are sucked up by a plurality of suction pins arranged in each mounting head, transferred to a centering and turning section and then progressively mounted on a printed circuit board. The mounting head is adapted to carry out the reciprocating movement in the X-direction a plurality of times while it carries out the reciprocating movement in the Y-direction one time.

Process for mounting chip type circuit elements on printed circuit

A simplified apparatus for automatically inserting electronic components of different forms into printed circuitboards successively conveyed along a travel path which extends along a horizontal plane includes a feed mechanism for separately and simultaneously feeding different pluralities of electronic components of different forms to a pallet operative for separately and simultaneously receiving and conveying the electronic components to an inserting device operative for separately and simultaneously inserting the electronic components into successive printed circuitboards, each board in its turn.

Apparatus for inserting electronic components into printed circuitboards

An apparatus for automatically mounting chip-type circuit elements on a substrate for a printed circuit board is disclosed which is capable of overcoming the problem of suction failure and wrong posture of a circuit element to efficiently carry out the mounting operation of the elements on a substrate. The automatic mounting apparatus includes a detecting device for detecting a defect such as a failure in suction of a circuit element by a mounting head and/or the wrong posture of a circuit element sucked up and a rotating disk controllably actuated to allow a mounting head other than that relating to the defect to suck up a circuit element of the same kind from tape feeders and mount it on the substrate after the detecting device detects the defect.

Apparatus for automatically mounting chip-type circuit elements on

A process and apparatus for the manufacture of a continuous web of parallel lead electronic components is provided. Wire for the leads of the components is straightened, cut into uniform predetermined lengths, formed into a U-shaped leadwire and fed onto a continuous moving support band. The parallel leads of the U-shaped lead wires are secured to the support band by adhesive tape at the same time the spacing between the parallel leads is controlled to insure dimensional accuracy. The parallel leads of the open end of the formed lead wires are formed with a cross-over portion and an electronic component element is connected to the formed end.

Process and apparatus for manufacture of parallel lead electronic

A machine for processing and securing parallel lead electronic circuit elements into lead receiving openings formed in a printed circuit board is provided. The machine includes a supply assembly for selectively supplying one group of a plurality of distinct groups of parallel lead electronic circuit elements, the supply assembly including a selecting sub-assembly for selecting one of the circuit elements from the selected group circuit elements to be supplied. A transfer assembly includes a chuck for receiving the supplied circuit elements and displacing same to a release position. An insert assembly is adapted to effect release of the circuit elements when the chuck is displaced to a release position and includes a holding sub-assembly for receiving each circuit element released by the chuck at the release position and a plunger sub-assembly adapted to engage the circuit elements at the release position and displace the circuit elements from the release position to an inserted position. A board handling assembly disposes the receiving openings in the printed board in alignment with the circuit elements so that the parallel leads each circuit element are received in the appropriate receiving openings when same are displaced to the inserted position.

Growing community of inventors

Tokyo, Japan

Hisashi Fujita