Hitachi, Ltd.

Hisashi Endou

Hiroshi Yoshikawa

Toshihiro Yamada

Nobuhiro Kakeno

Ryoji Nakagawa

Takashi Ogawa

Junichi Sakano

Mitsuteru Inoue

Kimihisa Furukawa

Hiroyuki Takagi

Masanori Miyagi

Masanori Kitaoka

Taichi Goto

Yasunori Hama

Hideya Isaka

Provided is a welding management system that appropriately manages welding. The welding management system () includes a plurality of local magnetic sensors (to) provided around a target joining position (K) and a correction magnetic sensor () curved to surround the target joining position (K). A data processing unit () generates information of a joining state of the target joining position (K) based on a difference between a detection value of each of the plurality of the local magnetic sensors (to) and a detection value of the correction magnetic sensor ().

Welding management system

A manufacturing monitoring assistance device includes: a model creation unit creating a computation model when a product as a sample is normal, based on a three-dimensional form acquired from the product; a simulation unit creating a corrective computation model when the product is abnormal, by adding a sample of an abnormal portion in the product to the created computation model, and performing a simulation on each of the computation model and the corrective computation model; and a monitoring method determination unit determining a method for monitoring a manufacturing process for the product, based on an abnormality index being a difference between an output from a sensor as a result of the simulation performed on the computation model and an output from a sensor as a result of the simulation performed on the corrective computation model, and causing an output device to display the determined method and the abnormality index.

Manufacturing monitoring assistance device, manufacturing monitoring assistance method, and manufacturing monitoring assistance program

The disclosure provides a joining process line monitoring system capable of preventing joining quality deterioration and operation delay. A joining process line monitoring systemincludes a joining phenomenon data acquisition partconfigured to acquire a joining phenomenon of a joining subject member as phenomenon data; an operation state data acquisition partconfigured to acquire a joining operation state of the joining subject member as operation state data; an evaluation data calculation unitconfigured to perform time synchronization of the acquired phenomenon data and the acquired operation state data, and associate the acquired phenomenon data and the acquired operation state data with each joining operation location, so as to calculate evaluation data; a difference data extraction unitconfigured to extract a difference between the evaluation data and reference data set in advance as difference data; an abnormal location determination unitthat determines that a portion having a large difference from the joining phenomenon is an abnormal location; and a presentation unitconfigured to present the abnormal location of a joining portion of the joining subject member based on the difference data.

Joining process line monitoring system

There are provided a welding monitoring system which can multidimensionally monitor a welding portion with high accuracy and a monitoring method thereof, by using a relatively simple configuration. There is provided a welding monitoring system which monitors a subject, including: a mechanical portion; and an imaging portion, in which the mechanical portion includes a transport arm which transports the subject, a subject holding portion which holds the subject, and an energizing device which causes welding with respect to the subject to be performed, and in which the imaging portion includes imaging means for obtaining imaging data of the subject, a data recording portion which records the imaging data, an analyzing portion which extracts predetermined characteristics from the imaging data, a comparison determination portion which compares the extracted characteristics and normal characteristics to each other to determine the presence or absence of abnormality, and a determination result output portion which outputs a determination result by the comparison determination portion.

Welding monitoring system and welding monitoring method

A defect inspection device configured to measure a surface shape of an inspection target using light applied to the inspection target via a spatial light phase modulator based on an interference state of reflected light from the inspection target obtained via the spatial light phase modulator, to measure magnetic field distribution of a surface of the inspection target magnetized by an excitation device for magnetizing the inspection target using light applied to the inspection target via the spatial light phase modulator based on an interference state of reflected light from the inspection target obtained via the spatial light phase modulator, and to separate data of a magnetic field specific portion which exists on the surface of the inspection target from magnetic field distribution data which is a measurement result of magnetic field distribution of the inspection target based on surface shape data which is a measurement result of the surface shape of the inspection target, to suppress deterioration of measurement accuracy of magnetic field distribution generated by the surface shape of the inspection target and to improve defect detection accuracy.

Defect inspection device and defect inspection method

A diagnostic system for a power converter which includes a semiconductor device, and which performs a switching operation between conduction and interruption of the principal current flowing through a main circuit. The diagnostic system includes a current change amount calculation circuit for obtaining numeric data which reflects a current change amount of the principal current per unit time, a determination circuit for determining a state of the power converter by comparing the numeric data with a reference value, and an output circuit for outputting a determination result of the determination circuit.

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Tokyo, Japan

Hisashi Endou