Toyoda Gosei Co., Ltd.

Showa Denko K.k.

Hisao Sato

Katsuki Kusunoki

Shunsuke Teranishi

Hisayuki Miki

Hitoshi Takeda

A semiconductor light emitting element includes: an n-type cladding layer containing n-type impurities (Si); a light emitting layer laminated on the n-type cladding layer; and a semiconductor layer containing a p-type cladding layer containing p-type impurities (Mg) and laminated on the light emitting layer. The light emitting layer has a multiple quantum well structure including first to fifth barrier layers and first to fourth well layers, and one well layer is sandwiched by two barrier layers. The thickness of the p-type cladding layeris set at less than 3-times the thickness of each of the first to fourth well layer.

Semiconductor light emitting element and light emitting device

A semiconductor light emitting element includes an n-type semiconductor layer containing n-type impurities, a light emitting layer stacked on the n-type semiconductor layer, and a p-type semiconductor layer stacked on the light emitting layer and containing p-type impurities. The light emitting layer includes three or more well layers, and four or more barrier layers composed of a group-III nitride semiconductor having a larger band gap than that of the well layers, and each of the three or more well layers is sandwiched from both sides by neighboring two of the barrier layers. The three or more well layers include plural n-side well layers each having a first thickness to emit light of a common wavelength, and one or plural p-side well layers each having a second thickness larger than the first thickness and having a different composition from the n-side well layers to emit light of the common wavelength.

A semiconductor light emitting element includes: an n-type semiconductor layer; a light emitting layer alternately laminating plural barrier layers and plural well layers; and a p-type semiconductor layer, wherein the light emitting layer includes three or more well layers and four or more barrier layers, each well layer being sandwiched by the barrier layers, one barrier layer contacting the n-type semiconductor layer, and another barrier layer contacting the p-type semiconductor layer, the well layers include plural n-side well layers from the n-type semiconductor layer side and one p-side well layer on the p-type semiconductor layer side, and a V-shaped concave portion including inclined surfaces is generated in the light emitting layer, and in at least one of the n-side well layers, a concentration of atoms of In on the inclined surface is not more than 50% of a concentration of atoms of In in the n-side well layer.

Semiconductor light emitting element and method of manufacturing semiconductor light emitting element

While maintaining unity of wavelength of light emitted from a semiconductor light emitting element, decrease of light emission efficiency with an increase in environmental temperature is suppressed. A semiconductor light-emitting element includes: an n-cladding layer; a light emitting layer laminated on the n-cladding layer; and a p-type semiconductor layer laminated on the light emitting layer. The light emitting layer includes a first barrier layer to an eighth barrier layer and a first well layer to a seventh well layer, and a single well layer is sandwiched by two barrier layers. The first well layer to the fifth well layer have a common standard well thickness and a common composition, and the sixth well layer and the seventh well layer are set at a maximum well thickness larger than the common standard well thickness and have a composition whose band gap energy is larger than that of the common composition.

Semiconductor light-emitting element and light-emitting device

In a semiconductor light emitting element outputting light indicating green color by using a group III nitride semiconductor, light emission output is improved. A semiconductor light emitting element includes: an n-type cladding layer containing n-type impurities (Si); a light emitting layer laminated on the n-type cladding layer; and a p-type cladding layer containing p-type impurities and laminated on the light emitting layer. The light emitting layer has a barrier layer including first to fifth barrier layers and a well layer including first to fourth well layers, and has a multiple quantum well structure to sandwich one well layer by two barrier layers. The light emitting layer is configured such that the first to fourth well layers are set to have a composition to emit green light, and the first barrier layer is doped with n-type impurities, whereas the other barrier layers are not doped with n-type impurities.

An object of the present invention is to provide a method for producing a gallium nitride-based compound semiconductor multilayer structure useful for the production of a gallium nitride-based compound semiconductor light-emitting device which can ensure that the operating voltage is reduced, the light emission output is good and the light emission output is less changed due to aging. The inventive production method of a gallium nitride-based compound semiconductor multilayer structure comprises a substrate having thereon an n-type semiconductor layer, a light-emitting layer and a p-type semiconductor layer, the light-emitting layer being disposed between the n-type semiconductor layer and the p-type semiconductor layer, and the light-emitting layer having a multiple quantum well structure formed by alternately stacking a well layer and a barrier layer, wherein at least one well layer has a non-uniform thickness, at least a part of the barrier layer is grown at a higher temperature than the well layer, and the temperature difference between each growth temperature of the well layer, the barrier layer and the p-type semiconductor layer is adjusted to be in a specific range.

Production method of gallium nitride-based compound semiconductor multilayer structure

The object of the present invention is to provide a gallium nitride-based compound semiconductor multilayer structure useful for manufacturing a gallium nitride-based compound semiconductor light-emitting device which requires a low operating voltage and from which a good emission output can be obtained. The present gallium nitride-based compound semiconductor multilayer structure comprises a substrate having thereon an n-type layer, a light-emitting layer and a p-type layer, the light-emitting layer having a multiple quantum well structure in which a well layer and a barrier layer are alternately stacked repeatedly and the light-emitting layer being provided between the n-type layer and the p-type layer, wherein the well layers consisting of the multiple quantum well structure comprise a well layer having an ununiform thickness and a well layer having a uniform thickness.

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Ichihara, Japan

Hisao Sato