Fujitsu Corporation

Fujitsu Media Devices Limited

Other

Taiyo Yuden Co., Ltd.

Drnc Holdings, Inc.

Hisao Okuda

Osamu Tsuboi

Yoshihiro Mizuno

Norinao Kouma

Hiromitsu Soneda

Satoshi Ueda

Ippei Sawaki

Tsuyoshi Matsumoto

Yoshitaka Nakamura

Fumio Yamagishi

Xiaoyu Mi

Mi Xiaoyu

Takeo Takahashi

Tadashi Nakatani

Takashi Katsuki

Masafumi Iwaki

There is provided an electric device including a base member, a beam elastically deformable to bend upward and having an outline partially defined by a slit formed in the base member, a conductive pattern provided on a top surface of the beam, a contact electrode provided above the conductive pattern, the contact electrode coming into contact with the conductive pattern, and a bridge electrode elastically deformable, the bridge electrode connecting the conductive pattern and a portion of the base member outside the outline.

Electric device and method of manufacturing the same

A micro movable device includes: a micro movable substrate in which a micro movable unit is formed, the micro movable unit including a frame, a movable part, and a coupling part for coupling the frame and the movable part to define an axial center of rotation of the movable part; a supporting substrate; and a reinforced fixed part provided between the frame and the supporting substrate, and including a first spacer that joins the frame to the supporting substrate and an adhesive part that covers the first spacer and joins the frame to the supporting substrate, wherein the frame includes a first area facing the movable part in a direction of extent of the axial center, and a second area different from the first area, and the reinforced fixed part is bonded to the second area of the frame.

Micro movable device and optical switching apparatus

An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.

Integrated electronic device and method of making the same

A microstructure comprises a laminate structure having a first conductor, a second conductor, and an intervening insulator located between the first and the second conductors. The first conductor includes opposite faces in relation to the second conductor, side faces, and edge parts which form the boundaries of the aforementioned opposite faces and side faces. The second conductor includes an extended face extending beyond the edge parts exceeding the first conductor. The insulation film includes an area covering at least part of an edge part and/or at least part of a side face.

Microstructure and microstructure manufacture method

A method for manufacturing a micro movable element includes: forming a movable section, a frame, and a connecting section connecting the movable section with the frame on a substrate; bonding a film to a surface of the substrate in forming the movable section, the frame, and the connecting section; and patterning the film to form a support structure being bridged between the movable section and the frame.

Method for manufacturing micro movable element

A micro-oscillation element facilitates adjusting the natural frequency relevant to the oscillating motion of the oscillating portion. The micro-oscillation element includes, for example, an oscillating portion, a frame, and a link portion that connects the oscillating portion and the frame. The link portion defines the oscillation axial center of oscillating motion of the oscillating portion with respect to the frame. The oscillating portion includes a main oscillating body, and a weight portion attached to the main oscillating body. The weight portion is movable in a direction intersecting the oscillation axial center.

Micro-oscillation element with adjustable resonance frequency of oscillating portion

A packaged device includes a package having an inner surface defining a closed internal space, a device chip fixed to the package in the internal space, and a parylene film covering at least a part of the inner surface of the package and/or at least a part of a surface of the device chip.

Packaged device and method of manufacturing the same

A micro-oscillation element includes a base frame, an oscillating portion, and a link portion connecting the base frame and the oscillating portion to each other. The oscillating portion has a movable functional portion, a first driving electrode connected to the movable functional portion, and a weight portion joined to the first driving electrode. The link portion defines an axis of the oscillating motion of the oscillating portion. The second driving electrode, fixed to the base frame, generates driving force for the oscillating motion in cooperation with the first driving electrode.

Micro-oscillation element provided with weight portion, and array utilizing the same

A micro movable element including a movable portion; first and second driving electrodes; first and second conductor portions electrically connected to the first and second driving electrodes, respectively; an intermediate insulating portion disposed between the first conductor portion and the second conductor portion; and a partly laminated structure portion including the first conductor portion, the intermediate insulating portion and the second conductor portion, wherein the first conductor portion has an opposed face making contact with the intermediate insulating portion, a side face adjacent to the opposed face and an edge portion forming the boundary between the opposed face and the side face, part of the edge portion opposed to the second conductor portion is covered with an insulating film, and parts of the first and second driving electrodes are not covered with an insulating film.

Micro movable element

A micro oscillating device includes a first frame; an oscillating portion; a first twist coupling portion and a second twist coupling portion coupling the first frame and the oscillating portion to define a first shaft center of an oscillating operation of the oscillating portion; a second frame including a support base and an arm portion extended from the support base toward the oscillating portion; and a third twist coupling portion and a fourth twist coupling portion coupling the second frame and the first frame to define a second shaft center of an oscillating operation of the first frame, wherein the third twist coupling portion is coupled to the first frame and the arm portion between the oscillating portion and the support base, and the fourth twist coupling portion is coupled to the first frame and the support base or the arm portion between the oscillating portion and the support base.

Micro oscillating device

A micro movable device suitable for suppressing deterioration of driving characteristics, and a micro movable device array including such a micro movable device are provided. The micro movable device (X) of the present invention includes a movable portion including a first driving electrode, a second driving electrode for generating electrostatic attraction between the first driving electrode and the second driving electrode, a first conductor portion () electrically connected to the first driving electrode, a second conductor portion () electrically connected to the second driving electrode, and a third conductor portion () which is not electrically connected to the first and the second driving electrodes and which is bonded to the first conductor portion () via an insulating film () and bonded to the second conductor portion () via the insulating film ().

Growing community of inventors

Kawasaki, Japan

Hisao Okuda