Asahi Kasei Kogyo Kabushiki Kaisha

Asahi Kasei Kabushiki Kaisha

Asahi Kasei Life & Living Corporation

Hisao Koike

Akihiko Ikeda

Toshioki Hane

Masayuki Sukigara

Mitsuyoshi Itada

Michihiro Yatsuzuka

Takeshi Arai

Yoshiaki Hamada

The present invention provides a biaxially oriented film of a polylactic acid resin that is suitable for films for bags and packaging films for various windows, particularly films for outlook window envelopes. The film is biodegradable and, as films for outlook window envelopes, is superior in the coating adaptability for an antistatic agent, a lubricant and an antiblocking agent or the like and in the high-speed cutting property. The present invention discloses a biaxially oriented film of a polylactic acid resin comprising not less than 50% by weight of a polylactic acid resin, which has a storage modulus E'at 80&#xb0; C. within the range from 10 MPa to 3,000 MPa, as determined by the test method for temperature dependency of dynamic viscoelasticity, in accordance with JIS K7198 (method A); a heat shrinkage of not higher than 10%, upon heating at 80&#xb0; C. for 10 seconds; and a tear strength in the width direction (TD direction) of the film of 10 to 200 mN, as determined in accordance with JIS K7128 (method B).

Biaxially oriented polylactic acid-based resin films

Polishing pad and polisher

The present invention relates to an expanded product comprising a thermoplastic fluroine type resin which does not have a cross-linking structure and has an expansion ratio of between 4-fold and 30-fold and a closed cell percentage of 40% or more. The expanded product contains at least one interface comprising layers having different cell densities and has a distribution index (Sc) and a coefficient of variation (Cv) of the maximum diameter of an open cell present at an optional cross section of each layer of 0&lt;Sc.ltoreq.6 and 0&lt;Cv.ltoreq.1, respectively, which are represented by the following equations:

Expanded fluorine type resin products and a preparation process thereof

Growing community of inventors

Kameyama, Japan

Hisao Koike