Kabushiki Kaisha Toshiba

Toshiba Electronic Devices & Storage Corporation

Hisao Ichijo

Syotaro Ono

Hiroaki Yamashita

Hideto Sugawara

Hiroshi Ohta

Hideyuki Ura

Masahiro Shimura

Takafumi Koumoto

A semiconductor device includes a semiconductor part including first to fifth layers; an electrode on a front surface of the semiconductor part; first and second control electrodes between the semiconductor part and the electrode. The first layer includes first and second portions alternately arranged along the front surface of the semiconductor part. The second layer is positioned between the first and second portions of the first layer. The first and second control electrodes are placed at boundaries of the first and second portions and the second layer, respectively. The third layer is provided between the second electrode and the first and second portions of the first layer. The fourth and fifth layers are selectively provided between the third layer and the second electrode. The first control electrode is opposed to the first, third and fourth layers. The second control electrode is opposed to the first, third and fifth layers.

Semiconductor device and method for controlling same

According to one embodiment, a semiconductor device includes first and second electrodes, first, second, third, fourth, fifth, sixth and seventh semiconductor regions, and a gate electrode. The first semiconductor region is provided on the first electrode. The second semiconductor region is provided on a portion of the first semiconductor region. The third semiconductor region is provided on another portion of the first semiconductor region. The fourth semiconductor region is provided in at least a portion between the first and third semiconductor regions. The fifth semiconductor region is provided between the first and fourth semiconductor regions. The sixth semiconductor region is provided on the third semiconductor region. The seventh semiconductor region is provided selectively on the sixth semiconductor region. The gate electrode opposes the second, sixth, and seventh semiconductor regions. The second electrode is provided on the sixth and seventh semiconductor regions.

Semiconductor device

A semiconductor device includes a semiconductor body, first and second electrodes, and a control electrode. The semiconductor body includes first to fourth semiconductor layers. The first electrode is provided on a front surface of the semiconductor body. The second electrode is provided on a back surface of the semiconductor body. The control electrode is provided between the semiconductor body and the first electrode. The second semiconductor layer is positioned between a portion and other portion of the first semiconductor layer in a first direction directed along the front surface. The third semiconductor layer contacts the portion of first semiconductor layer and the second semiconductor layer. The third semiconductor layer includes a first end portion positioned in the portion of the first semiconductor layer and a second end portion positioned in the second semiconductor layer. The fourth semiconductor layer is selectively provided in the second end portion.

A semiconductor device includes a semiconductor body, first to third electrodes provided on the semiconductor body, and a control electrode. The control electrode is provided between the semiconductor body and the first electrode. The semiconductor body includes first to sixth layers. The second layer of a second conductivity type is selectively provided between the first layer of a first conductivity type and the first electrode. The third layer of the first conductivity type is selectively provided between the second layer and the first electrode. The fourth layer of the second conductivity type is provided between the first layer and the second and third electrodes. The fifth layer of the first conductivity type is selectively provided in the fourth layer and electrically connected to the first electrode. The sixth layer of the first conductivity type is provided in the fourth layer, and electrically connected to the third electrode.

A semiconductor device of an embodiment includes a semiconductor layer having a first plane and a second plane, a first semiconductor region of a first conductivity type, a second semiconductor region and a third semiconductor region of a second conductivity type, the first semiconductor region interposed between the third semiconductor region and the second semiconductor region, a first well region of a first conductivity type, a second well region of a first conductivity type separated from the first well region, a first contact region of a first conductivity type, a second contact region of a first conductivity type, a gate electrode provided on the first semiconductor region between the first well region and the second well region, a source electrode having a first region in contact with the first contact region and a second region in contact with the second contact region, and a drain electrode.

A semiconductor device includes a first conductivity type first semiconductor region, a second conductivity type second semiconductor region, a second conductivity type third semiconductor region, a first conductivity type fourth semiconductor region, a gate insulating portion, a gate electrode, and first and second electrodes. The first semiconductor region includes first and second portions. The second semiconductor region includes third and fourth portions. The gate electrode is on the gate insulating portion and over the first semiconductor region and a portion of the third semiconductor region. The first electrode is on, and electrically connected to, the fourth semiconductor region. The second electrode is over the first portion, the third portion, and the gate electrode, and spaced from the first electrode.

Growing community of inventors

Kanazawa, Japan

Hisao Ichijo