Sumitomo Electric Industries, Limited

Hisao Go

Toshiaki Kihara

Kiyoshi Kato

Eiji Tsumura

Akihiro Moto

Mitsutoshi Kamakura

Yutaka Matsumura

Toshio Takagi

Osamu Akita

Kazuhiro Tanida

Shunichi Yoneyama

Akihiko Shioda

Yoshihide Enami

Takashi Kato

Toshio Mizue

Mitsuaki Nishie

Ryugen Yonemura

Norimasa Kushida

Hidenori Takahashi

Keiichi Imamura

The present invention provides an optical transmitting module, in which a laser diode and a termination resistor are provided without sizing up the package thereof and degrading the thermal characteristic due to heat generation by the termination resistor. The transmitting module of the present invention includes the semiconductor laser diode, and the resistor. The laser diode is mounted on the side surface of the block extruding from the base. The resistor is mounted on the flat side portion of the end of the lead. The lead is secured in the through hole provided in the base with seal glass being filled in the gap between the through hole and the lead. In the transmitting module thus configured, the laser diode is thermally isolated from the heat generated by the resistor due to the seal glass.

Can-type optical transmitting module utilizing a laser diode with impedance matching resistors

The present invention relates to an optical transceiver that installs an optical transmitting assembly and an optical receiving assembly both are compact, inexpensive, and capable of operating at a high speed. The optical transmitting assembly of the present invention provides the metal bottom that installs the thermoelectric cooler thereon and the semiconductor optical device is mounted, via the insulating substrate, on the thermoelectric cooler. The first and second multi-layered ceramic substrates are provided to surround the thermoelectric cooler. The DC signal or the low-frequency signal for the thermoelectric cooler and the semiconductor optical device is supplied through the first ceramic substrate, while the high frequency signal for the semiconductor device, with the complementary signal having the opposite phase to the high frequency signal, is provided to the semiconductor device through the inner layer of the second ceramic substrate and the insulating substrate. The semiconductor light-receiving device, which monitors light emitted from the semiconductor light-emitting device, is mounted on the top layer of the second ceramic substrate. Thus, the transmission path for the high frequency signal from the drive circuit installed outside of the transmitting assembly to the light-emitting device becomes substantially linear.

Optical sub-assembly having a thermo-electric cooler and an optical transceiver using the optical sub-assembly

The present invention provides an optical module in which an optical alignment between the light-emitting device and the waveguide device may be simplified. The optical module of the present invention has a waveguide device, first and second lenses, a housing and an optical sub-assembly (OSA) unit. Two lenses optically couple with respective end faces of the waveguide device. The housing encloses the waveguide device, and first and second lenses therein. The OSA unit has a package and a light-emitting device installed in the package. In the present invention, the OSA unit is aligned with the housing such that the light-emitting device is optically coupled with the waveguide device via the first lens.

Optical module having individual housing for an optical processing unit and an optical sub-assembly

The present invention provides an optical transmitting module capable of outputting a signal for precisely controlling bias and modulation current, and a transmitting optical sub-assembly using the same. The optical transmitting module of the invention builds a semiconductor laser diodeand a temperature sensor within a CAN type package. The CAN type package includes a base, a block provided on the base and mounting the laser diode on a side thereof, and a plurality of leads secured to the base. The laser diode is supplied current signal Sthrough one of leads, while the temperature sensor outputs a signal Sthrough the other of leads. The temperature sensor is mounted immediately close to the laser diode, accordingly, capable of monitoring the temperature of the laser diode.

Optical transmitting module having a can type package and providing a temperature sensor therein

The present invention provides an optical transmitting module or optical transmitting sub-assembly in which an inductor for de-coupling the bias circuit of the semiconductor laser diode is built. The laser diode is mounted on the side surface of the block provided on the stem, while the inductor is installed on the lead, which is secured by the stem, such that one electrode of the inductor is in contact to the lead and the other electrode of the inductor is connected to an electrode of the laser diode. The electrode of the laser diode is also connected to the other lead. Thus, the electrode of the laser diode is connected to two leads, one of which is through the inductor.

Optical transmitting module having a de-coupling inductor therein

The present invention relates to a method for manufacturing an optical transceiver that installs an optical transmitting assembly and an optical receiving assembly both are compact, inexpensive, and capable of operating at a high speed. The optical transmitting assembly of the present invention provides the metal bottom that installs the thermoelectric cooler thereon and the semiconductor optical device is mounted, via the insulating substrates, on the thermoelectric cooler. The first and second multi-layered ceramic substrates are provided to surround the thermoelectric cooler. The DC signal or the low-frequency signal for the thermoelectric cooler and the semiconductor optical device is supplied through the first ceramic substrate, while the high frequency signal for the semiconductor device, with the complementary signal having the opposite phase to the high frequency signal, is provided to the semiconductor device through the inner layer of the second ceramic substrate and the insulating substrate. The semiconductor light-receiving device, which monitors light emitted from the semiconductor light-emitting device, is mounted on the top layer of the second ceramic substrate. Thus, the transmission path for the high frequency signal from the drive circuit installed outside of the transmitting assembly to the light-emitting device becomes substantially linear.

Method for manufacturing a transmitting optical sub-assembly with a thermo-electric cooler therein

A light-transmitting module of the present invention includes a light-emitting device such as a laser diode (LD), a transistor for shunting-drive the LD and a CAN type package with a base and an electrically conductive block. The LD and the transistor are mounted on a side of the block in side-by-side arrangement such that the LD substantially positions a center of the package. One of the current terminals of the transistor and one electrode of the LD are connected via the conductive block. The other of the current terminal of the transistor and the other of the electrodes of the LD are connected to one lead, while the control terminal of the transistor is connected to the other lead. Since the present module includes the transistor within the CAN type package, the size thereof may be miniaturized, and the quality of the optical output can be enhanced.

Light-transmitting module containing an driving device in a package

An optical device has a package enclosing an LD and a driver circuit for driving the LD. The package has a laminated ceramic wiring board fixed on the top surface of a bottom plate. A sleeve, which is able to receive a ferrule of an optical connector plug, is attached to the front surface of the package. A flexible heat-dissipating sheet is disposed on the bottom surface of the bottom plate. The sheet dissipates heat generated in the package to the body of the optical module.

Optical device and optical module

An optical module comprises (1) an optical device assembly having an optical device for converting one of optical and electric signals into the other; (2) a circuit board for mounting an electronic device to electrically connect with the optical device; (3) a lead frame having a lead pin, a board mounting part for mounting the circuit board, and a support part which are provided on a reference surface; (4) a holding member having a holding part for grasping and holding the optical device assembly, and a grasping part for grasping the support part of the lead frame; and (5) a resin member for encapsulating the optical device assembly, the circuit board, the holding member, and the lead frame.

Optical module and method of making the same

The light generating module comprises a housing, a semiconductor light emitting device, a first mounting face, a second mounting face, and a lens. The housing comprises a base and an optical window. The base extends along a predetermined plane and is made from material exhibiting a first thermal conductivity. The semiconductor light emitting device is provided in the housing. The first mounting face is made from material exhibiting a thermal conductivity equal to or more than the first thermal conductivity. The second mounting face mounts the semiconductor light emitting device and is made from material exhibiting a thermal conductivity equal to or more than the first thermal conductivity. The lens is provided in the housing. The lens has an installation face mounted on the first mounting face. The lens is used to direct light from the semiconductor light emitting device toward the optical window.

Light generating module

Provided are a lead frame, an optical module, and a method of making the optical module. These can reduce the force applied to a ferrule from an encapsulating die even if the alignment accuracy required in the step of bonding an optical module principal portion mounted with the ferrule onto the lead frame is relaxed. The lead frame has an island portion for mounting the optical module principal portion such that the ferrule is aligned with a predetermined direction; and an island support portion, included within the plane including the lead frame, allowing the island to be displaced in a direction intersecting the predetermined direction.

Lead frame, optical module, and a method of optical module

An optical transceiver comprises a receiver optical sub-module , a transmitter optical sub-module , and a housing to accommodate these modules. The receiver optical sub-module has a light receiving element, and a receiver electronic circuit substrate . The transmitter optical sub-module has a light emitting element, and a transmitter electronic circuit substrate . The housing has a receptacle part with which an optical connector is engaged. The receiver electronic circuit substrate and the transmitter electronic circuit substrate are disposed opposite to each other.

Optical transceiver

In the method of making an optical module in accordance with the present invention, an optical module principal portion is molded by means of a molding die. The molding die has a ferrule accommodating portion f or accommodating a ferrule and a positioning portion which are located on its lead frame-mounting surface. The method of making an optical module comprises the steps of: preparing a lead frame having an alignment portion enabling the positioning with respect to the mold die; preparing the optical module principal portion; aligning the optical module principal portion with the lead frame and securing them to each other by means of a positioning jig so that the ferrule secured to the optical module principal portion meets the ferrule accommodating portion of the molding die; placing the lead frame with the optical module principal portion secured thereto on the molding die; and resin-molding the lead frame and the optical module principal portion by means of the molding die.

Optical module and a method of fabricating the same

An optical module which can reduce its size, and a method of making the same are provided. The optical module has a substrate, a carbon-coated optical fiber, a ferrule, and an optical device. The substrate has first, second, and third regions along an axis, and also has a ferrule support groove in the first region, an optical fiber support groove in the second region, and a device mount portion in the third region. The carbon-coated optical fiber is mounted in the optical fiber support groove. The ferrule covers the side face of the optical fiber and is secured to the ferrule support groove. The optical device is mounted at the device mount portion and is optically coupled to the carbon-coated optical fiber.

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Yokohama, Japan

Hisao Go