Alps Electric Co., Ltd.

Alps Alpine Co., Ltd.

Hisanobu Okawa

Hisayuki Yazawa

Hideki Kamimura

Eiji Umetsu

Chiaki Kera

Hiroshi Ishida

Katsuya Kikuiri

Ayako Otsuka

Toru Takahashi

Toshihiro Kobayashi

Masahiko Ishizone

Kiyoshi Sato

Hiroyuki Morioka

Yasuyuki Hattori

Akira Miyatake

Tetsuya Fukuda

Shuji Yanagi

Yasuhiro Suda

Masaya Yamatani

Atsushi Tondokoro

Takayuki Minagawa

Yoshitaka Uto

Kazushige Sejimo

Shigeaki Yamauchi

Shoji Yoshida

Takuya Adachi

Takashi Nishimizu

Kazuhide Nakayama

Tatsuru Ikarashi

Daisuke Tsuchiya

A load sensor device includes a load sensor that has a pressure receiver, a housing that accommodates the load sensor, an elastic member that receives a load and presses against the load sensor, and a pressing member that is provided between the elastic member and the load sensor. The pressing member has a rigid presser capable of coming into contact with the pressure receiver, and an elastic supporter that supports the rigid presser on the housing. A gap is provided between the rigid presser and the pressure receiver in a state where the load is not applied to the elastic member. The elastic supporter elastically deforms to reduce the gap between the rigid presser and the pressure receiver when the load is applied to the elastic member. The load sensor device further includes a shock absorber capable of alleviating elastic deformation of the elastic supporter.

Load sensor device having shock absorber

A pressure sensor includes a diaphragm on a silicon substrate and a plurality of piezoelectric element areas that change in resistance according the distortion of the diaphragm. The plurality of piezoelectric element areas of the pressure sensor include a first piezoelectric element area, a second piezoelectric element area, a third piezoelectric element area, and a fourth piezoelectric element area. The diaphragm has a maximum deflection area whose stress becomes 80% or more of a maximum stress when distorted by a predetermined pressure. The first piezoelectric element area, the second piezoelectric element area, the third piezoelectric element area, and the fourth piezoelectric element area are disposed in the maximum deflection area.

Pressure sensor

A pressure sensor includes a pressure detecting element; a base material on which the pressure detecting element is mounted; a pad electrode provided on the base material and electrically connected to the pressure detecting element; a ground electrode provided on the base material and spaced from the pad electrode; and a cap having a tubular shape, the cap surrounding a periphery of the pressure detecting element on the base material and being attached to the ground electrode with a conductive adhesive. An inner receiving section is provided between an inner peripheral surface of the cap and a ground-electrode-side end surface of the cap, the inner receiving section thereby preventing excessive spreading of the conductive adhesive. The cap can be attached to the base material with the conductive adhesive without causing excessive spreading of the conductive adhesive.

Pressure sensor with a cap structured with an inner receiving section that prevents excessive spreading of a conductive adhesive

A pressure sensor includes a pressure detection element; a substrate on which the pressure detection element is mounted; and a cap in a tubular shape, the cap being attached to the attachment surface of the substrate with an adhesive, the attachment surface enclosing the periphery of the pressure detection element. An attracting concave part is in the end face of the cap, the end face facing the attachment surface, so as to have an inclined surface the distance of which from the attachment surface is increased in a direction from the outer circumferential surface of the cap toward its inner circumferential surface. Part of the adhesive is embedded in the interior of the attracting concave part.

Pressure sensor having a cap being attached to the substrate surface with an adhesive

A load sensor unit according to an aspect of the present invention includes an operating part movable forward and backward in a first direction; a load sensor that has a pressure receiving part and outputs a signal according to a load received in the first direction by the pressure receiving part; a linking part that has one end part linked to the operating part and an other end part that causes the pressure receiving part to operate and is movable forward and backward in the first direction in synchronization with the operating part; and an elastic member that gives biasing force to the other end part of the linking part and gives an initial load to the pressure receiving part through the other end part. This can prevent a load sensor from being broken by an overload with a simple configuration and fully demonstrate detection accuracy of the load sensor.

Load sensor unit and input device

A waterproof pressure sensor includes a pressure detection element, a cavity package configured to be provided with a recess in which the pressure detection element is mounted and an edge provided around the recess, a frame configured to be attached to the edge of the cavity package and has a surface more smoothed than the edge and an opening, a contact prevention member configured to be attached to the frame, and a pressure introducing hole having a diameter smaller than a diameter of the opening at a position overlapping the opening, and a gel agent configured to be provided in the recess and the opening, in which the gel agent is provided to be separated from an edge of the pressure introducing hole on the frame side.

Waterproof pressure sensor, and manufacturing method and sensor conveyance body for manufacturing waterproof pressure

A sensor package includes a pressure sensor, a computation unit that performs specified computation in accordance with a result of detection performed by the pressure sensor, a lead frame through which a result of computation performed by the computation unit is output to an outside, a main housing that is formed of resin and that holds the lead frame, and a sensor housing that is formed of ceramic and that has an inner space in which the pressure sensor is disposed. The pressure sensor is disposed in the main housing using the sensor housing.

Sensor package

A sensor device includes: a sensor portion having a movable thin film and a detection element configured to output a signal corresponding to displacement of the movable thin film; a frame portion disposed to surround an outside of the sensor portion; a spring portion provided between the frame portion and the sensor portion; and a circuit board including a circuit configured to process the signal output from the detection element, in which the frame portion is laminated on the circuit board, and the sensor portion is cantilevered from the frame portion by the spring portion such that a gap is formed between the sensor portion and the circuit board.

Sensor device

In a pressure detection device which is provided in an intake pressure measurement apparatus, a detection space surrounded by an outer wall portion is formed in a housing, and an inner wall portion is formed integrally in the detection space such that both end portions are connected to the outer wall portion. The inner wall portion has a cylindrical shape, and a sensor storage portion is formed between the inner wall portion and the outer wall portion. In the sensor storage portion, a pressure sensor is disposed in a region with the least influence of thermal stress at a position closer to the inner wall portion than the outer wall portion.

Pressure detection device and intake pressure measurement apparatus using the same

A humidity sensing portion is mounted in a gap between a first opposite member and a second opposite member. Metal joints and dummy joints are provided in the gap between the first opposite member and the second opposite member, and the two opposite members are fixed to each other through the metal joints and the dummy joints. Since only the metal joints and the dummy joints are present in the gap between the two opposite members, gas to be measured is easily introduced into the humidity sensing portion, and the sensing response to the humidity change is improved.

Humidity sensing apparatus

A first sealing layer having a frame-like shape and a first contact layer are formed on a back surface of a frame portion of a sensor substrate. The first contact layer is separated from the first sealing layer, extends through a functional member and an insulation layer, and is electrically connected to the functional member and a first base member. A second sealing layer and a second contact layer are formed on a surface of a wiring substrate. The second sealing layer faces the first sealing layer. The second contact layer is separated from the second sealing layer, extends through the insulation layer, and is electrically connected to the second base member. The sealing layers are eutectically bonded to each other. The contact layers are electrically connected to each other, and thereby the first and second base members and the frame portion have the same potential.

Physical quantity sensor and method of making the same

A semiconductor pressure sensor includes a cavity disposed in one silicon substrate of a SOI substrate having two silicon substrates bonded to each other with an oxide film therebetween and a diaphragm formed from the other silicon substrate and the oxide film, wherein the oxide film, bordering the cavity, of the diaphragm includes an arc-shaped section at the boundary portion to the one silicon substrate defining the inner wall side surface of the cavity, the arc-shaped section having the same width as the width of the cavity at a desired section in the one silicon substrate and reducing the width of the cavity from the boundary portion toward the diaphragm center.

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Tokyo, Japan

Hisanobu Okawa