Asahi Kasei Chemicals Corporation

Hisanao Yamamoto

Hideaki Takahashi

Takayuki Matsuda

Kazuhiro Daikai

Taketoshi Usui

Kazuhiko Yamamoto

A thermosetting resin compositing having an essential component (A) organopolysiloxane containing a compound represented by following general formula (1) or (2) and optical semiconductor peripheral material using the composition. [Herein, in the formulas, Rindependently represents a substituted or non-substituted monovalent hydrocarbon radical with the carbon number of 1 to 10, Rrepresents an epoxy group-containing organic group, Rrepresents Ror R, a independently represents an integer of 2 or more, b independently represents an integer of 0 or more, X represents general formula (3), Y represents -o- or a bivalent hydrocarbon radical with the carbon number of 1 to 6, Z represents following formula (4), Rin the formula independently represents a substituted or non-substituted monovalent hydrocarbon radical with the carbon number of 1 to 10, and c represents an integer of 0 or more.]

Thermosetting resin composition and semiconductor sealing medium

An amine hardener for epoxy resins which comprises an amine adduct (A) and a low-molecular amine compound (B) as major components, wherein the molecular weight distribution of the amine adduct (A), which is defined by the ratio of the weight-average molecular weight to the number-average molecular weight, is 3 or lower and the low-molecular amine compound (B) is contained in an amount of 0.001 to 1 part by mass per 100 parts by mass of the amine adduct (A).

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Tokyo, Japan

Hisanao Yamamoto