Kyocera Corporation

Hisaki Masuda

Takayuki Kimura

Yuko Tanaka

Takayuki Ohyama

Yoshihiro Uemura

Mitsuo Yanagisawa

Hiroyuki Miura

A lid body includes a base containing an alloy of iron and nickel, a first film positioned on a lower surface of the base and containing nickel, and a second film positioned on a lower surface of the first film and containing copper. During welding of the lid body, penetration of crystal grain boundaries of the base by Cu of the second film is reduced by the first film. Therefore, occurrence of cracks in the base is reduced and thus a package with high airtightness can be formed.

Lid body, electronic component accommodation package, and electronic device

A board in an aspect of the present invention includes a substrate, a first film, a first layer, and a second film. The substrate has a first elastic modulus. The first film is at an upper surface of the substrate. The first layer is at a lower surface of the substrate. The first layer has a second elastic modulus lower than the first elastic modulus and has a first thermal expansion coefficient. The second film is at a lower surface of the first layer. The second film includes the same material as the first film and has a second thermal expansion coefficient lower than the first thermal expansion coefficient.

Board and semiconductor apparatus

A package for housing a photosemiconductor element comprises a substrate having a mounting portion on a top surface of which a photosemiconductor element is mounted, a frame attached onto the substrate to surround the mounting portion and having a through hole on a side thereof, a cylindrical fixing member attached around the through hole of the frame and having a space therein for transmitting an optical signal, a light transmitting member attached to the cylindrical fixing member, for clogging the inside of the fixing member and a lid attached onto a top surface of the frame, hermetically sealing the photosemiconductor element. The fixing member is made of an alloy of from 40 to 60 wt % iron and from 40 to 60 wt % nickel. The coefficient of thermal expansion of the fixing member is about 9.5&times;10 /&deg; C. (room temperature to 400&deg; C.), which is close to that of the light transmitting member of amorphous glass, so that no thermal stress caused by the difference in coefficient of thermal expansion occurs in attaching the two. Because there is no thermal stress, which causes the double-refraction of the light excited by the photosemiconductor element, the excited light is received by the optical fiber member without being double-refracted in the light transmitting member, and the transmission efficiency of optical signal is enhanced.

Growing community of inventors

Hikone, Japan

Hisaki Masuda