Denso Ten Limited

Fujitsu Ten Limited

Senju System Technology Co., Ltd.

Hisaki Hayashi

Yasuyuki Watanabe

Noboru Hashimoto

Yasuo Nishioka

Yoshiyuki Andoh

Shigeki Fukaya

Katsuhiro Yoshimura

An application device according to an embodiment includes a liquid nozzle part, an air nozzle part, and an ejection controlling unit. The liquid nozzle part ejects liquid to be applied to an electronic component mounted on a substrate. The air nozzle part ejects air toward the substrate. The air nozzle is concentrically arranged with respect to the liquid nozzle part. The ejection controlling unit ejects the air from the air nozzle part at a timing in synchronization with an ejection timing of the liquid to be applied by the liquid nozzle part.

Application device and application method

A preparation apparatus includes a first tank, a second tank, a preparation tank, and a computer having a hardware processor. The first tank contains a first liquid. The second tank contains a second liquid having a lower viscosity than the first liquid. The preparation tank stirs the first liquid supplied from the first tank and the second liquid supplied from the second tank to prepare a preparation liquid. The hardware processor measures a viscosity of the first liquid based on a supply time required to supply a specified amount of the first liquid at a constant pressure from the first tank to the preparation tank, and supplies an amount of the second liquid to the preparation tank based on the measured viscosity of the first liquid so as to cause the preparation liquid to have a target viscosity.

Preparation apparatus

A soldering device according to an embodiment includes a jet nozzle and a cover. The jet nozzle jets a molten solder. The cover is filled with an inert gas in an inside thereof and has a hole part at a position that corresponds to the jet nozzle. The cover causes the jet nozzle to protrude from the hole part for an application time period when the solder is applied to an application target and houses the jet nozzle in the inside thereof for a waiting time period other than the application time period.

Soldering device and control method for soldering device

There is provided a flux applying method using a flux applying apparatus configured to jet and apply a flux to a target. The flux is supplied to a nozzle of the flux applying apparatus. A gas is applied to a foaming pipe with a porous filter included in the nozzle. The gas is jetted from the porous filter of the foaming pipe to the flux supplied to the nozzle, thereby jetting foamed flux to the target.

Flux applying method and flux applying apparatus

There is provided a flux applying apparatus configured to jet and apply a flux to a target, whereby the flux applying apparatus is capable of rapidly collecting a surplus flux in a sub-tank and returning the same to the main tank for further jetting and applying. In particular, the flux applying apparatus is coupled to a control unit capable of estimating a flux amount trapped in the sub-tank on the basis of a time period for which the flux is to be jetted from the nozzle.

Growing community of inventors

Kobe, Japan

Hisaki Hayashi