Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Hisahiro Tanaka

Matsuo Masuda

Tsuyoshi Tokiwa

Ryota Fujii

Takashi Kubara

Hisashi Tsuji

Masanari Miyamoto

Shinichi Shigenaga

Akitoshi Izumi

Koshi Tanaka

Shinichi Takayama

Yuuji Terashima

Takeshi Fujiyama

Shigeki Ogata

Masanori Ikari

An audio processing device includes an acquisition unit that acquires audio that is picked up by a sound pick-up unit, a detector that detects an audio position of the audio, a determiner that determines whether or not the audio is a speech audio when the audio position is within a privacy protection area, an analyzer that analyzes the speech audio to acquire an emotion value, a converter that converts the speech audio into a substitute sound corresponding to the emotion value, and an output controller that causes an audio output that outputs the audio to output the substitute sound.

Audio processing device, image processing device, microphone array system, and audio processing method

A service monitoring system includes a voice collector that collects a voice of an employee in a predetermined voice collection region, a storage unit that stores service event data including determination conditions for each predetermined service event, terminal operation history data indicating an operation history of an employee on a predetermined business terminal and voice data of the employee in correlation with each other, a detector that detects the service event of the employee based on the service event data and the terminal operation history data, a calculator that calculates a service speech evaluation value corresponding to a predetermined speech keyword on the basis of the voice data of the employee during the service event, and an output that stores the service speech evaluation value in correlation with identification information of the employee, and voice data of the employee specified by a service position and time point of the employee.

Service monitoring system and service monitoring method

A true leaf and a plurality of artificial leaves are attached on a white reference substrate. A first light source radiates a reference beam of 905 nm while sequentially scanning toward the white reference substrate. A second light source radiates a measuring beam of 1550 nm while sequentially scanning toward the white reference substrate. A threshold level setter/water content index detector calculates a relative water content of a true leaf based on the intensity of each reflection light of the reference beam and the measuring beam which are respectively reflected by the true leaf and a plurality of artificial leaves.

Moisture content observation device, moisture content observation method, cultivation device and sample

There is provided an order entry system including: a first microphone that picks up speech regarding order details of a first speaker; a second microphone that picks up speech regarding the order details of a second speaker for checking the order details of the first speaker; a speech recognizer that recognizes the speech regarding the order details of the first speaker which is picked up by the first microphone and the speech regarding the order details of the second speaker which is picked up by the second microphone; and an order data output that displays on a display, a display screen of order data regarding the order details of the first speaker, including a first speech recognition result of the speech regarding the order details of the first speaker and a second speech recognition result of the speech regarding the order details of the second speaker.

Order entry system and order entry method

The present invention has an object to provide a tin-plated film and a method for producing the same, capable of preventing whiskers from being generated and simultaneously preventing the surface of a substrate to be plated, which is not covered with a tin-plated film, from discoloring due to oxidation, by which prevention of whisker generation, suppression of whisker growth, and prevention of discoloring of a substrate to be plated are compatible with simplified operations ensuring excellent productivity. The method is provided with the steps of removing a part of a tin-plated film formed on copper or copper alloy; processing to prevent discoloring of the copper or copper alloy from which the tin-plated film is removed; and applying heat energy to the tin-plated film of the copper or copper alloy which is processed to prevent discoloring.

Tin-plated film and method for producing the same

A tin-silver alloy plating film improved in solderability and flex cracking characteristics is provided by producing it by an electroplating process which uses a current having a pulse waveform of a current passing period of not less than 3 ms and not more than 500 ms and a stopping period of not less than 1 ms and not more than 500 ms with a proviso that the stopping period is equal to or shorter than the passing period.

Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the plating film

A circuit board comprising an insulating substrate, via-holes made in the insulating substrate, and a wiring conductor having at least one layer disposed on the insulating substrate. The circuit board is characterized in that a gold-plated layer of the wiring conductor exposed to the inside of the via-hole is thinner than a gold-plated layer of the wiring conductor exposed to a portion other than the inside of the via-hole in the insulating substrate. A method of manufacturing the circuit board is characterized in that gold electroplating of the wiring conductor is performed with the open-end of the via-hole contacted on a shielding board in a plating bath. The present invention provides a circuit board capable of satisfying the requirements for long-lasting strength of solder ball junction and good wire bonding ability at the same time.

Method of manufacturing a circuit board

Lead frame for semiconductor device, process for producing the same and semiconductor device using the same

The present invention relates to a method for producing a tin-silver alloy plating film having an excellent wettability and improved in solderability and said method comprises a step of heat treating the surface of the tin-silver alloy plating film preferably the heat treating temperature is 70-210&deg; C.

Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the film

A lead frame for a semiconductor device includes a sheet-like body and a Pd coating plated on the sheet-like body. The Pd coating includes Ni in an amount of not more than 2%. In another embodiment, the Pd coating includes Cu in an amount of not more than 0.12%. By virtue of limiting the amount of Ni or Cu to these particular levels, the solderability of the lead frame is remarkably enhanced.

Lead frame for semiconductor device and method of producing same

A lead frame made from Ni, a Ni alloy, Cu, a Cu alloy, Fe or an Fe alloy, comprising an inner lead part with a surface treatment layer of Ag or a Ag-containing alloy and an outer lead part with a surface treatment layer of an alloy containing Ag and Sn, wherein the latter surface treatment layer has a brightness of not less than 0.6 and Sn has the body-centered tetragonal lattice with the crystal orientation indices of from 1.5 to 5 at the (220) plane, not more than 0.9 at the (211) plane and not less than 0.5 at the (200) plane. The surface treatment layer is plated with utilization of a plating solution which contains one or more selected from alkane sulfonic acid, alkanol sulfonic acid and sulfamine acid as the acid component, one or more of tin methane-sulfonate and SnO as a tin salt, and one or more slected from silver methane-sulfonate, Ag O and AgO as a silver salt. The outer lead part may be subjected to a preliminary etching treatment with utilization of a treatment agent of one or more selected from chloric acid, nitric acid and sulfic acid prior to forming the surface treatment layer. The formed surface treatment layer may be treated by a treating agent containing sodium triphosphate.

Semiconductor device with a coating of Pb-free Sn-base solder and manufacturing method therefor

A palladium plating film having excellent soldering characteristics, including excellent solder wettability, high solder wetting speed, and especially the maintenance of these characteristics in a high-temperature atmosphere, is produced by using a palladium plating solution. The palladium plating film can be used, for example, for the plating of electrical and electronic parts. The palladium plating solution used contains a soluble palladium salt and a quaternary compound, and, if necessary, further contains a pyridine derivative or a salt thereof, and optionally further contains at least one compound selected from ammonium chloride, ammonium hydrogenphosphate, ammonium nitrate, ammonium sulfate, ammonium chloride and boric acid or a soluble selenium salt.

Palladium plating solution, palladium plating film formed using the

In a lead frame formed out of at least one metal selected from the group consisting of nickel and nickel alloys, copper and copper alloys and iron and iron alloys, the inner lead part is provided with a surface treatment layer of Ag or an alloy containing silver and the outer lead part is provided at least with a surface treatment layer of an alloy containing silver and tin of the body-centered cubic structure preferentially oriented in the (101) plane and/or the (211) plane. According to the above-mentioned structure, a semiconductor device that uses a lead frame for electronic parts which does not contain lead, one of the environmentally harmful pollutants, has good characteristics including solder wettability and bonding strength and is of low cost and a process for producing the device are provided.

Growing community of inventors

Fukuoka, Japan

Hisahiro Tanaka