Yazaki Corporation

Hisafumi Maruo

Norihito Suzuki

Syunsuke Nagakura

Takahiro Miyakawa

Manabu Ooishi

Masashi Nagao

Masayuki Saito

Satoshi Ishikawa

Masataka Suzuki

Takanori Watanabe

Hiroyuki Ashiya

Yasutaka Nagaoka

Yayoi Maki

Osamu Soda

Masayuki Sato

Shunsuke Nagakura

Hirotoshi Oda

A liquid-level detecting apparatus is provided. The liquid-level detecting apparatus includes a resistance plate with an insulating substrate; conductive segments on the insulating substrate at substantially equal intervals; a resistor mounted on the conductive segments and through which the conductive segments are connected to each other; an conductive sliding arm including a contact part for selectively coming into sliding contact with a portion of the conductive segments; a conducting pattern which is formed between one or more pairs of two adjacent conductive segments to short-circuit the two adjacent conductive segments; and a measuring device which is connected to one of the conductive segments and measures a value based on a portion of the resistor connected between a first segment of the conductive segments contacted by the contact part and the one of the conductive segments connected to the measuring device, thereby detecting a level of the liquid surface.

Liquid-level detecting apparatus

A sliding fluid level-detecting device which is mounted in a fuel tank of a vehicle and detects a remaining amount of a liquid fuel in the tank by sliding, on a plurality of stripes of an electrode formed at an electrode part electrically connecting with a fuel meter, a contact point provided on a slider interlocking with displacement of a float floating on a fluid surface of the liquid fuel, wherein the electrode is formed out of a glass-incorporated silver-palladium alloy where glass is mixed in an amount of 30 to 50 parts by weight per 100 parts by weight of a silver-palladium alloy and the contact point is formed out of a conductive material having a Vickers hardness (Hv) of 190 to 250.

Sliding fluid level-detecting device

In an apparatus for detecting a liquid level, a sliding arm is supported on the resistance plate so as to pivot thereon in accordance with the liquid level. A plurality of first conductive segments is arranged on the resistance plate in a pivoting direction of the sliding arm. Adjacent ones of the first conductive segments are connected by resistive elements respectively. A plurality of second conductive segments are electrically connected to each other, and arranged on the resistance plate in the pivoting direction. A first contact part is provided on the sliding arm, and slides on the first conductive segments in accordance with a pivoting movement of the sliding arm. A second contact part is provided on the sliding arm, and slides on the second conductive segments in accordance with the pivoting movement of the sliding arm. The first conductive segments and the second conductive segments are arranged such that a first timing, at which the first contact part is brought into contact with one of the first conductive segment, is synchronized with a second timing, at which the second contact part is brought into contact with one of the second conductive segments, while a third timing, at which the first contact part is detached from the one first conductive segment, is synchronized with a fourth timing, at which the second contact part is detached from the one second conductive segment.

Apparatus for detecting liquid level

In an apparatus for multiplex communication, a bus line constitutes a bus type network for connecting a plurality of terminal communication equipments. A plug-shaped terminating resistance device is detachably provided at an end of the bus line to reduce reflection noise.

Apparatus for multiplex communication

A chip part ( ) is mounted on bus bars ( ), and connection portions ( ) of the chip part ( ) are soldered to the bus bars ( ), respectively. At this time, recesses ( ) are beforehand formed respectively in soldering lands of the two spaced-apart bus bars each corresponding to a predetermined solder wetting area. The chip part is soldered to the bus bars in such a manner that the connecting portions are spaced apart from inner edges of these recesses, respectively, thereby forming a solder fillet between at least part of each of the recesses and the corresponding connecting portion of the chip part.

Structure of joining chip part to bus bars

A method of adjusting a resistance value of a film resistor. The method includes defining, as a single resistive element, a portion of a resistive film formed over a first linear conductive film formed at a position at which a first resistance value is detected when an electric contact is slid thereto, and a second linear conductive film formed at a position at which a second resistance value is detected when the electric contact is slid thereto. The method also includes trimming a portion of the resistive element at opposite sides of the first linear conductive film in a longitudinal direction substantially perpendicular to the width direction to form first and second trimmed portions; and trimming a portion of the resistive element from an end of the second trimmed portion in the width direction toward the second linear conductive film to form a third trimmed portion.

Method for adjusting a resistance value of a film resistor

Heat radiation packaging structure for an electric part and packaging method thereof

A safety device of an electric circuit is provided, in which a thermal fuse securely prevents an accident from occurring when an overcurrent protector is extraordinarily overheated. The safety device includes: first protective means in an overcurrent protector for protecting the electric circuit from an overcurrent, which generates heat to increase its electrical resistance when an overcurrent flows in the electric circuit, whereby reducing or cutting off the overcurrent; and second protective means including a thermal fuse situated in the vicinity of the overcurrent protector containing: a first electrode having a first conductor pattern connected to the overcurrent protector; a second electrode having a second conductor pattern insulated from the first electrode by a gap; and solder connecting the first and second electrodes and melting by heat from the overcurrent protector so as to split into two parts toward the first and second electrodes. According to the safety device, the thermal fuse can quickly operate when the overcurrent protector is extraordinarily overheated and be easily formed by employing an automatic soldering machine and the like.

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Shizuoka, Japan

Hisafumi Maruo