Kabushiki Kaisha Toyota Chuo Kenkyusho

Denso Corporation

Toyota Jidosha Kabushiki Kaisha

Aisin Seiki Kabushiki Kaisha

Applied Nanoparticle Laboratory Corporation

Hisaaki Takao

Yasuyoshi Saito

Kazumasa Takatori

Tatsuhiko Nonoyama

Takahiko Homma

Hirofumi Ito

Hideo Hasegawa

Motoki Hiraoka

Hideo Nakai

Toshiatsu Nagaya

Masaya Nakamura

Tadashi Oshima

Toshihiko Tani

Yoshinori Shibata

Hideo Nakamura

Keisuke Uchida

Wataru Yagi

Keiu Kanada

Akikazu Matsumoto

Teruo Komatsu

Hideki Teshima

Masashi Furukawa

Yoshitomo Kawanishi

Goro Watanabe

Shinichi Towata

Shinya Urata

Tsukasa Sugie

Shuhei Yamaguchi

Yuji Kaneko

Yukio Takada

Daichi Maruyama

Toshitaka Ishizaki

Takefumi Isogai

Yasuhiro Ishii

Mitsuhiro Kanou

Shuxin Dong

Tsunaji Kitayama

Atsuto Okamoto

Hirofumi Koike

Naotoshi Tominaga

Yasumoto Sato

Yoshiharu Hirose

Hiroaki Kadoura

Juntaro Seki

Narutaka Kasuya

Ryosuke Gomi

A jointed body that has been solid-phase jointed at normal temperature and that has a non-conventional structure is presented. The jointed body is formed by solid-phase joining a first jointed member to a second jointed member, and has a junction interface between the first member and the second member. This jointed body includes an average crystal grain size in a near interface structure that constitutes a near interface area having a total width of 20 micrometers and extending at both sides of the junction interface as a center is 75-100% of an average crystal grain size in an around interface structure that constitutes around interface areas located at both outer sides of the near interface area. In the jointed body, the near interface structure after the joining is almost the same as the structure before the joining, allowing the jointed body to exert similar characteristics to the jointed members.

Jointed body, method for manufacturing same and jointed member

A rare earth magnet production method of the present invention includes a placing step of placing a magnet material including a compact or a sintered body of powder particles having a rare earth magnet alloy, and a diffusing material containing a diffusing element to improve coercivity, in a vicinity of each other; and a diffusing step of diffusing the diffusing element into an inside of the magnet material by exposing the magnet material heated to vapor of the diffusing element evaporated from the diffusing material heated; and wherein the diffusing step is a step of heating the diffusing material independently of the magnet material to diffusing material temperature which is different from heating temperature of the magnet material called magnet material temperature.

Rare earth magnet and method for producing the same

A jointed structure comprises a first metal layer and a second metal layer. The first metal layer and the second metal layer are jointed together and have different coefficients of thermal expansion. The first metal layer and the second metal layer are jointed together by solid-phase joining via a jointing interface microstructure, wherein the jointing interface microstructure includes an amorphous oxide phase and having a thickness of 50 nm or less.

Jointed structure and method of manufacturing same

Exemplary embodiments provide a resistance welding method capable of stabilizing quality or improving efficiency of resistance welding such as spot welding. This resistance welding method comprises a calculating step of calculating resistance ratio X of a second electric resistance value Rof workpieces to be joined in residual heat after Joule heating stops to a first electric resistance value Rof the workpieces immediately before the Joule heating stops or vice versa (R/Ror R/R); a determining step of determining whether the resistance ratio X is equal to or greater than a threshold value Xn, and a reheating step of carrying out the Joule heating again when the resistance ratio X is smaller than the threshold value Xn. Thereby at least part of a welding portion is melted and solidified to reliably form a nugget, and a stably resistance-welded member can be provided.

Resistance welding method, resistance welder, and method and device for evaluating resistance welding

Provided is a composite nanometal paste which, when a layer of the paste interposed between upper and lower bodies is sintered in an inert gas under no load until the layer turns to a metal layer, attains a shear bond strength between the upper and lower bodies of 10 MPa or higher. The composite nanometal paste contains, as metallic components, composite metallic nanoparticles comprising metal cores with an average particle diameter of X (nm) and an organic coating layer formed around the circumference, metallic nanofiller particles having an average particle diameter of d (nm), and metallic filler particles having an average particle diameter of D (nm), and satisfies the first relation X&#x3c;d&#x3c;D and the second relation X&#x3c;d&#x3c;100 (nm). Furthermore, this is a composite nanometal paste in which said average particle diameter d has a size such that said metal nanofiller particle can be embedded into a three pocket formed when said three said metal filler particles are placed on a plane so as to be mutually in contact, and said average particle diameter X has a size such that the gaps that remain within said three pocket are filled.

Three-metallic-component type composite nanometallic paste, method of bonding, and electronic component

A method for evaluating a solder joint portion by means of which a part and a substrate are joined to each other includes a preparation process for preparing the substrate including the solder joint portion, a thermal shock process for applying thermal shock to the solder joint portion multiple times, and an evaluation process for obtaining a change of a crystal grain size in the solder joint portion caused by the application of the thermal shock so as to evaluate a lifespan of the solder joint portion based on the change of the crystal grain size obtained.

Method for evaluating solder joint portion

Grain oriented ceramics constituted of a polycrystalline body having a first perovskite-type alkali-pentavalent metal oxide compound as the main phase, in which a specific crystal plane of each grain constituting the polycrystalline body is oriented. The grain oriented ceramics are obtained by molding a mixture of a first anisotropically-shaped powder A of which developed plane has a lattice matching with a specific crystal plane of the first perovskite-type alkali-pentavalent metal oxide compound and a first reaction material capable of reacting with the first anisotropically-shaped powder A thereby forming at least the first perovskite-type alkali-pentavalent metal oxide compound such that the first anisotropically-shaped powder A is oriented, and by heating them.

Anisotropically-shaped powder of an alkali metal oxide compound

To provide a production method of a polycrystalline ceramic body with excellent density, a preparation step, a mixing step, a forming step and a heat-treating step are performed. In the preparation step, a coarse particle ceramic powder, and a fine particle powder having an average particle diameter of &#x2153; or less of the average particle diameter of the coarse particle ceramic powder are prepared. In the mixing step, the coarse particle ceramic powder and the fine particle powder are mixed to produce a raw material mixture. In the forming step, the raw material mixture is formed to a shaped body. In the heat-treating step, the shaped body is heated and thereby sintered to produce a polycrystalline ceramic body. In the heat-treating step, a temperature elevating process and a first holding process are performed and at the same time, a second holding process and/or a cooling process are performed. In the temperature elevating process, heating is started to elevate the temperature and in the first holding process, the shaped body is held at a temperature T&#xb0; C. In the second holding process, the shaped body is held at a temperature T&#xb0; C. lower than the temperature T&#xb0; C. In the cooling process, the shaped body is cooled at a temperature dropping rate of 60&#xb0; C./h or less from the temperature T&#xb0; C.

Production method of polycrystalline ceramic body

A piezoelectric actuatorincludes a piezoelectric element, which has a pair of electrodes formed on the surface of a piezoelectric ceramic member, as a drive source. The piezoelectric actuatorsatisfies at least one of the following requirements (a) to (c):

Piezoelectric actuator

The piezoelectric actuator includes a piezoelectric element () including a sheet of piezoelectric ceramic and electrodes formed at least part of the surface of the sheet of piezoelectric ceramic, and a holding member () holding the piezoelectric element ();

This invention provides a piezoelectric ceramic composition that does not contain lead, can be sintered at a normal pressure and is excellent in at least one of a piezoelectric constant, an electro-mechanical coupling coefficient, a dielectric loss, a relative dielectric constant and a Curie point, its production method, and a piezoelectric device and a dielectric device each utilizing the piezoelectric ceramic composition. The invention relates to a piezoelectric composition expressed by the general formula {Li(KNa)}(NbSb)O, each of x, y and z respectively falling within composition ranges of 0&#x2266;x&#x2266;0.2, 0&#x2266;y&#x2266;1.0 and 0&#x2266;z&#x2266;0.2 (with the exception of x=z=0), and its production method. The invention further relates to a piezoelectric device having a piezoelectric body formed of the piezoelectric ceramic composition described above and a dielectric device having a dielectric body formed of the piezoelectric ceramic composition described above.

Piezoelectric ceramic composition, its production method, and piezoelectric device and dielectric device

This invention provides a piezoelectric ceramic composition that does not contain lead, can be sintered at a normal pressure and has a high electro-mechanical coupling coefficient and a small dielectric loss, its production method, and a piezoelectric device utilizing the piezoelectric ceramic composition. The invention relates to a piezoelectric composition containing a compound expressed by the general formula {Li(KNa)}(NbTa)O, each of x, y and z respectively falling within composition range of 0&#x2266;x&#x2266;0.2, 0&#x2266;y&#x2266;1.0 and 0&#x2266;z&#x2266;0.4, as its main component, and further containing nickel or a nickel-containing compound. To provide a piezoelectric device that does not contain lead, can be sintered at a normal pressure and has a high electro-mechanical coupling coefficient Kp and a small dielectric loss, the piezoelectric ceramic composition of the invention is expressed by the general formula {Li(KNa)}(NbTa(MnW)O, each of x, y, z and n respectively falling within a composition range of 0&#x2266;x&#x2266;0.2, 0&#x2266;y&#x2266;1.0, 0&#x2266;z&#x2266;0.4 and 0&#x3c;n&#x2266;0.1.

Piezoelectric ceramic composition, its production method and piezoelectric device

A piezoelectric ceramic composition not containing lead, able to be sintered at ordinary pressure, and superior to the past in at least one of the properties unique to piezoelectric ceramic compositions such as the piezoelectric dconstant, that is, a piezoelectric ceramic composition having a compound of a general formula {Li(KNa)}(NbTaSb)Owhere x, y, z, and w are in the ranges of 0&#x2266;x&#x2266;0.2, 0&#x2266;y&#x2266;1, 0&#x3c;z&#x2266;0.4, and 0&#x3c;w&#x2266;0.2 as a main ingredient, where the piezoelectric ceramic composition contains at least one metal element selected from (1) palladium, silver, gold, ruthenium, rhodium, rhenium, osmium, iridium, and platinum, (2) nickel, iron, manganese, copper, and zinc, or (3) magnesium, calcium, strontium, and barium as an added element, and a method of production of the same and a piezoelectric element and dielectric element utilizing that piezoelectric ceramic composition.

Piezoelectric ceramic composition and method of production of same, piezoelectric element, and dielectric element

Grain oriented ceramics

A lead-free solder alloy comprises 0.8 to 5.0% inclusive by weight of Ag, not less than 0.1% by weight of In, not less than 0.1% by weight of Bi, the total amount of In and Bi being not more than 17% by weight and the balance of Sn and inevitable impurities. The other lead-free solder alloy further contains 0.1 to 10% by weight of Sb. These solder alloys have low melting point and narrow melting range, and furthermore, they show excellent wettability and mechanical characteristics.

Lead-free solder alloy

Growing community of inventors

Seto, Japan

Hisaaki Takao