Advanced Chip Engineering Technology, Inc.

His-Ying Yuan

Wen-Kun Yang

Chin-Chen Yang

Wen-Bin Sun

Jui-Hsien Chang

Chun-Hui Yu

Chao-Nan Chou

Kuang-Chi Chao

Cheng-hsien Chiu

Chun Hui Yu

Wen-Ping Yang

An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.

Image sensor with a protection layer

A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.

Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP

A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination.

FBGA and COB package structure for image sensor

Growing community of inventors

Taoyuan, Taiwan

His-Ying Yuan