Mitsubishi Denki Kabushiki Kaisha

Toshiba Mitsubishi-electric Industrial Systems Corporation

Hirozoh Kanegae

Masaki Kuzumoto

Shigenori Yagi

Koji Ohta

Yujiro Okihara

Youichiro Tabata

Noboru Wada

Akaru Usui

Yuji Ganryu

Hiromichi Komiya

Hiromi Ito

Kunito Sakai

Kazuharu Oshio

Hirofumi Fujioka

Hiroshi Adachi

Etsushi Adachi

Yoshifumi Itabashi

Hiroshi Mochizuki

Takumi Kikuchi

Fumio Nogami

Shigeru Harada

Ichiro Takahashi

Kimio Hagi

Kazuhito Matsukawa

Masanori Obata

Takemi Endoh

Akira Ohhisa

An ozonizer has a flat plate-shaped low voltage electrodea flat plate-shaped high voltage electrodefacing a main surface of the low voltage electrodeThe ozonizer also has a flat plate-shaped dielectricand a spacer for forming a discharge gapof a thin thickness in a laminating direction provided between the low voltage electrodeand the electrodean electrode cooling sheetprovided facing a main surface of the electrodeat a side opposite the discharge gapfor cooling the electrodeThe ozonizer also has a thermal conducting/electric insulating sheetsandwiched between the electrodeand the electrode cooling sheetAn alternating voltage is applied between the low voltage electrodeand the electrodeand a discharge is produced in the discharge gapinjected with oxygen gas to produce ozone gas.

Ozonizer

An ozonizer has a flat plate-shaped low voltage electrode, flat plate-shaped first and second high voltage electrodes facing the low voltage electrode, a first dielectric, and a first spacer, located between the low voltage electrode and the first high voltage electrode, a second dielectric, and a second spacer between the electrode and the second high voltage electrode. The ozonizer also has a first electrode cooling sheet facing the first high voltage electrode at a side opposite a first discharge gap, a second electrode cooling sheet facing the second high voltage electrode, a first thermally conducting and electrically insulating sheet sandwiched between the first high voltage electrode and the first electrode cooling sheet, and a second thermally conducting and electrically insulating sheet sandwiched between the second high voltage electrode and the second electrode cooling sheet.

An ozonizer has a flat plate-shaped low voltage electrode and a flat plate-shaped high voltage electrode facing a main surface of the low voltage electrode. The ozomzer also has a flat plate-shaped dielectric and a spacer forming a discharge gap in a laminating direction, located between the low voltage electrode and the high voltage electrode, a high voltage electrode cooling unit forming a cooling water passage insulated from the high voltage electrode inside the high voltage electrode. An alternating voltage is applied between the low voltage electrode and the high voltage electrode and a discharge is produced in the discharge gap, into which oxygen is injected, to produce ozone gas.

The ozonizer of this present invention is small in size, and capable of generating highly concentrated ozone with a high (generating) efficiency. A low voltage electrode includes a disc-shaped low voltage electrode main body facing a high voltage electrode and an extension at one side of the low voltage electrode main body, and the extensions are laminated in layers on a base via blocks, and a coolant inlet portion for supplying coolant to a coolant passage, a coolant outlet portion for exhausting coolant from the coolant passage, and an ozone gas outlet portion for exhausting ozone gas from the ozone gas passage pass through the extensions and the blocks, respectively, in a laminating direction of the discharge cells.

An ozonizer has a flat plate-shaped low voltage electrode, a flat plate-shaped high voltage electrodefacing a main surface of the low voltage electrode. The ozonizer also has a flat plate-shaped dielectricand a spacer for forming a discharge gapof a thin thickness in a laminating direction provided between the low voltage electrodeand the electrode, an electrode cooling sheetprovided facing a main surface of the electrodeat a side opposite the discharge gapfor cooling the electrode. The ozonizer also has a thermal conducting/electric insulating sheetsandwiched between the electrodeand the electrode cooling sheet. An alternating voltage is applied between the low voltage electrodeand the electrodeand a discharge is produced in the discharge gapinjected with oxygen gas to produce ozone gas.

Epoxy resin composition for molding comprising epoxy resin (A), acid anhydride (B), curing accelerator (C), coupling agent (D) and filler (E), process for preparing molded product used for apparatus for high voltage made of the epoxy resin composition for molding and molded product produced by the process for preparing the molded product. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and high toughness and excellent thermal resistance, the process for preparing the molded product can provide molded product made of the epoxy resin composition, and the produced molded product has excellent crack resistance and high reliability.

Epoxy resin composition for molding having improved mechanical

'Molded products for high voltage apparatus comprising an' epoxy resin composition for molding comprising an epoxy resin (A), an acid anhydride (B), a curing accelerator (C), at least one coupling agent (D) and a filler (E). The epoxy resin (A) is a bifunctional brominated bisphenol A or a brominated bisphenol F, 'epoxy resin and at least one bisphenol A, bisphenol F or bisphenol epoxy resin'. The coupling agent (D) is selected from the group consisting of epoxysilane type coupling agents, phenylaminosilane type coupling agents, mercaptosilane type coupling agents and titanate type coupling agents, which has an average particle diameter of not more than 60 .mu.m and in which the content of particles having a diameter of not more than 5 .mu.m is not less than 5% by weight. The filler (E) comprises at least one of silica fillers or alumina fillers. The ratio of the number of acid anhydride groups of the acid anhydride (B) to the number of epoxy groups of the epoxy resin (A) is 0.5 to 1.5; the amount of the curing accelerator (C) is 0.5 to 10 parts by weight based on 100 parts by weight of the epoxy resin (A); the amount of the coupling agent (D) is 0.05 to 5 parts by weight based on 100 parts by weight of the filler (E); and the content of the filler (E) is 35 to 95% by weight of the resin composition. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and toughness, and excellent thermal resistance.

Molded products for high voltage apparatus comprising brominated epoxy

A molding machine comprises a mold composed of lower and upper mold sections. A recess is defined in the lower mold section to receive a lead frame or other objects. The lead frame is sandwiched between the upper and lower mold sections. A mold cavity is defined in the lower mold section below the recess so as to receive a thermosetting resin or encapsulant. A gasket groove is defined adjacent to the mold cavity to receive a gasket. The gasket is subject to plastic deformation upon application of force. An oil chamber is communicated with the gasket groove and contains hydraulic oil. The hydraulic oil is pressurized to urge the gasket against the lead frame. As a result, the gasket is so deformed as to closely contact the surface of the lead frame and seal the mold cavity. The hydraulic oil is preferably mixed with thermoplastic resin in powder form.

Encapsulation method

A molding apparatus having an upper mold, a lower mold, and a cylindrical mold cavity defined between the upper mold and the lower mold and adapted to receive a molding material such as epoxy resin. An annular recess is defined in the lower mold adjacent to the mold cavity. A gasket is fit in the recess and made of lead. An oil passage is defined in the lower mold. Silicon oil as a pressure medium is fed to the recess through the oil passage so as to press the gasket against the upper mold. Then, the gasket is deformed to form a seal around a portion of the mold cavity where the upper and lower molds mate with one another. An annular spacer is placed in the bottom of the recess. An annular groove is defined below and along the bottom of the recess so as to allow the silicon oil to flow below and along the annular spacer, whereby sufficient pressure is exerted uniformly on the gasket to cause deformation of the gasket.

Molding apparatus and method in which a mold cavity gasket is deformed

A molding machine includes a mold composed of lower and upper mold sections. A recess is defined in the lower mold section to receive a lead frame or other objects. The lead frame is sandwiched between the upper and lower mold sections. A mold cavity is defined in the lower mold section below the recess so as to receive a thermosetting resin or encapsulant. A gasket groove is defined adjacent to the mold cavity to receive a gasket. The gasket is subject to plastic deformation upon application of force. An oil chamber is communicated with the gasket groove and contains hydraulic oil. The hydraulic oil is pressurized to urge the gasket against the lead frame. As a result, the gasket is so deformed as to closely contact the surface of the lead frame and seal the mold cavity. The hydraulic oil is preferably mixed with thermoplastic resin in powder form.

Molding machine and method

The present invention is mainly characterized by providing an even surface of an interlayer insulating film for insulating and isolating an upper interconnection and a lower interconnection from each other. A lower interconnection layer is provided on a semiconductor substrate, having a pattern of stepped portions. A silicon type insulating film is provided on the semiconductor substrate so as to cover the lower interconnection layer. A silicon ladder resin film is filled in recessed portions of the surface of the silicon type insulating film for making even the surface of the silicon type insulating film. An upper interconnection layer electrically connected to the lower interconnection layer through a via hole is provided on the silicon type insulating film. The silicon ladder resin film has the structural formula: ##STR1## where R.sub.1 is at least one of a phenyl group and a lower alkyl group, R.sub.2 is at least one of a hydrogen atom and a lower alkyl group, and n is an integer of 20 to 1000.

Semiconductor device and manufacturing method thereof

The disclosed is a method of manufacturing a semiconductor device sealed with molding resin. An aluminum interconnection including an aluminum electrode pad is formed on a semiconductor substrate having an element. A silicone ladder polymer expressed by the following general formula is formed on the semiconductor substrate to cover the element. The silicone ladder polymer film is selectively etched by an aromatic organic solvent to expose the surface of the aluminum electrode pad. The temperature of the silicone ladder polymer film is elevated at a temperature elevating rate of 20.degree. C./min or more, and then, the silicone ladder polymer film is cooled at a cooling rate of 20.degree. C./min or more to form a cured stress buffering protective film for buffering a stress applied to the element. ##STR1## (in the formula, n is an integer which makes the weight-average molecular weight be in the range of 100,000 to 200,000.)

Method of manufacturing a semiconductor device sealed with molding resin

Disclosed herein is an epoxy resin composition for sealing a semiconductor, which contains a flexibilizer, epoxy resin, a hardener, a hardening accelerator, a filler, a mold releasing agent, a colorant and a finishing agent. The flexibilizer is prepared from silicone containing hydroxyphenyl groups on ends of and/or in its molecules, which is formed of a copolymer of denatured silicone oil A having hydroxyphenyl groups, denatured silicone oil B having epoxy groups and/or bifunctional epoxy resin having epoxy groups on both ends. In addition to heat resistance, moisture resistance, a low elastic modulus, a low thermal expansion coefficient and a high glass-transition temperature, the epoxy resin composition according to the present invention has toughness which is higher than that of a conventional one, due to fine dispersion of silicone.

Growing community of inventors

Tokyo, Japan

Hirozoh Kanegae