Mitsubishi Denki Kabushiki Kaisha

Hiroyukio Nakajima

Seiji Oka

Fumiyuki Miyamoto

Makoto Doi

Mitsuhiro Nonogaki

A resin having a low dielectric constant obtained by heat-curing 100 parts by weight of a butadiene polymer containing in its polymer chain at least 50 mol% of a 1,2-butadiene unit having a double bond in its side chain and from 10 to 100 parts by weight of a vinyl compound having at least 3 vinyl groups in one molecule in the presence of an organic peroxide. Also disclosed is a resin having flame resistance obtained by heat-curing a blend of an organic peroxide with a composition comprising 100 parts by weight of a butadiene polymer containing in its polymer chain at least 50 mol% of a 1,2-butadiene unit having a double bond in its side chain, from 10 to 100 parts by weight of a vinyl compound having at least 3 vinyl groups in one molecule and at least one member selected from the compounds of the formulas I-IV: ##STR1## wherein X is H or CH.sub.3, Y is Br or Cl, A is --, --o--, --CO--, SO.sub.2, --CH.dbd.CH--, --C(CH.sub.3).sub.2 --or --(CH.sub.2 .sub.a --, ad each of m, n and a is an integer of from 1 to 4, in an amount of from 25 to 100 parts by weight in the case of the formulas I to III and from 25 to 200 parts by weight in the case of the formula IV.

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Amagasaki, Japan

Hiroyukio Nakajima