Daikin Industries, Ltd.

National Institute of Advanced Industrial Science and Technology

Sumitomo Electric Industries, Limited

Hiroyuki Yoshimoto

Taku Yamanaka

Yasuhiko Sawada

Shunji Kasai

Makoto Ono

Yoshinori Nanba

Takahiro Taira

Dai Fukami

Shinichi Yano

Shuji Tagashira

Tetsuo Shimizu

Taketo Kato

Yuki Ueda

Michio Asano

Junpei Terada

Masaji Komori

Masahiro Horibe

Hirokazu Komori

Tomohiro Ikeda

Yuto Kato

Masayuki Tsuji

Katsutoshi Yamamoto

Masamichi Sukegawa

Haruhisa Masuda

Yoshihisa Yamamoto

Kazuya Kawahara

Takanobu Suzuki

Kazuo Ishiwari

Hirokazu Yukawa

Hideto Nakagawa

Susumu Ihara

Kohei Yasuda

Ryo Sakamaki

Katsumi Mizuuchi

Yoshinori Hori

Toshinori Kadowaki

Kyohiro Kang

Kyouhei Murayama

Hideo Nishiumi

A dielectric waveguide including: a center dielectric A; a dielectric layer Asurrounding the center dielectric A; and a dielectric layer Asurrounding the dielectric layer A, the center dielectric Aincluding polytetrafluoroethylene, the center dielectric A, the dielectric layer A, and the dielectric layer Ahaving relative permittivities at 25° C. and 6 GHz represented by ε, ε, and ε, respectively, ε, ε, and εsatisfying the following: εis 2.20 or lower; εis 1.90 or lower; εis 1.55 or lower; and ε>ε>εis satisfied.

Dielectric waveguide line

A laminate, including a fluororesin sheet; and a base material. The fluororesin sheet including a fluororesin composition containing: a melt moldable fluororesin; and a silica. The fluororesin is a tetrafluoroethylene-perfluoro(alkyl vinyl ether) copolymer and/or a tetrafluoroethylene-hexafluoropropylene copolymer having 25 or more carbonyl group-containing functional groups per 10main-chain carbon atoms; the silica is a spherical silica; a blending ratio of the spherical silica to a total amount of the fluororesin and the silica is 50% by mass or higher and 70% by mass or lower; the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower and a melt flow rate (MFR) of 1.0 g/10 min or higher and 30 g/10 min or lower. Also disclosed is a substrate for circuits including the fluororesin sheet used as a part in a multilayer structure.

Fluororesin composition, fluororesin sheet, laminate and substrate for circuits

A wiring board including a dielectric line containing a resin (A), and a dielectric exterior covering the dielectric line and containing a resin (B). The dielectric exterior has a relative permittivity lower than a relative permittivity of the dielectric line at 6 GHz and 25° C.

Wiring board

A fluororesin composition containing a melt moldable fluororesin and a silica, wherein the fluororesin has 25 or more carbonyl group-containing functional groups per 10main-chain carbon atoms; the silica is a spherical silica; and the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower. Also disclosed is a fluororesin sheet including the fluororesin composition, a laminate including a copper foil layer and a layer including the fluororesin composition and a substrate for circuits including a copper foil layer and a layer including the fluororesin composition.

The present invention aims to provide a paste containing polytetrafluoroethylene which can be formed into a molded polytetrafluoroethylene article having a significantly small thickness of polytetrafluoroethylene and is less likely to cause defects in molding; and a method of producing the paste. The present invention provides a method of producing a paste, including the steps of coagulating primary particles of polytetrafluoroethylene in an aqueous dispersion that contains the primary particles and water to form slurry that contains secondary particles of polytetrafluoroethylene and water or secondary particles of polytetrafluoroethylene floating in water; and adding an organic solvent to at least one of the slurry and the secondary particles of polytetrafluoroethylene floating in water to provide the paste.

Paste containing polytetrafluoroethylene and method for producing same

The invention provides a connector-attached dielectric waveguide that allows the dielectric waveguide to be easily connectable with an opposite component and is capable of forming a connection structure exhibiting low transmission and return losses of a high frequency signal. The connector-attached dielectric waveguide includes a dielectric waveguide and a connector. The dielectric waveguide includes a dielectric waveguide body and a dielectric waveguide end. The dielectric waveguide end has a smaller cross-sectional area than the dielectric waveguide body.

Connector-attached dielectric waveguide including a connecting portion and a fixing portion that are slidably axially movable with respect to each other

The invention provides a dielectric waveguide for transmitting millimeter waves or sub-millimeter waves. The dielectric waveguide is easily processed and connected even when having a small diameter, and can provide a connection structure exhibiting low transmission and return losses of high frequency signals. The dielectric waveguide includes a dielectric waveguide body and a dielectric waveguide end having a lower permittivity than the dielectric waveguide body. The dielectric waveguide body and the dielectric waveguide end are seamlessly and monolithically formed from the same material.

Dielectric waveguide having a dielectric waveguide body and a dielectric waveguide end with specified densities and method of producing

The present invention provides a dielectric waveguide having excellent transmission efficiency. The dielectric waveguide includes a polytetrafluoroethylene molded article that has a permittivity of 2.05 or higher at 2.45 GHz or 12 GHz, a loss tangent of 1.20&#xd7;10or lower at 2.45 GHz or 12 GHz, and a hardness of 95 or higher.

Dielectric waveguide line comprising a polytetrafluoroethylene molded article and method of manufacture

The present invention provides a modified polytetrafluoroethylene fine powder which can be processed into molded articles high in thermal stability, chemical resistance and transparency and for which the extrusion pressure can be lowered. The present invention is a modified polytetrafluoroethylene fine powder, wherein the cylinder extrusion pressure at a reduction ratio of 1600 is not higher than 50 MPa and the haze value of molded article a for measurement formed therefrom is not higher than 60.

Modified polytetrafluoroethylene fine powder and modified polytetrafluoroethylene molded product

A metal-clad laminate, including metal foil, and a first resin layer arranged on the metal foil, the first resin layer including an epoxy resin and a fluoropolymer with a curable functional group. Also disclosed is a method of producing the metal-clad laminate.

Metal-clad laminate, method for producing same, and flexible printed board

The present invention provides a polytetrafluoroethylene powder having moldability/processability as well as electrical characteristics in microwave bands. The present invention is a modified polytetrafluoroethylene powder which has (1) a dielectric loss tangent at 12 GHz of not higher than 2.0&#xd7;10and (2) a cylinder extrusion pressure of not higher than 45 MPa at a reduction ratio of 1600.

Modified polytetrafluoroethylene powder and method for producing tetrafluoroethylene polymer

The invention provides a fluororesin composition capable of providing a molded article having low relative dielectric constant, excellent in a temperature stability and causing only small transmission losses. The invention is a fluororesin composition wherein a rate of change in relative dielectric constant between 25&#xb0; C. and 80&#xb0; C. of a molded article produced therefrom under a standard condition is not greater than 0.2%.

Fluororesin composition, fluororesin molded article and method for producing the same

The present invention provides a molded article comprising a polytetrafluoroethylene resin (A) and a thermoplastic resin (B) having a melting point of not lower than 100&#xb0; C. but lower than 322&#xb0; C., wherein the maximum peak temperature of the endothermic curve appearing on the crystal melting curve of the above polytetrafluoroethylene resin (A) as measured by a differential scanning calorimeter is higher by at least 3&#xb0; C. than the maximum peak temperature of the endothermic curve appearing on the crystal melting curve of the above polytetrafluoroethylene resin (A) after heating to a temperature of not lower than 340&#xb0; C. as measured by the differential scanning calorimeter.

Molded object process for producing the same product for high-frequency signal transmission and high-frequency transmission cable

It is an object of the present invention to provide a polytetrafluoroethylene-based-resin tube high in longitudinal tensile strength and a method of producing the same. The present invention provides a polytetrafluoroethylene-based-resin tube characterized in that the tensile strength thereof in the longitudinal direction is not lower than 60 MPa.

Growing community of inventors

Settsu, Japan

Hiroyuki Yoshimoto