Olympus Optical Company, Ltd.

Symetrix Corporation

Hiroyuki Yoshimori

Larry D McMillan

Takashi Mihara

Carlos Alberto Paz De Araujo

Hitoshi Watanabe

Michael C Scott

Joseph D Cuchiaro

Shuzo Hiraide

John W Gregory

Tatsuo Imamura

Carlos P De Araujo

Hiroshi Nakano

Hiroyuki Watanabe

Tatsuo Nagasaki

Shinichi Imade

Masayoshi Omura

Shinichi Harada

Eishi Ikuta

Yoshio Fukuda

Akira Katoh

Kazuhisa Yanagisawa

Takeshi Ito

Hiroyuki Abe

Makoto Koike

A liquid precursor containing a metal is applied to a substrate, RTP baked, and annealed to form a layered superlattice material. Special polyoxyalkylated precursor solutions are designed to optimize polarizability of the corresponding metal oxide materials by adding dopants including stoichiometric excess amounts of bismuth and tantalum. The RTP baking process is especially beneficial in optimizing the polarizability of the resultant metal oxide.

Process for fabricating layered superlattice materials and making

A liquid precursor containing a metal is applied to a substrate, RTP baked, and annealed to form a layered superlattice material. Prebaking the substrate and oxygen in the RTP and anneal is essential, except for high bismuth content precursors. Excess bismuth between 110% and 140% of stoichiometry and RTP temperature of 725.degree. C. is optimum. The film is formed in two layers, the first of which uses a stoichiometric precursor and the second of which uses an excess bismuth precursor. The electronic properties are so regularly dependent on process parameters and material composition, and such a wide variety of materials are possible, that electronic devices can be designed by selecting from a continuous record of the values of one or more electronic properties as a continuous function of the process parameters and material composition, and utilizing the selected process and material composition to make a device.

A method of fabricating a ferroelectric or layered superlattice DRAM compatible with conventional silicon CMOS technology. A MOSFET is formed on a silicon substrate. A thick layer of BPSG followed by a thin SOG layer overlies the MOSFET. A capacitor is formed by depositing a layer of platinum, annealing, depositing an intermediate layer comprising a ferroelectric or layer superlattice material, annealing, depositing a second layer of platinum, then patterning the capacitor. Another SOG layer is deposited, contact holes to the MOSFET and capacitor are partially opened, the SOG is annealed, the contact holes are completely opened, and a Pt/Ti/PtSi wiring layer is deposited.

Integrated circuit with layered superlattice material compound

A ferroelectric gate transistor has a structure in which n-type source and drain regions are formed on a p-type semiconductor, a ferroelectric thin film is formed on a channel region between the source and drain regions, and a gate electrode is formed thereon. Memory information is erased by applying a voltage V.sub.g to the ferroelectric to cause poling in the first direction. The memory information is written by applying a voltage V.sub.W lower than a coercive voltage of the ferroelectric and having a polarity opposite to that of the voltage V.sub.g to the ferroelectric. The memory information is read out by applying a voltage V.sub.DR lower than the voltage V.sub.W and having a polarity opposite to that of the voltage V.sub.g to the drain to read a drain current I.sub.DS.

Method of driving ferroelectric gate transistor memory cell

An oversize ferroelectric capacitor is located against the contact hole to the MOSFET source/drain in a DRAM. A barrier layer made of titanium nitride, titanium tungsten, tantalum, titanium, tungsten, molybdenum, chromium, indium tin oxide, tin dioxide, ruthenium oxide, silicon, silicide, or polycide lies between the ferroelectric layer and the source drain. The barrier layer may act as the bottom electrode of the ferroelectric capacitor, or a separate bottom electrode made of platinum may be used. In another embodiment in which the barrier layer forms the bottom electrode, an oxide layer less than 5 nm thick is located between the barrier layer and the ferroelectric layer and the barrier layer is made of silicon, silicide, or polycide. A thin silicide layer forms and ohmic contact between the barrier layer and the source/drain. The capacitor and the barrier layer are patterned in a single mask step. The ends of the capacitor are stepped or tapered. In another embodiment both the bottom and top electrode may be made of silicon, silicide, polycide or a conductive oxide, such as indium tin oxide, tin dioxide, or ruthenium oxide.

Ferroelectric integrated circuit

A ferroelectric memory includes a constant voltage source, a capacitor having first and second electrodes, and a transistor having a gate. A switch alternately connects the gate of the transistor to the first electrode and the constant voltage source. In another embodiment, there are two ferroelectric transistors, and the first electrode of each capacitor is connected both to the gate of the transistor and to a voltage source external of the memory.

Memory with ferroelectric capacitor connectable to transistor gate

A non-volatile integrated circuit memory in which the memory cell includes a first transistor gate overlying a first channel region, a ferroelectric material overlying a second channel region, and a second transistor gate overlying a third channel region. The channel regions are connected in series, and preferably are contiguous portions of a single semiconducting channel. The firm channel is connected to a plate voltage that is 20% to 50% of the coercive voltage of the ferroelectric material. A sense amplifier is connected to the third channel region via a bit line. The rise of the bit line after reading a logic '1' state of the cell is prevented from disturbing the ferroelectric material by shutting off the third channel before the sense amplifier rises.

Ferroelectric memory and non-volatile memory cell for same

An integrated circuit non-volatile, non-destructive read-out memory unit includes a ferroelectric capacitor having first and second electrodes, a capacitance Cf, and an area Af, and a transistor having a gate, a source and a drain forming a gate capacitor having an area Ag and a gate capacitance Cg, a gate overlap b, and a channel depth a, with the capacitor first electrode connected to the gate of the transistor. The ferroelectric material has a dielectric constant .epsilon.f and the gate insulator has a dielectric constant .epsilon.g. A source of a constant reference voltage is connectable to the first electrode. A bit line connects to the second electrode. In one embodiment the first electrode and gate are the same conductive member. In another embodiment the second electrode and the gate are the same conductive member and the first electrode is formed by extensions of the transistor source and drains underlying the gate, with the ferroelectric material between the source and drain extensions and the gate. The memory unit has the parametric relationships: Cf&lt;5.times.Cg, Af.ltoreq.2Ag, b.gtoreq.2a, and .epsilon.g.gtoreq..epsilon.f/8.

Ferroelectric non-volatile memory unit

A method and apparatus for programming ferroelectric memory cells which reduces polarizability fatigue effects of switching polarization of the ferroelectric devices associated with the memory cells such as ferroelectric capacitors and transistors. Alteration of the pulse width duty cycle associated with signals used to switch ferroelectric device polarization is shown to reduce polarizability fatigue of the ferroelectric material thereby increasing the useful life of ferroelectric memory cells. Methods and apparatus for producing a signal pulse duty cycle in the range 2-30% is disclosed and shown to improve the useful life of the ferroelectric material.

Method and apparatus for reduced fatigue in ferroelectric memory

A method and apparatus for programming ferroelectric memory cells which reduces fatigue effects of switching polarization of the ferroelectric devices associated with the memory cells such as ferroelectric capacitors and transistors. Alteration of the rise AC fall times associated with signals used to switch ferroelectric device polarization are shown to reduce fatigue of the ferroelectric material thereby increasing the useful life of ferroelectric memory cells. Slowing the rise and fall times as well as the rate of signal level rise and fall, (signal shape), are shown to reduce the fatigue effects of switching polarization of ferroelectric devices. Methods and apparatus for producing a triangular ('sawtooth') signal waveform, a Gaussian signal waveform, and a waveform having exponential rise and fall times are disclosed.

Method and apparatus for reduced fatigue in ferroelectric memory elements

A method of fabricating a ferroelectric or layered superlattice DRAM compatible with conventional silicon CMOS technology. A MOSFET is formed on a silicon substrate. A thick layer of BPSG followed by a thin SOG layer overlies the MOSFET. A capacitor is formed by depositing a layer of platinum, annealing, depositing an intermediate layer comprising a ferroelectric or layered superlattice material, annealing, depositing a second layer of platinum, then patterning the capacitor. Another SOG layer is deposited, contact holes to the MOSFET and capacitor are partially opened, the SOG is annealed, the contact holes are completely opened, and a Pt/Ti/PtSi wiring layer is deposited.

Integrated circuit with layered superlattice material and method of

Process for fabricating ferroelectric integrated circuit

A ferroelectric memory includes a ferroelectric thin film having first and second surfaces opposite to each other, a first electrode assembly having a plurality of stripe electrodes arranged in parallel on the first surface side of the ferroelectric thin film, a second electrode assembly having a plurality of stripe electrodes arranged in parallel on the second surface side of the ferroelectric thin film to intersect the stripe electrodes of said first electrode assembly, first and second common electrodes arranged separately from the end portions of the respective first and second electrode assemblies to extend in respective directions in which the stripe electrodes of the first and second electrode assemblies are arranged, and selecting sections for respectively connecting the first and second electrode assemblies to the first and second common electrodes and selectively activating at least one of the stripe electrodes of each of the first and second electrode assemblies.

Growing community of inventors

Kanagawa, Japan

Hiroyuki Yoshimori