Shin-etsu Chemical Co., Ltd.

National Institute of Advanced Industrial Science and Technology

Hitachi-high-technologies Corporation

Maruzen Petrochemical Company, Limited

Mitsubishi Electric Corporation

Sumitomo Bakelite Company Limited

N.e. Chemcat Corporation

Honda Motor Co., Ltd.

Hitachi-kokusai Electric Inc.

Jsr Corporation

Wako Pure Chemical Industries, Inc.

Advanced Industrial Science and Technology

Hiroyuki Yasuda

Michihiro Sugo

Hideto Kato

Shohei Tagami

Masahito Tanabe

Norihisa Fukaya

Takashi Naniki

Toshikazu Takahashi

Shouji Yamamoto

Kazunori Kondo

Toshiyasu Sakakura

Jun-chul Choi

Katsuya Takemura

Kazuhiko Sato

Masahiro Furuya

Yukio Takagi

Shinji Nagai

Tetsuya Nishida

Takuro Furukawa

Tatsuro Hino

Kanemi Sasaki

Tomoteru Mizusaki

Takeshi Haruna

Yasunori Hayashi

Katsuya Ito

Jun-Chul Choi

Junchul Choi

Shunya Onozawa

Jae-Hyun Kim

Akira Hashimoto

Hiroyuki Akita

Shinya Ito

Kenji Sato

Masayuki Ikeno

Hideyoshi Yanagisawa

Takanobu Takeda

Atsushi Sakaue

Hironori Tsuiki

Tae-hoon Kim

Yasushi Terui

Kazuya Hasegawa

Yoshihiro Ohta

Mitsuhiko Sakakibara

Yoichi Okubo

Takashi Kondo

Jung-sik Choi

Akira Fujii

Shunsuke Yamamoto

Kyoko Soga

Kohei Egashira

Yoshinori Nakajima

Akihito Mori

Takato Sakurai

Koji Moriya

Takeshi Miyao

Masahiro Kawazu

Tetsuya Yokogawa

Takahiro Kiyosu

Kazunori Muto

Shinji Yoshioka

Masahiro Yuya

Goro Sawada

Shun-ya Onozawa

Takeharu Toyoshima

Yoshiyuki Yamamori

Hironori Osuga

Jun-won Han

Kazuo Tomisawa

Kota Hirohashi

Takayoshi Iida

Natsumi Tamura

Satoko Tomita

Kazuyuki Nagahiro

Shinobu Sato

Tomoyuki Honda

Takashi Yagisawa

Masuo Yamazaki

Naoyuki Saruwatari

Seong-Jib Choi

Toshio Horikoshi

Tatsuki Kawashima

Yasumasa Takenaka

Kyosuke Yamaguchi

Hitomi Ezura

Kei Ichikawa

Tomomi Kitsugi

Qiao Zhang

Yasunori Negoro

Kaori Saitou

Masae Ueda

Shinya Koboyashi

Shun-Ya Onozawa

Hideo Kato

A coil alignment device includes: a plate-shaped first jig having a plurality of grooves arranged along a circumferential direction so as to extend toward a radial-direction outer side; and a second jig that can contact with a segment coil inserted in the first jig. Each groove includes a storage portion extending along a radial direction and having a first length so that leg portions of the segment coils can be stored side by side in the radial direction, and a guiding portion extending from the storage portion toward the radial-direction outer side, and has a first shape so that, using, as a fulcrum, one leg portion inserted in the storage portion, the other leg portion is movable toward the storage portion. The second jig is movable to press the segment coil from a radial-direction side and store the other leg portion into the storage portion.

Coil alignment device and coil alignment method

The disclosure provides a vehicle body rear part structure. The vehicle body rear part structure includes a load support part on a quarter pillar. The load support part includes a side sill stiffener, a quarter pillar stiffener and a damper stiffener. The side sill stiffener reinforces a side sill and forms a part of the quarter pillar. The quarter pillar stiffener is provided continuously with the side sill stiffener and reinforces the quarter pillar. The damper stiffener is provided above a rear wheel house and joined to the quarter pillar stiffener and a roof side rail.

Vehicle body rear part structure

Provided is a rotating electric machine capable of downsizing a coil end. The rotating electric machine includes an armature core and a plurality of coils. The plurality of coils each include a plurality of turn portions. The plurality of turn portions each include an inner-layer-side turn portion and an outer-layer-side turn portion. The inner-layer-side turn portion includes a first inner-layer-side bent portion, a first inner-layer-side oblique portion, and an inner-layer-side shift portion which is twisted. The outer-layer-side turn portion includes a first outer-layer-side bent portion, a first outer-layer-side oblique portion, and an outer-layer-side shift portion. The outer-layer-side shift portion has the inner-layer-side shift portion arranged between the outer-layer-side shift portion and the armature core.

Rotating electric machine and manufacturing method therefor

Perception of the relationship between a comfort level and environmental data is facilitated, and appropriate management of air-conditioning equipment is enabled. A comfort level display apparatus has a preference storage unit to store a preference of a user regarding an air-conditioned environment, an attribute storage unit to store an attribute of the user, an environmental data value acquisition unit to acquire an environmental data value representing a condition in an air-conditioned space, a comfort level value generation unit to generate a comfort level value indicating comfort of the user in the air-conditioned space, based on the preference of the user stored the preference storage unit, the attribute of the user stored in the attribute storage unit, and the environmental data value of the air-conditioned space acquired by the environmental data value acquisition unit, a display data generation unit to generate display data by synthesizing the comfort level value of the user generated by the comfort level value generation unit and the environmental data value of the air-conditioned space acquired by the environmental data value acquisition unit, and a display unit to display the display data.

Comfort level display apparatus that generates correlation information between user comfort levels and temperature changes

An organometallic complex catalyst that makes it possible to obtain a higher yield of a desired product than conventional catalysts in a cross-coupling reaction. The organometallic complex catalyst has a structure represented by formula (1) and is for use in a cross-coupling reaction. In formula (1), M is the coordination center and represents a metal atom such as Pd or an ion thereof. R1, R2, and R3 may be the same or different and are a substituent such as a hydrogen atom. R4, R5, R6, and R7 may be the same or different and are a substituent such as a hydrogen atom. X represents a halogen atom. R8 represents a substituent that has a &#x3c0; bond and 3-20 carbon atoms. With regard to the electron-donating properties of R1-R7 with respect to the coordination center M of the ligand containing R1-R7 that is indicated in formula (2), R1-R7 are arranged in combination such that the TEP value obtained from infrared spectroscopy shifts toward the low frequency side compared to the TEP value of the ligand of formula (2-1). 

Organometallic complex catalyst

An organometallic complex catalyst is disclosed for use in a cross-coupling reaction. In formula (1), M is the coordination center and represents a metal atom such as Pd or an ion thereof. R, R, and Rmay be the same or different and are a substituent such as a hydrogen atom. R, R, R, and Rmay be the same or different and are a substituent such as a hydrogen atom. X represents a halogen atom. Rrepresents a substituent that has a &#x3c0; bond and 3-20 carbon atoms. With regard to the electron-donating properties of R-Rwith respect to the coordination center M of the ligand containing R-Rthat is indicated in formula (2), R-Rare arranged in combination such that the TEP value obtained from infrared spectroscopy shifts toward the high frequency side compared to the TEP value of the ligand of formula (2-1). 

A method for producing a thin wafer includes: separating the support body from the laminate by irradiating a wafer laminate, which includes a support body, an adhesive layer formed on the support body, and a wafer laminated with a surface thereof including a circuit plane facing the adhesive layer, with light from a side of the support body of the wafer laminate; and after separating, removing a resin layer remaining on the wafer from the wafer by peeling, wherein the adhesive layer includes only a resin layer A with a light-blocking property, and a resin layer B including a thermosetting silicone resin or a non-silicone thermoplastic resin in this order from the side of the support body.

Method for producing thin wafer

A temporary adhesive film roll for substrate processing, includes: a roll axis and a composite film-shaped temporary-adhesive material for temporarily bonding a substrate to a support, the composite film-shaped temporary-adhesive material being rolled up around the roll axis; wherein the composite film-shaped temporary-adhesive material includes a first temporary adhesive layer composed of a thermoplastic resin, a second temporary adhesive layer composed of a thermosetting resin, and a third temporary adhesive layer composed of a thermosetting resin which is different from that of the second temporary adhesive layer. The temporary adhesive film roll for substrate processing is capable of giving a temporary adhesive material which facilitates temporary adhesion between a substrate and a support, rapidly forms a temporary adhesive material layer on a substrate or a support, has excellent resistance to a thermal process such as chemical vapor deposition, and is easily separated to improve the productivity of thin wafers.

Temporary adhesive film roll for substrate processing, method for manufacturing thin wafer

A method of production of carbamic acid ester has a high yield and high selectivity and is superior in economy. The method of production of a carbamic acid ester includes reacting an amine, carbon dioxide, and an alkoxysilane compound in the presence of a catalyst containing a zinc compound or an alkali metal compound or in the presence of an ionic liquid. A carbamic acid ester is produced, for example by reacting aniline, carbon dioxide, and tetramethoxysilane at a temperature of 150 to 180&#xb0; C. in the presence of zinc acetate and 2,2'-bipyridine.

Production method of carbamic acid ester

A resin composition includes: (a) a supported platinum catalyst having a structure shown by the following general formula (1) in which a platinum complex is supported on a surface of an inorganic oxide; and (b) a thermoplastic matrix resin. The resin composition is usable as an addition-reaction catalyst capable of imparting sufficient storability and quick curability to an addition-reaction curable composition. In the formula, L represents a ligand selected from carbon monoxide, an olefin compound, an amine compound, a phosphine compound, an N-heterocyclic carbene compound, a nitrile compound, and an isocyanide compound; and n represents the number of Ls and an integer from 0 to 2.

Resin composition containing supported platinum catalyst, thermosetting organopolysiloxane composition using the resin composition, and method for curing the thermosetting organopolysiloxane composition

Disclosed herein is a semiconductor device including: a support; a double-layered adhesive resin layer formed on the support, an insulating layer and a redistribution layer formed on the adhesive resin layer; a chip layer, and a mold resin layer, wherein the adhesive resin layer includes a resin layer A containing a resin decomposable by light irradiation and a resin layer B containing a non-silicone-based thermoplastic resin, the resin layer A and the resin layer B being provided in this order from the support side, the resin decomposable by light irradiation is a resin containing a fused ring in its main chain, and the non-silicone-based thermoplastic resin has a glass transition temperature of 200&#xb0; C. or higher.

Semiconductor device, method for producing the same, and laminate

Disclosed herein is a wafer laminate suitable for production of thin wafers and a method for producing the wafer laminate. The wafer laminate can be formed easily by bonding between the support and the wafer and it can be easily separated from each other. It promotes the productivity of thin wafers. The wafer laminate includes a support, an adhesive layer formed on the support, and a wafer which is laminated on the adhesive layer in such a way that that surface of the wafer which has the circuit surface faces toward the adhesive layer, wherein the adhesive layer is a cured product of an adhesive composition composed of resin A and resin B, the resin A having the light blocking effect and the resin B having the siloxane skeleton.

Wafer laminate, method for production thereof, and adhesive composition for wafer laminate

A manufacturing method for a stator winding coil includes: a bulging portion forming step that forms a bulging portion on a conductor wire; a crank portion forming step that forms a crank portion on the central portion of the bulging portion; an oblique portion forming step that forms oblique portions on the conductor wire at two ends of the bulging portion; a rectilinear portion forming step that forms rectilinear portions on the conductor wire at opposite ends of the oblique portions from the bulging portion; and a circular arc forming step that forms the oblique portions into a circular arc shape after forming the rectilinear portions.

Manufacturing method for stator winding coil

To provide a wafer laminate which permits easy bonding between a support and a wafer, permits easy delamination of a wafer from a support, enables enhanced productivity of a thin wafer, and is suited to production of a thin wafer, and for a method of producing the wafer laminate. The wafer laminate includes a support, an adhesive layer formed on the support, and a wafer laminated in such a manner that its front surface having a circuit surface faces the adhesive layer. The adhesive layer includes a light-shielding resin layer A and a non-silicone thermoplastic resin-coating resin layer B in this order from the support side. The resin layer A is composed of a resin that contains a repeating unit having a condensed ring, and the resin layer B has a storage elastic modulus E' at 25&#xb0; C. of 1 to 500 MPa and a tensile break strength of 5 to 50 MPa.

Wafer laminate and method of producing the same

A wafer laminate has an adhesive layer () sandwiched between a transparent substrate () and a water (), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer () includes a first cured resin layer () disposed adjacent the substrate and having light-shielding properties and a second cured resin layer () disposed adjacent the wafer and comprising a cured product of a thermosetting resin composition.

Wafer laminate and making method

Growing community of inventors

Annaka, Japan

Hiroyuki Yasuda