Panasonic Electric Works Co., Ltd.

Panasonic Corporation

Matsushita Electric Works, Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Yamaju Ceramics Co., Ltd.

Hiroyuki Yagyu

Shinji Hashimoto

Tooru Nakashiba

Tomoaki Matsushima

Takuya Matsumoto

Yutaka Kinugasa

Yuuki Kasai

Makoto Nishimura

Hideo Nakanishi

Motoo Ikari

Ryo Taniguchi

Nobuyuki Asahi

Nobuyuki Miyagawa

Tomoaki Nemoto

Tadahiro Yamaji

Yukio Matsushita

Kouhei Kotera

Yuji Takada

Hideaki Abe

Sadayuki Sumi

Tsutomu Niiho

Toshiyuki Suzuki

Yuichi Uchida

Masato Kawashima

Kyosuke Iribe

Wataru Tanaka

Shinichi Abe

Yoshihiro Matsumura

Nobuyuki Asashi

Makoto Nisimura

Hideki Ohashi

Kazuhiro Horiuchi

Coil units equipped with primary coils having the same specification are provided in a power feeding module. Coil-unit intermeshing recess sections are formed on a printed circuit board to match each of the coil units. Pads for joining together with electrodes formed on the coil units are formed on the bottom faces of each of the coil-unit intermeshing recess sections. A plurality of coil units can be mounted onto the printed circuit board easily, by fitting each of the coil units into each of the coil-unit intermeshing recess sections and joining them together, which will enable manufacturing efficiency to be improved.

Power supplying module for contactless power supplying device, method for using power supplying module of contactless power supplying device, and method for manufacturing power supplying module of contactless power supplying device

Disclosed is an optical module which improves optical coupling efficiency either when configured to receive an optical signal from an optical fiber with a light receiving element or when configured to receive an optical signal from a light emitting element with an optical fiber. The optical module includes: a substrate () having in the surface thereof a first groove () and a second groove () formed, with this second groove () being configured to have a substantially V-shaped cross section formed deeper than the first groove and being formed in continuation from the first groove; and an internal waveguide () provided within the first groove () of the substrate (). The optical further modules a mirror portion () for changing an optical path, provided at the front end of the first groove (); an optical element () mounted on the surface of the substrate () so as to face the mirror portion (), and configured to emit an optical signal to a core () of the internal waveguide () via the mirror portion (). Moreover, the optical module further includes an optical fiber () having a fiber cladding () placed within the second groove () and a fiber core () optically connected to the core () of the internal waveguide ().

Optical module

To provide a photoelectric converter capable of reducing the height of the device. The photoelectric converter includes: a light emitting element or a light receiving element; an IC circuit for transmitting/receiving an electric signal to/from the light emitting element or the light receiving element; a mount substrate adapted to be mounted on one surface from the side on which the light emitting element emits light, or the side on which the light receiving element receives light; an electric connector adapted to be provided on the one surface or the other surface of the mount substrate, and to be attached and detached to and from an external connector; and a waveguide adapted to be provided on the mount substrate along the one surface or the other surface of the mount substrate, and to be optically coupled to the light emitting element or the light receiving element.

Photoelectric converter providing a waveguide along the surface of the mount substrate

An optical module includes an emitter-side mounting substrate, a receiver-side mounting substrate and an external waveguide substrate. The mounting substrate is provided with a waveguide having a core and a pair of fitting recesses. The external waveguide substrate is provided with an external waveguide having a core, a pair of fitting tabs and a lap joint portion. As the fitting tabs are fitted into the respective fitting recesses, the mounting substrate) and the external waveguide substrate are joined together, the two cores are aligned with each other, and the lap joint portion is positioned to overlap the mounting substrate.

A material for an optical circuit-electrical circuit mixedly mounting substrate comprises a light permeable resin layer, and an optical circuit forming layer that is made of a light permeable resin of which refractive index increases (or decreases) when irradiated with an activating energy beam and is disposed adjacent to the light permeable resin layer, wherein a refractive index of a portion of the optical circuit forming layer is higher (or lower) than that of the light permeable resin layer when the material for the optical circuit-electrical circuit mixedly mounting substrate is irradiated with an activating energy beam so that said portion is irradiated.

Material for substrate mounting optical circuit-electrical circuit mixedly and substrate mounting optical circuit-electrical circuit mixedly

In a method for forming a photoelectric composite board () on which a photoelectric transducer () is mounted, photo-masks () which are used in processes to form the photoelectric composite board () are respectively disposed on the basis of a reference mark () previously formed on a metal thin film (). In addition, openings () are formed on solder resist layers () by irradiating laser beams at positions defined on the basis of a reference point () defined above a light deflector () formed on an end of a light guide ().

Method for forming photoelectric composite board

A process of forming a deflection mirror in a light waveguide with a use of a dicing blade having a cutting end with a flat top cutting face and at least one slanted side cutting face. The process includes a cutting step of cutting a surface of the light waveguide to a depth not greater than a width of the flat top cutting face, thereby forming a groove in the surface of the light waveguide. The groove has a slanted surface which is formed by the slanted cutting face to define the deflection mirror in the waveguide.

Process of forming a deflection mirror in a light waveguide

A material for an optical circuit-electrical circuit mixedly mounting substrate comprises a light permeable resin layer, and an optical circuit forming layer that is made of a light permeable resin of which refractive index increases (or decreases) when irradiated with an activating energy beam and is disposed adjacent to the light permeable resin layer,

Material for substrate mounting optical circuit-electric circuit mixedly and substrate mounting optical circuit-electric circuit mixedly

An infrared ray receiving element includes a substrate made of a pyroelectric material and having at least one cantilever portion surrounded by a slit, in which at least a part of the cantilever portion in the substrate is uniformly polarized in the same direction and the remainder in the substrate includes a portion polarized at random. At least a pair of electrodes are respectively provided on a top surface and a bottom surface of the cantilever portion.

Infrared ray receiving element and infrared ray sensor using the same

A pyroelectric-type IR receiving element comprises a pyroelectric substrate which is fixed to a supporting body at its support ends and at least one rectangular patch formed in the substrate. The patch is formed on its opposite surfaces with first and second electrodes which are overlapped to each other. The substrate has a U-shaped slit composed of a pair of side slits and a base slit connecting the side slits. The U-shaped slit surrounds continuously three sides of the patch, so that the patch is supported by the substrate in a cantilever fashion at a cantilever end which is opposed to one of the support ends of the substrate. Since a thermal stress applied to the substrate when the substrate is exposed to a temperature change is absorbed by the U-shaped slit, a stress concentration to be considered is not developed in the patch. As a result, it is possible to reduce the occurrence of popcorn noise, while maintaining good IR sensitivity.

Pyroelectric-type IR receiving element and IR sensor using the same

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Hirakata, Japan

Hiroyuki Yagyu