Ibiden Company Limited

Hiroyuki Watanabe

Kiyotaka Tsukada

Masahiro Kaneko

Yoshihiro Kodera

Tsutomu Iwai

Shinya Maeda

Kazunari Suzuki

Michio Ido

Morio Nakao

Takahiro Yamashita

A semiconductor mounting device including a first substrate having insulation layers, conductor layers formed on the insulation layers, and via conductors connecting the conductor layers, a second substrate having insulation layers and conductor layers formed on the insulation layers of the second substrate, first bumps connecting the first substrate and the second substrate and formed on an outermost conductor layer of the first substrate formed on an outermost insulation layer of the first substrate, and second bumps positioned to mount a semiconductor element to the second substrate and formed on an outermost conductor layer of the second substrate formed on an outermost insulation layer of the second substrate. The second substrate has a thickness which is greater than a thickness of the first substrate.

Semiconductor mounting device and method for manufacturing semiconductor mounting device

A semiconductor mounting device including a first substrate having first insulation layers, first conductor layers formed on the first insulation layers and via conductors connecting the first conductor layers, a second substrate having a core substrate, second conductor layers, through-hole conductors and buildup layers having second insulation layers and third conductor layers, first bumps connecting the first and second substrates and formed on the outermost first conductor layer on the outermost first insulation layer, and second bumps positioned to connect a semiconductor element and formed on the outermost third conductor layer on the outermost second insulation layer. The second substrate has greater thickness than the first substrate, the second conductor layers are formed on surfaces of the core substrate, respectively, the through-hole conductors are formed through the core substrate and connecting the second conductor layers, and the buildup layers are formed on the core substrate and second conductor layers, respectively.

Semiconductor mounting device having multiple substrates connected via bumps

A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.

Method for manufacturing printed wiring board

A composite layer composed of an Ni layerand a Pd layeris formed on a solder padU, and a solder&#x3b1; on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by means of thermal stress.

Printed wiring board and method for manufacturing printed wiring board

This invention provides a printed wiring board having an intensified drop impact resistance of a joint portion between pad and solder. An electrode pad comprises pad portion loaded with solder ball and a cylindrical portion projecting to the solder ball supporting the pad portion. An outer edge of the pad portion extends sideway from a cylindrical portion so that the outer edge is capable of bending. If the outer edge bends when stress is applied to the solder ball, stress on the outer edge of the pad portion on which stress is concentrated can be relaxed so as to intensify the joint strength between an electrode pad and solder ball.

Growing community of inventors

Ogaki, Japan

Hiroyuki Watanabe