Growing community of inventors

Tochigi, Japan

Hiroyuki Usui

Average Co-Inventor Count = 2.54

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 19

Hiroyuki UsuiKeisuke Aramaki (3 patents)Hiroyuki UsuiYoshihisa Shinya (2 patents)Hiroyuki UsuiYasumi Endo (2 patents)Hiroyuki UsuiShinji Sonda (1 patent)Hiroyuki UsuiMitsuharu Suzuki (1 patent)Hiroyuki UsuiYuuji Ishimura (1 patent)Hiroyuki UsuiShinntarou Suzuki (1 patent)Hiroyuki UsuiHiroyuki Usui (6 patents)Keisuke AramakiKeisuke Aramaki (31 patents)Yoshihisa ShinyaYoshihisa Shinya (51 patents)Yasumi EndoYasumi Endo (7 patents)Shinji SondaShinji Sonda (3 patents)Mitsuharu SuzukiMitsuharu Suzuki (3 patents)Yuuji IshimuraYuuji Ishimura (3 patents)Shinntarou SuzukiShinntarou Suzuki (1 patent)
..
Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Dexerials Corporation (5 from 682 patents)

2. Yazaki Corporation (1 from 8,204 patents)


6 patents:

1. 10737477 - Bonding device and method for producing plate-shaped bonded assembly

2. 9789674 - Bonding device and method for producing plate-shaped bonded assembly

3. 9365001 - Thermally conductive sheet and process for producing same

4. 9308695 - Thermally conductive sheet and process for producing same

5. 8808607 - Thermally conductive sheet and process for producing same

6. 7378592 - Protector

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as of
12/17/2025
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